Morphology and composition of MgO films grown on single-crystalline diamond (100) have been studied. MgO thin films were deposited in the substrate temperature range from room temperature (RT) to 723K by means of electron beam evaporation using MgO powder source. Atomic force microscopy images indicated that the film grown at RT without $O_2$ supply was relatively uniform and flat whereas that deposited in oxygen ambient yielded higher growth rates and rough surface morphologies. X-ray photoelectron spectroscopy analyses demonstrate that the MgO film deposited at RT without $O_2$ has the closest composition to the stoichiometric MgO, and that a thin contaminant layer composed mainly of magnesium peroxide (before etching) or hydroxide (after etching) was unintentionally formed on the film surface, respectively. These results will be discussed in relation to the interaction among the evaporated species and intentionally supplied oxygen molecules at the growth front as well as the interfacial energy between diamond and MgO.

We investigated dry etching of GaAs and AlGaAs in a high density planar inductively coupled plasma system with $BCl_3$ and $BCl_3/Ar$ gas chemistry. A detailed process study as a function of ICP source power, RIE chuck power and $BCl_3/Ar$ mixing ratio was performed. At this time, chamber pressure was fixed at 7.5 mTorr. The ICP source power and RIE chuck power were varied from 0 to 500 W and from 0 to 150 W, respectively. GaAs etch rate increased with the increase of ICP source power and RE chuck power. It was also found that etch rate of GaAs in $BCl_3$ gas with 25% Ar addition was superior to that of GaAs in a pure $BCl_3$ (20 sccm $BCl_3$) plasma. The result was same with AlGaAs. We expect that high ion-assisted effect in $BCl_3$/Ar plasma increased etch rates of both materials. The GaAs and AIGaAs features etched at 20 sccm $BCl_3$ and $15BCl_3/5Ar$ with 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr showed very smooth surfaces(RMS roughness < 2 nm) and excellent sidewall. XPS study on the surfaces of processed GaAs also proved extremely clean surfaces of the materials after dry etching.

Amorphous $Al_2O_3$ nanotubes have been fabricated by utilizing the ZnO nanowires as template with wet etching method. ZnO nanowires synthesized by thermal evaporation are conformally coated with $Al_2O_3$ by atomic-layer deposition(ALD) method. The $Al_2O_3$-coated ZnO nanowires are of core-shell structure; ZnO core nanowires and $Al_2O_3$ shells. When the $ZnO/Al_2O_3$ core-shell structure is dipped in $H_3PO_4$ solution at $25^{\circ}C$ for a 6 min, the core ZnO materials are completely etched, and only $Al_2O_3$ nanotubes are remained. This nanotube fabrication is technically easier than others, and simply approachable. Transmission electron microscopy shows that the $Al_2O_3$ nanotubes have various thicknesses that can be controlled.

Impurities transmuted in GaN thin film and GaN nanowires after neutron irradiation are studied in this work. The structural properties of GaN nanowires were shown using by Transmission Electron Microscope(TEM). Transmuted impurities that are expected to be doped into GaN thin film and GaN nanowires are then confirmed by photoluminescence(PL). Transmuted atom in GaN materials is Ge atom, Ge-related peaks in GaN thin film lead to emit at 2.9eV, 2.25eV. But emission bands at 2.9eV, 2.25eV are not shown in PL spectra of GaN nanowires. Our experimental results are expected to give deep impact on nano-material doping technology for the achievement of the fabrication of nano-devices.

Chemical mechanical polishing (CMP) is an essential dielectric planarization in multilayer microelectronic device fabrication. In the CMP process it is necessary to minimize the extent of surface defect formation while maintaining good planarity and optimal material removal rates. The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on W passivation layer, in order to obtain higher removal rate (RR) and very low non-uniformity (NU%) during W-CMP process. In this paper, we compared the effects of oxidizer or W-CMP process with three different kind of oxidizers with 5% hydrogen peroxide such as $Fe(NO_3)_3$, $H_2O_2$, and $KIO_3$. The difference in removal rate and roughness of W in stable and unstable slurries are believed to caused by modification in the mechanical behavior of $Al_3O_3$ particles in presence of surfactant stabilizing the slurry.

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

[ $HfO_xN_y$ ] films using a hafnium tertiary-butoxide $(Hf[OC(CH_3)_3]_4)$ in plasma and $N_2$ ambient were prepared to improve the thermal stability of hafnium-based gate dielectrics. A 10% nitrogen incorporation into $HfO_2$ films showed a smooth surface morphology and a crystallization temperature as high as $200^{\circ}C$ compared with pure $HfO_2$ films. The $TaN/HfO_xN_y/Si$ capacitors showed a stable capacitance-voltage characteristics even at post-metal annealing temperature of $1000^{\circ}C$ in $N_2$ ambient and a constant value of 1.6 nm EOT (equivalent oxide thickness) irrespective of an increase of PDA and PMA temperature. Leakage current densities of $HfO_xN_y$ capacitors annealed at PDA temperature of 800 and $900^{\circ}C$, respectively were approximately one order of magnitude lower than that of $HfO_2$ capacitors.

Silicon carbide (SiC) was etched in a $NF_3/CH_4$ inductively coupled plasma. The etch process was modeled by using a neural network called generalized regression neural network (GRNN). For modeling, the process was characterized by a $2^4$ full factorial experiment with one center point. To test model appropriateness, additional test data of 16 experiments were conducted. Particularly, the GRNN predictive capability was drastically improved by a genetic algorithm (GA). This was demonstrated by an improvement of more than 80% compared to a conventionally obtained model. Predicted model behaviors were highly consistent with actual measurements. From the optimized model, several plots were generated to examine etch rate variation under various plasma conditions. Unlike the typical behavior, the etch rate variation was quite different depending on the bias power Under lower bias powers, the source power effect was strongly dependent on induced dc bias. The etch rate was strongly correated to the do bias induced by the gas ratio. Particularly, the etch rate variation with the bias power at different gas ratio seemed to be limited by the etchant supply.

In this paper, the electrical characteristics of single oxide layer due to high temperature diffusion process, wafer resistivity and thickness of poly backseat was researched. The oxide quality was examined through capacitance-voltage characteristics, and besides, it will be describe the capacitance-voltage characteristics of the single oxide layer by semiconductor device simulation.

합성된 GaN, ZnO 나노선 네트워크를 이용하여 전류-전압 특성을 조사하고 정류성 특징을 가지는 나노선네트워크에 대해서는 다이오드의 이상지수를 측정하여 기존의 다이오드의 특성과 비교 분석하고 간단한 광 특성 측정을 하여 광전소자로서의 가능성도 확인해 보았다.

In this paper, electrical properties of photovoltaic module have been observed for 5 years and found to drop around 5 to 25 %. Element technologies which are critical to electrical loss were therefore examined and dark I-V curve were observed with different soldering conditions. From the results, series resistance decreased with the decrease of contact resistance regardless of temperature conditions.

We studied InP etch results in high density planar inductively coupled $BCl_3$ and $BCl_3$/Ar plasmas. The investigated process parameters were ICP source power, RIE chuck power, chamber pressure and $BCl_3$/Ar gas composition. It was found that increase of ICP source power and RIE chuck power raised etch rate of InP, while that of chamber pressure decreased etch rate. Etched InP surface was clean and smooth (RMS roughness < 2 nm) with a moderate etch rate ($300\;{\sim}\;500\;{\AA}/min$) after the planar $BCl_3/Ar$ ICP etching. It may make it possible to open a new regime of InP etching with $CH_4/H_2$ - free plasma chemistry. Some amount of Ar addition (< 50%) also improved etch rates of InP, while too much Ar addition reduced etch rates of InP.

In this paper, the programming characteristics of the multi-bit devices based on SONOS structure are investigated. Our devices have been fabricated by $0.35\;{\mu}m$ complementary metal-oxide-semiconductor (CMOS) process with LOCOS isolation. In order to achieve the two-bits per cell operation, charges must be locally trapped in the nitride layer above the channel near the junction. Channel hot electron (CHE) injection for programming can operate in multi-bit using localized trap in nitride film. CHE injection in our devices is achieved with the single power supply of 5 V. To demonstrate CHE injection, substrate current (Isub) and one-shot programming curve were investigated. The multi-bit operation which stores two-bit per cell is investigated with a reverse read scheme. Also, hot hole injection for fast erasing is used. Due to the ultra-thin gate dielectrics, our results show many advantages which are simpler process, better scalability and lower programming voltage compared to any other two-bit storage flash memory. This fabricated structure and programming characteristics are shown to be the most promising for the multi-bit flash memory.

HgTe quantum dots(QDs) were synthesized in aqueous solution by colloidal method. The absorption and photoluminescence(PL) spectrum of the synthesized HgTe QDs revealed the strong exitonic peak in the IR region. And the photocurrent measurement of colloidal QDs are performed using IR light source. The lineshape of the wavelength dependent intensity of photocurrent was very similar to the absorption spectrum, indicating the charges generated by the absorption of photons give direct contribution to photocurrent. The channels of dark current are supposed $H_2O$ containing in thiol by the remarkable drop of current at the state of vacuum. It was thought that the proper passivation layer on the top of HgTe film reduce the dark current and the adequate choice of capping material improves the efficiency of the photocurrent in the HgTe QDs. This study suggests that HgTe QDs are very prospective materials for optoelectronics including photodetectors in the IR range.

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina ($Al_2O_3$) abrasive containing slurry with $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

본 논문에서는 철도차량 견인전동기에 대한 상태진단 및 상시감시 기술에 관하여 소개하였다. 권선의 절연상태 진단을 위한 비파괴 시험법에서는 부분방전량 Q에 대한 평균열화도 $\Delta$로 표현되는 D-Map에 의해 잔여 절연내력(residual dielectric strength)을 예측하고, 기기의 운전이력측면에서 기동-정지 횟수와 열적, 전기적 및 열싸이클 스트레스 등에 의해 각 열화 인자를 고려한 운전시간에 기반한 N-Y 수명예측을 수행한다. 그리고 견인전동기의 전류에 대한 온라인 상태감시를 통해 베어링 고장, 고정자 및 전기자 고장, 고장 또는 전동기축 손상에 기인하는 비정상 운전상태 의 감지를 수행한다.

In this paper, ageing diagnostics in the large capacity oil transformer are investigated. Following items are investigated for the ageing diagnostic in transformer oils (leakage current of sensor, power consumption and temperature of transformer oil). All temperature data are gathered from daily report in the substation. The power consumption of transformer are gathered output report of APIS(Airport Power Information System). Especially, data of sensor leakage current are accumulated from the online diagnostic system for transformer oil. The temperature of transformer oils major change factor was ambient temperature and capacity of power load. The leakage current are change by oil temperature. The leakage current ware not more than 2 [nA] in summer,

The primary insulation system used in an oil-filled transformer is kraft paper, wood, porcelain and oil. Modern transformers use paper that is chemically treated to improve its tensile strength properties and resistance to aging caused by immersion in oil. But these insulation papers are mainly aged to thermal stress. Over the course of the insulation paper and oil's life it is exposed to high temperatures, oxygen and water. Its interaction with the steel of the tank and core plus the copper and aluminium of the windings will eventually cause the chemical properties of the oil to decay. High temperature have an effect on mechanical strength of cellulous paper using the layer insulation. We made two aging cell in which thermal aging tests of insulation papers and mineral oil are conducted. It is measured dielectric strength, number of acid, moisture, etc. of insulation paper and oil aged in the aging cells.

다층의 산화물 박막으로 이루어진 coated conductor의 제조를 위하여 각층의 증착조건이 최적화되어야 한다. 가공/열처리를 통하여 2축배향성을 가지는 Ni 금속 기판위에 $Y_2O_3$, YSZ, $CeO_2$ 등의 산화물 완충층을 증착한 후 초전도층인 YBCO를 증착하였다. 12도와 8도의 in-plane fwhm (full width at half maximum)과 out-of-plane fwhm을 가지는 Ni 기판을 이용하여 13도와 4.5도의 in-plane 및 out-of-plane fwhm을 가지는 YBCO coated conductor를 제조하였다. 임계온도 (Tc), 임계전류 (Ic), 및 임계전류밀도 (Jc) 는 각각 84K, 3.3A, 및 $310,000\;A/cm^2$ 이었다.

We have proposed a model to describe the current-voltage characteristics of fabricated devices using the Biot-Savart's law in order to develop superconducting flux flow transistors, The measured and calculated values, including induced voltage, transresistance and current gain were investigated in relation to the parallel flow of the vortices in a single microbridge. The predictions agreed very well with measured results.

In order to improve the surface uniformity and the conduction properties of the fabricated YBCO thick films, a system that applies alternating field vertically to the EPD field has been developed for the first time and applied to the electrophoretic deposition process. The applied alternating electric field caused a force to be exerted on each YBCO particle and resulted in a shaking of the particle in the direction of applied electric field, accomplishing a uniform particle orientation. The usual commercial electrical power was used for the vertically applied alternating voltage and the induced electric field was 25-120 V/cm at 60Hz. The thick film fabricated by the method developed in this paper showed better surface uniformity without crack and porosity and improved film characteristics such as critical temperature ($T_{c,zero}$ : 90 K) and critical current density ($2354\;A/cm^2$). Therefore, it is expected that the shaky-aligned electrophoretic deposition method can be used to fabricate superconductor films through a simpler process and at less expense.

The sensor at liquid nitrogen temperature showed the increase of electrical resistance by applying magnetic field. Actually, the voltage drop across the sensor was changed from zero to a value more than $100\;{\mu}V$ by the applied magnetic field. The change of electrical resistance depended on magnetic field. The sensitivity of this sensor was $2.9\;{\Omega}/T$. The sensing limit was about $1.5{\times}10^{-5}\;T$. The increase of electrical resistance by the magnetic field was ascribed to a modification of the Josephson junctions due to the penetrating magnetic flux into the superconducting material. Considering the observed properties of the superconductor with trapped magnetic flux, a magnetic sensor was fabricated to detect simultaneously both the intensity and the direction of the magnetic field.

This paper describes characteristics for insertion losses of Isolator have an effect on material parameter. One purpose of the paper is to present insertion loss on this resonator for magnetic loss, dielectric loss, magnetic field and saturation magnetization. Another is to study the effect of propeller resonator on response characteristics. In this paper, the analysis and measurement of the response characteristics were carried out for the isolator prototype. The measurement results agreed on the simulation results and acquire insertion loss $0.18\;{\sim}\;0.24dB$, return loss 27dB, isolation 27dB and bandwidth 500MHz on this condition saturation magnetization 550G, dielectric loss 0.0004, magnetic loss 20 and dielectric constant 14.

The electrophoretic deposition method using the suspension solution with additives under the electric potential was applied for the fabrication of YBCO superconductor wire. This method was able to simplify the fabrication facilities, and produce an uniform and dense thick film. To improve the critical current density of deposited films, the additive PEGs(Poly Ethylene Glycole) with the molecular weight of 600, 1000 and 3400, were used as chemical binders for the suspension solution. The organic additive PEG showed better effects to the properties of YBCO superconductor wire. The PEG improved the adhesion between superconductor particles and suppressed the crack on the surface, which enhanced the surface uniformity and density of YBCO deposited film. It was found that acetone suspension solution showed better deposition properties than the others. The samples fabricated in the solution with the additive, 8 vol.% of 1% PEG(1000), showed the highest critical current density measured as $2300{\sim}2400\;Acm^2$ at 77 K, 0 T.

4-bit 강유전체 위상변위기를 이용하여 10 GHz, 상온에서 작동하는 위상배열 안테나를 설계 및 제작하였다. 이 안테나는 빔 스캔을 위하여 전압에 대한 비선형특성을 보이는 강유전체 Bal-xSrxTiO3 (BST)를 기본으로 하는 위상변위기를 이용하였다. 우리는 펄스레이져 증착법으로 MgO (001) 기판위에 걸맞게 증착된 BST 박막을 일반적인 사진공정과 식각법을 이용하여 동일평판형 전극을 가진 위상변위기를 만들었다. 일반적인 동일평판형 강유전체 위상변위기의 경우 연결 전송선로의 임피던스와의 차이로 인해 반사손실과 이로 인한 부가적인 삽입손실이 발생한다. 이런 손실들을 줄이기 위해 입력과 출력 포트에 임피던스 매칭을 하였다. 이렇게 테이퍼링되어 만들어진 동일평판형 위상변위기는 이전의 구조에 비해 반사 손실과 삽입 손실 값에서 각각 약 10, 2 dB 정도씩의 개선을 보였다. 이 구조로 전송선로의 길이를 길게하여 만든 1-bit 강유전체 위상변위기는 10 GHz, 150 V의 전압변화에서 180도의 차등위상변위를 보였으며 최대 삽입손실과 최대 반사손실은 각각 약 10 dB, 20 dB 이다. 안테나 모듈은 4개의 마이크로스트림 패치 안테나와 4개의 강유전체 위상변위기로 이루어졌는데 10 GHz, 150 V의 전압변화에서 약 15도의 빔 스캔을 확인하였다.

[ $ZnWO_4$ ] shows excellent frequency selectivity due to its high quality factor($Q{\times}f$) at microwave frequencies. However, in order to use $ZnWO_4$ as multilayered wireless communication components, its other properties such as sintering temperature($1050^{\circ}C$), ${\tau}_f$ ($-70ppm/^{\circ}C$) and ${\varepsilon}_r(15.5)$ should be modified. In present study, $TiO_2$ and LiF were used to improve the microwave dielectric and sintering properties of $ZnWO_4$. $TiO_2$ additions to $ZnWO_4$ changed ${\tau}_f$ from negative to positive value, and also increased ${\varepsilon}_r$ due to its high ${\tau}_f$ ($+400ppm/^{\circ}C$) and ${\varepsilon}_r$(100). At 20 mol% $TiO_2$ addition, ${\tau}_f$ was controlled to near zero $ppm/^{\circ}C$ with ${\varepsilon}_r=19.4$ and $Q{\times}f=50000GHz$. However, the sintering temperature was still high to $1100^{\circ}C$. LiF addition to the $ZnWO_4+TiO_2$ mixture was greatly reduced the sintering temperature from $1100^{\circ}C$ to $850^{\circ}C$ due to liquid phase formation. Also LiF addition decreased the ${\tau}_f$ value due to its high negative ${\tau}_f$ value. Therefore, by controlling the $TiO_2$ and LiF amount, temperature stable LTCC material in the $ZnWO_4$-TiO_2-LiF$ system could be fabricated.

The circular cavity resonator which can measure the dielectric properties of dielectrics in the V-band($50GHz{\sim}75GHz$) frequency range was designed and fabricated. Exciting and detecting of the resonator is peformed by WR15 rectangular waveguides using Bethe's small hole coupling. The GaAs plate sample was used for the verification of the performance of the fabricated circular cavity resonator. In the measurement of GaAs single crystal using that resonator, the resonant frequency of the dominant $TE_{011}$ mode, the permittivity and $Q{\times}f_0$ were measured as 53.29GHz, 12.87 and 138,000, respectively.

Microwave dielectric properties of $Ca(Li_{1/4}Nb_{3/4})O_3-CaTiO_3$ ceramic systems were investigated with calcination temperatures and amounts of $CaTiO_3$ in the range of 0.2 to 0.4mol. $Ca(Li_{1/4}Nb_{3/4})O_3$ ceramics having orthorhombic crystal structure could be synthesized at $750^{\circ}C$ and sintered well at $1250^{\circ}C$. They showed the dielectric constant of 26, quality factor($Q{\times}f_o$) of 13,000 and temperature coefficient of resonant frequency(${\tau}_f$) of $-49{\pm}2ppm/^{\circ}C$ With adding the $CaTiO_3$ amount the dielectric constant and ${\tau}_f$ increased due to the solute of $CaTiO_3$ but the quality factor decreased. The 0.7$Ca(Li_{1/4}Nb_{3/4})O_3-0.3CaTiO_3$ ceramic showed the dielectric constant of 44, quality factor($Q{\times}f_o$) of 12,000 and ${\tau}_f$ of $-9{\pm}1ppm/^{\circ}C$.

Al doped Zinc Oxide(ZnO:Al) films, which is widely used as a transparent conductor in optoelectronic devices such as solar cell, liquid crystal display, plasma display panel, thermal heater, and other sensors, were prepared by using the capacitively coupled DC magnetron sputtering method. The influence of the substrate temperature, working gas pressure and discharge power on the electrical, optical and morphological properties were investigated experimentally. The consideration on the effect of doping amounts of Al on the electrical and optical properties of ZnO thin film were also carried out. ZnO:Al films with the optimum growth conditions showed resistivity of $9.42{\times}10^{-4}\;{\Omeg}-cm$ and transmittance of 90.88% for 840nm in film thickness in the wavelength range of the visible spectrum.

In this paper, We fabricated a high temperature pressure sensor using SBD(silicon- direct-bonding) wafer of $Si/SiO_2$/Si-sub structure. This sensor was very sensitive because the piezoresistor is fabricated by single crystal silicon of the first layer of SDB wafer. Also, it was possible to operate the sensor at high temperature over $120^{\circ}C$ which is the temperature limitation of general silicon sensor because the piezoresistor was dielectric isolation from silicon substrate using silicon dioxide of the second layer. The sensitivity of this sensor is very high as the measured result of D2200 shows $183.6\;{\mu}V/V{\cdot}kPa$. Also, the output characteristic of linearity was very good. This sensor was available at high temperature as $300^{\circ}C$.

AlN/Al/SiO$_2$/Si thin films for application to FBAR(Film Bulk Acoustic Resonator) devices were prepared by FTS(Facing Targets sputtering system) apparatus which provides a stable discharge at low gas pressures and can deposit high quality thin films because of the substrate located apart from the plasma. The AlN thin films were deposited on a $SiO_2(1{\mu}m)/Si(100)$ substrate using an Al bottom electrode. The process parameters were fixed such as sputering power of 200W, working pressures of 1mTorr and AlN thin film thickness of 800nm, respectively and crytallographic characteristics of AlN thin films were investigated as a function of $N_2$ gas flow rate$[N_2/(N_2+Ar)]$. Thickness of AlN thin films were measured by $\alpha$-step, the crystallographic characteristics and c-axis preferred orientation were evaluated by XRD.

Polycrystalline $Ti_{1-x}Co_xO_2$ thin films on $SiO_2$ (200 nm)/Si (100) substrates were prepared using liquid-delivery metalorganic chemical vapor deposition. Microstructures and ferromagnetic properties were investigated as a function of doped Co concentration. Ferromagnetic behaviors of polycrystalline films were observed at room temperature, and the magnetic and structural properties strongly depended on the Co distribution, which varied widely with doped Co concentration. The annealed $Ti_{1-x}Co_xO_2$ thin films with $x{\leq}0.05$ showed a homogeneous structure without any clusters, and pure ferromagnetic properties of thin films are only attributed to the $Ti_{1-x}Co_xO_2$ (TCO) phases. On the other hand, in case of thin films above x=0.05, Co clusters formed in a homogeneous $Ti_{1-x}Co_xO_2$ Phase, and the overall ferromagnetic (FM) properties depended on both $FM_{TCO}$ and $FM_{Co}$. Co clusters with about 10nm-150nm size decreased the value of Mr (the remanent magnetization) and increased the saturation magnetic field.

This paper describes on anodic bonding characteristics of MLCA(Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100 %, input power $1\;/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-008 %FS. Moreover, any damages or separation of MICA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MICA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

Carbon nitride films with ${\beta}-C_3N_4$ crystals were grown by rf reactive magnetron sputtering system with negative DC bias. Chamber baking system to supply whole chamber with activation energy was used to reduce the contamination of H and O atoms. XRD peaks showed the existence of crystalline ${\beta}-C_3N_4$(200) and lonsdaleite structures. FTIR spectroscopy studies revealed that the film contain ${\alpha}-C_3N_4$ and ${\beta}-C_3N_4$ with $1011\;cm^{-1},\;1257\;cm^{-1}\;and\;1529\;cm^{-1}$ peaks. We could also find the grain growth of hexagonal structure from SEM photograph, which is coincident with the theoretical carbon nitride unit cell. ${\alpha}$-step was used to make the thickness profile of the grown films.

Bismuth layered structure, Cerium-substituted $Bi_4Ti_3O_{12}$ ($(Bi,Ce)_4Ti_3O_{12}$) thin films were prepared on the $Pt/TiO_2/SiO_2/Si$ substrates by the pulsed laser deposition method. We investigated the Ce-subsitituted effect on the grain orientation and ferroelectric properties. $Ce^{3+}$ ion substitution for $Bi^{3+}$ ion in perovskite layers of BTO decreased the deeree of c-axis orientation and increased the remanent polariation (2Pr). The structure and morphology of the films were characterized using X-ray diffraction and atomic force microscopy. The $(Bi,Ce)_4Ti_3O_{12}$ (BCT) thin films, which were annealed $700^{\circ}C\;and\;800^{\circ}C$ for 10min and 30min, showed a perovskite phase and dense microstructure. As the thickness of the BCT film was decresed that the ferroelectric properties of the BCT thin films were good.

ZnO:Al thin film for application to FBAR's bottom electrode using ZnO piezoelectric thin film were prepared by FTS, in order to improve the crystallographic properties of ZnO thin films because the ZnO:Al thin film and ZnO thin films structure is equal each other. So we prepared the ZnO:Al thin film with oxygen gas flow rate. Thickness and c-axis preferred orientation and electric properties of ZnO:Al bottom electrode were evaluated by $\alpha$-step, XRD and 4-point probe..

Tri-crystalline silicon (Tri-Si) wafers have three different orientations and three grain boundaries. In this paper, tri-Si wafers have been used for the fabrication of buried contact solar cells. The optical and micro-structural properties of these cells after texturing in KOH solution have been investigated and compared with those of cast multi-crystalline silicon (multi-Si) wafers. We employed a cost effective fabrication process and achieved buried contact solar cell (BCSC) energy conversion efficiencies up to 15% whereas the cast multi-Si wafer has efficiency around 14%.

In this paper, we investigated the position-dependent stress distribution of indium-tin-oxide (ITO) film on Polycarbonate (PC) substrate by external bending force. It was found that there are the maximum crack density at the center position and decreasing crack density as goes to the edge. In accordance with crack distribution, it was observed that the change of electrical resistivity of ITO islands is maximum at the center and decrease as goes to the edge. From the result that crack density is increasing at same island position as face-plate distance (L) decreases, it is evident that the more stress is imposed on same island position as L decreases.

In this paper, it was demonstrated that the organic thin film transistors were fabricated by the organic gate insulators with vapor deposition polymerization (VDP) processing. In order to form polyimide as a gate insulator, vapor deposition polymerization process was also introduced instead of spin-coating process, where polyimide film was co-deposited by high-vacuum thermal evaporation from 4,4'-oxydiphthalic anhydride (ODPA) and 4,4'-oxydianiline (ODA) and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and ODA, and cured at $150^{\circ}C$ for 1hr. Electrical output characteristics in our organic thin film transistors using the staggered-inverted top-contact structure obtained to the saturated slop in the saturation region and the subthreshold non-linearity in the triode region. Field effect mobility, threshold voltage, and on-off current ratio in $0.45\;{\mu}m$ thick gate dielectric layer were about $0.17\;cm^2/Vs$, -7 V, and $10^6\;A/A$, respectively. Details on the explanation of compared to organic thin-film transistors (OTFTS) electrical characteristics of ODPA-ODA and 6FDA-ODA as gate insulators by fabricated thermal co-deposition method.

Through using aspheric lens can result in advantages such as an improved optical transfer function, a reduced distortion path or the realization of special image field curvatures. Using the diamond turning method for generating aspherics, the company claim to be able to generate surfaces with a form error of less than $0.33\;{\mu}\;m$ and a surface roughness of less than $0.025\;{\mu}\;m$. In this paper, we are manufacturing thermal image aspheric lens. Thermal image system is electro-optical imaging device which can make visible the difference of infrared energy naturally emitted by objected. In the result of aspherical surface, the form accuracy of about $0.24\;{\mu}\;m$ P-V was obtained and the surface roughness Ra $0.004\;{\mu}\;m$. Also, a brief review of Ultra-precision system Korea photonics technology institute(KOPTI) is present in this paper.

본 연구에서는 MILC 및 FALC를 도핑 타입에 따른 온도별 패턴별 인가 전압별로 진행하여 현미경 및 FESEM 관찰을 함으로써 그 메커니즘을 규명하고자 하였다. LPCVD를 이용하여 $1000\;{\AA}$ a-Si 을 glass에 입힌 후 photolithography법 또는 Hard Mask법으로 Ni $200\;{\AA}$ 을 선택적으로 증착하였으며 Pt 전극을 Sputtering법으로 제작하였다. $33\;{\sim}\;200\;V/cm$의 전기장 하에서 MILC 속도가 2배 정도 증가되는 현상이 관찰되었으며 또한 인접패턴에 의해 FALC 속도가 영향을 받는 현상이 관찰되었다. 또한 전자가 움직이는 방향으로 MILC 선단영역 전후에 Void가 발생하는 영역이 존재함을 발견하였다. FESEM 분석을 통하여 FALC 영역 및 Void 영역을 관찰한 결과 도핑 종류에 따라 결정화 양상이 다른 것이 관찰되었으며 Void 분석결과 Charged vacancy가 어닐링시 결집되어 나타나는 것으로 분석할 수 있었다.

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on two kinds of polyimide (PI) surfaces using thin plastic substrates. The generated NLC pretilt angles on the pre-imidized type PI are about $3.8^{\circ}$ by the rubbing alignment method with thin plastic substrates, However, the pretilt angle measured at about $2.8^{\circ}$ lower on the polyamic acid type PI than by pre-imidized type PI surface with thin polymer film. The tilt angle increases as increasing curring temperature for making polyimide layer using polyamic acid type PI. It was concluded that pretilt angle in the polyimide surface is attributable to the increasing of imide rato.

Ion implantation has been shown to significantly alter the surface properties of polymers. Polycarbonate(PC) and Polyimide(PI) were irradiated with 50keV $N^+$, $Xe^+$ ions to the fluences of $1{\times}10^{16}{\sim}3{\times}10^{17}\;cm^2$. The ion beam-induced modification of the electrical conductivity and the related structural features have been studied for polymers. The beam-induced chemical and structural modifications have been investigated by using X-ray Phooelectron Spectroscopy(XPS) and Fourier Transform-Infrared Spectroscopy(FT-IR), while the modification of the electrical properties was followed by performing a complete set of sheet resistance measurements. Samples irradiated at higher fluence showed a good conductivity, with a saturation value of $10^7{\Omega}/sq$. The XPS data demonstrate that the modification of the electrical properties is due to the progressive formation with increasing ion fluence of a dense amorphous carbon network, while PF-IR data reveal that material degradations through bond breaking are the main effects.

The dielectric carbon nitride thin films were deposited onto Si(100) using a pulsed laser ablation of pure graphite target combined with a high voltage discharge plasma in nitrogen gas atmosphere. We can be calculated dielectric constant, ${\varepsilon}_s$, with a capacitance Sobering bridge method. We reported to investigate the influence of the laser ablation of graphite target and DC high voltage source for the plasma. The properties of the deposited carbon nitride thin films were influenced by the high voltage source during the film growth. Deposition rate of carbon nitride films were found to increase drastically with the increase of high voltage source. Infrared absorption clearly shows the existence of C=N bonds and $C{\equiv}N$ bonds. The carbon nitride thin films were observed crystalline phase, as confirmed by x-ray diffraction data.

In this paper, a model pole transformer was designed to improve the reliability of pole transformers and its short circuit withstand strength was tested. The failure causes of the pole transformers which had been operated in the field were analyzed and several patterns of the causes were determined. A novel countermeasure was devised to prevent the failures of the pole transformers in advance. A model pole transformer was designed and made in accordance with the given specifications to strengthen the short circuit withstand capability and its characteristic was tested. As a result, the advanced performance of the model pole transformer was confirmed and novel techniques in manufacturing process was suggested. It is considered that all the methods employed in the developing process will be helpful to design and manufacture the pole transformers thus the reliability of pole transformers in distribution lines will be improved.

The Judd-Ofelt theory is becoming basis that induced of ligand field of electric dipole transitions of between 4f electic states. It is developed for the rare earth ions through judd and of ofelt. This theory be applicate success to the raer earth ions in solid, liquid and gas state. This paper reports a optical characteristices of Nd:glass by using the Judd-Ofelt Method.

In this paper, we designed a Ku-band BPF(Band Pass Filter) by microstrip line that most usually used a microwave device design and fabrication. Here a substrate of designed BPF were silicon substrate(${\varepsilon}_r=11.8$), and metal line was copper and silver/copper structure. And a configration of BPF was used hairpin pattern. A center frequency of designed BPF was 10GHz and their FBW(Fractional Band Width) was 20%(2GHz). It presented simulated results obtained for a 10GHz filter which yields an insertion loss of 0.1dB that ripple value related chebyshev reponse. Finallt we tried to make that a 30dB attenuation frequency was 20% of center frequency.

We propose an improvement method for a $\underline{G}ate$ $\underline{OX}ide(GOX)$ thinning at the edge of $\underline{S}hallow$ $\underline{T}rench$ $\underline{I}solation(STI)$, when STI is adopted to Dual Gate Oxide(DGOX) Process. In the case of SOC(System On-a-Chip), the DGOX process is usually used for realizing both a low and a high voltage parts in one chip. However, it is found that the severe GOX thinning occurs from at STI top edge region and a dent profile exists at the top edge of STI, when conventional DGOX and STI process carried out in high density device chip. In order to overcome this problem, a new DGOX process is tried in this study. And we are able to prevent the GOX thinning by H2 anneal, partially SiN liner skip, and a method which is merged a thick sidewall oxide(S/O) with a SiN pull-back process. Therefore, a good subthreshold characteristics without a double hump is obtained by the prevention of a GOX thinning and a deep dent profile.

Usually, the thrust of a Linear Pulse Motor(LPM) is calculated by magnetic equivalent circuit modelling method. Analytical thrust deviation exists to calculating magnetic flux density by using Permeance Modelling Method, Finite Element Method, and Velocity Electric Motive Force Method. For calculating accuracy thrust by using these every method, the thrust is calculated and compared by Lorentz Force Method, Magnetic Coenergy Method, and Maxwell correspondence force Method. And that becomes important factor at the comparison of each capacity and parameter of motor. So this study wants to compare and analyze measurement data and calculating data of the static thrust of LPM. and then we can get more accuracy method, calculating the static thrust of LPM.

수소 가스발생을 위한 마이크로 수소 발생기 개발에서 MEMS 공정을 이용하여 기판에 반응 유로를 위해 HAR(High Aspect Ratio) 구조물을 형성하고 Ru(ruthenium) 박막을 증착하여 수소 발생량을 측정하였다. Pyrex glass 기판상에 sand blast 방법으로 반응 구조물을 만들었으며, 그 위에 sputter system을 이용하여 Ru 박막을 $5500{\AA}$었다. 수소 발생량은 촉매 박막이 증착된 기판 재질과 기판의 표면 상태 그리고 마이크로 수소 발생기에 두께로 증착하였다. 반응 구조물의 전체 크기가 가로 2.0 cm, 세로 2.0cm의 면적에서 약 12.3 ml/min의 수소가 측정되 형성한 구조물의 형상에 의존하였다. Pyrex glass 기판을 사용하여 HAR로 반응 구조물을 형성한 경우에 단위 면적당 Ru 박반응 막의 반응 표면적이 증가되어 기존에 구조물을 형성하지 않은 평면 기판에 비교하여 약 5.5배 이상의 수소 발생이 증가하였다.

투어멀린(Tourmaline)은 비대칭 쌍극자를 가진 유극성 결정체로 광물 중에서 영구적으로 전기분극 특성을 띄고 있는 유일한 물질로써, 일명 "전기석"이라고 알려져 있다. 자체의 미약 전류(약 0,06mA)와 함께 음이온 및 원적외선의 발생으로 최근 우리 주변에서 건강과 환경정화를 위한 관심 대상의 투어멀린은 육방정계의 압전성 및 초전성을 띄는 붕규산염으로, 물분자를 만나면 수소($H^+$)와 수산기($OH^-$)로 분해하여 친수기와 소수기를 구분하여 발생하며, $H^+$와 $OH^-$는 각각 $H_2O$와 결합하여 활성이 강한 hydronium ion($H_3O^+$)과 계면활성 작용이 있는 hydroxyl ion($H_3O_2^-$)을 생성한다. 물속에서 불안정한 상태로 존재하는 수산기는 hydroxyl (-)ion을 형성하여 약 알카리성($pH{\sim}7.4$)을 띄고, 물의 클러스터(cluster)를 세분화하는 수질개선 기능과 함께 살균, 항균 및 세균번식억제 효과를 갖는 것으로 확인되었다. 따라서 투어멀린 소결체를 활용하여 그 처리수의 특성조사 및 기능개발과 함께 대장균의 번식억제 작용 및 살균작용과 수질개선 기능 등 유용한 결과의 분석으로부터 다양한 응용성을 확보하였다.

Randomly oriented ferroelectric cerium-substituted $Bi_4Ti_3O_{12}$ thin films have been prepared by using metal-organic decomposition method. The layered perovskite structure was investigated using annealing for 1 h in the temperature range from $550\;{\sim}\;750\;^{\circ}C$. The structure and morphology of the films were characterized using X-ray diffraction and scanning electron microscopy The $Bi_{3.4}Ce_{0.6}Ti_3O_{12}$ (BCeT) thin films showed a perovskite phase and dense microstructure. The grain size of the BCeT films increasedwith increasing annealing temperature. The hysteresis loops of the films were well defined at temperatures above $600\;^{\circ}C$. The 200-nm-thick BCeT thin films annealed at $650\;^{\circ}C$ showed a large remanent polarization (2Pr) of 59.3 ${\mu}C/cm^2$ at an applied voltage of 10 V. The BCeT thin films showed good fatigue endurance up to $5\;{\times}\;10^9$ bipolar cycling at 5 V and 100 kHz.

This paper discribes the analysis of the breakdown voltage characteristics of SOI LIGBT with dual epi-layer. In case of SOI LIGBT with dual epi-layer, if we used high doping concentration in epi-layer, we obtained higher breakdown voltage compared with typical device because of charge compensation effect, and we obtained low on-state resistivity characteristic in the same breakdown voltage. In this paper, we analyzed on-state and off-state characteristics of SOI LIGBT with dual epi-layer. Breakdown voltage of proposed LIGBT was shown 125V when $T_1=T_2=2.5{\mu}m$, $N_1=7{\times}10^{15}/cm^3$ and $N_2=3{\times}10^{15}/cm^3$, respectively Although we used high doping concentration and thin epi-layer thickness, breakdown voltage was increased compared with conventional devices.

The pulsed laser deposition process modeling is investigated using neural networks based on radial basis function networks and multi-layer perceptron. Two input factors are examined with respect to the PL intensity. In order to minimize the joint confidence region of fabrication process with varying the conditions, D-optimal experimental design technique is performed and photoluminescence intensity is characterized by neural networks. The statistical results were then used to verify the fitness of the nonlinear process model. Based on the results, this modeling methodology can be optimized process conditions for pulsed laser deposition process.

Two Si wafers are bonded with indium-silver alloy using diffusion bonding method. When silver and indium thin films are contacted, they diffuse into each other and form inter-metallic compounds like $AgIn_2$, $Ag_2In$, $Ag_3In$ etc. These compounds are determined by ratio of two metals. From phase diagram of Ag-In alloy, we can get the ratio of $Ag_2In$, that has high melting point about 700$^{\circ}C$, approximately 2:1. This ratio was made by controlling of film thickness. And bonding was executed by annealing and adding pressures at a time. The joint of these wafers had been observed by SEM. And we had also seen the EDS (Energy Dispersive Spectroscopy) data to analysis the component of samples.

The surface electronic state of rutile $TiO_2$, which is an oxide semiconductor and has a wide band gap of 3.1 $\sim$ 3.5 eV, was calculated by DV-$X_{\alpha}$ method, which is a sort of the first principle molecular orbital method and uses Hartre-Fock-Slater approximation. The $[Ti_{15}O_{56}]^{-52}$ cluster model was used for the calculation of bulk state and the $[OTi_{11}O_{34}]^{-24}$ model for the surface state calculation. After calculations, the energy level diagrams and the deformation electron density distribution map were compared in both models. As results, it was identified that the surface energy levels are found between the valence and conduction band of bulk $TiO_2$ on the surface area. The energy values of these surface-induced levels are lower than conduction band of bulk $TiO_2$ by 0.1 $\sim$ 1 eV. From this fact, it is expected that the surface energy levels act as donar levels in n-type semiconductor.

The gate leakage current is first calculated using the experimental method between gate and drain by opening source electrode. Next, the gate to drain current has been obtained with a ground source. The difference of two current has been tested and provide that the existence of another source to Schotuy barrier height against the image force lowering effect.

반도체 웨이퍼 및 각종 박막의 면/비저항(sheet/resistivity resistance)의 측정에 비교적 간단히 측정할 수 있고 측정정확도가 높은 4탐침(four-point probe)방법이 널리 사용되고 있다 또한 4탐침 측정방법은 높은 분해능의 contour map작성과 ion implantation의 doping accuracy 및 doping uniformity의 측정에도 사용된다. 최근 재료의 소형, 박막화 경향으로 볼 때 정확한 비저항 측정의 필요성이 요구되고 있으며 이에 따라 4탐침 측정기술인 single 및 dual configuration method로 실리콘 웨이퍼에 대한 비저항의 측정 정확도를 고찰한 결과 dual configuration 측정방법이 single configuration측정 방법에 비하여 정밀 정확도가 더 좋은 것으로 고찰되었다.

네트워크상태의 탄소나노튜브 나노선과 바나듐 옥사이드 나노선의 전압-전류 특성을 측정하고 옴성 전압전류특성과 함께 정류 다이오드 특성을 관측하였다 정류특성을 Schottky diode 관점에서 분석하였고 나노선을 이용한 다이오드의 이상지수가 10을 초과하는 큰 값을 가짐을 알았다. 2단자 전극상태에서 전류잡음 1/f 잡음형태가 관측되었다.

최근 logic 소자의 gate oxide로 기존의 $SiO_2$, SiON보다 고유전, 작은 누설전류를 가지는 물질의 개발이 중요한 이슈가 되고 있다. 본 실험실에서는 Si 기판위에 $HfO_2$를 바로 증착하는 경우, 기판의 Si이 박막내로 확산하여 유전율이 저하되는 문제점을 인식하고, 기판과 $HfO_2$ 사이에 $AlO_x$를 방지막으로 사용하였다. 이 때, $AlO_x$의 Al precursor는 TMA로 고정하고, 산화제로는 $H_2O$, $O_2$-plasma, $O_3$를 각각 사용하였다. 모든 $AlO_x/\;HfO_y$ 박막에서 매우 우수한 누설전류특성을 얻을 수 있었는데, 특히 $O_3$를 산화제로 사용한 $AlO_x$방지막의 경우 가장 우수한 특성을 보였다. 또한 질소 분위기에서 $800^{\circ}C$ 10분간 열처리한 후, 방지막을 사용한 모든 경우에서 보다 향상된 열적 안정성을 관찰할 수 있었다.

The p-CIn2Te4 single crystal was grown in the three-stage vertical electric furnace by using Bridgman method. The quality of the grown crystal has been investigated by the x-ray diffraction and the photoluminescence measurements. From the photoluminescence spectra of the as-grown CdIn2Te4 crystal and the various heat-treated crystals, the (Do, X) emission was found to be the dominant intensity in the photoluminescence spectrum of the CdIn2Te4:Cd, while the (Ao, X) emission completely disappeared in the CdIn2Te4:Cd. However, the (Ao, X) emission in the photoluminescence spectrum of the CdIn2Te4:Te was the dominant intensity like an as-grown CdIn2Te4 crystal. These results indicated that the (Do, X) is associated with VTe acted as donor and that the (Ao, X) emission is related to VCd acted as acceptor, respectively. The p-CdIn2Te4 crystal was found to be obviously converted into the n-type after annealing in the Cd atmosphere. The origin of (Do, Ao) emission and its TO phonon replicas is related to the interaction between donors such as VTe or Cdint, and accepters such as VCd or Teint. Also, the In in the CdIn2Te4 was confirmed not to form the native defects because it existed in the stable form of bonds.

Single crystal $CuAlSe_2$ layers were grown on thoroughly etched semi-insulating GaAs(100) substrate at $410\;^{\circ}C$ with hot wall epitaxy (HWE) system by evaporating $CuAlSe_2$ source at $680\;^{\circ}C$. The crystalline structure of the single crystal thin films was investigated by the photoluminescence and double crystal X-ray diffraction (DCXD). The carrier density and mobility of single crystal $CuAlSe_2$ thin films measured with Hall effect by van der Pauw method are $9.24{\times}10^{16}\;cm^{-3}\;and\;295\;cm^2/V{\cdot}s$ at 293 K, respectively. The temperature dependence of the energy band gap of the $CuAlSe_2$ obtained from the absorption spectra was well described by the Varshni's relation, $E_g(T)\;=\;2.8382\;eV\;-\;(8.68\;{\times}\;10^{-4}eV/K)T^2/(T\;+\;155\;K)$. The crystal field and the spin-orbit splitting energies for the valence band of the $CuAlSe_2$ have been estimated to be 0.2026 eV and 0.2165 eV at 10 K, respectively, by means of the photocurrent spectra and the Hopfield quasicubic model. These results indicate that the splitting of the $\Delta$so definitely exists in the ${\Gamma}_5$ states of the valence band of the $CuAlSe_2$. The three photocurrent peaks observed at 10 K are ascribed to the $A_1-$, $B_1-$, and $C_1$-exciton peaks for n = 1.

In the case of high voltage devices, junction termination plays an important role in determining the breakdown voltage of the device. The mesa junction termination has been demonstrated to yield nearly ideal breakdown voltage for 6H-SiC p-n junctions. However, such an approach may not be attractive because of the nonplanar surface, which is difficult to passivate. Moreover, In case of 4H-SiC, ideal breakdown voltage could not be achieved using mesa junction termination. For 4H-SiC planar junction termination technique is more useful one rather than mesa junction termination. In this paper, breakdown characteristics of the 4H-SiC device with planar junction termination, such as FLR(Field Limiting Ring), FP(Field Plate) and JTE(Junction Termination Extension), is presented. In the case of the FLR, breakdown voltage of 1800V is obtained. And breakdown voltage of 1000V and 1150V is also obtained for the case of FP and JTE case, respectively.

Ohmic contact characteristics of Al ion implanted n-type SiC wafer were investigated. Al ions implanted with high dose to obtain the final concentration of $5{\times}10^{19}/cm^3$, then annealed at high temperature. Firstly, B ion ion implanted p-well region were formed which is needed for fabrication of SiC devices such as DIMOSFET and un diode. Secondly, Al implanted high dose region for ohmic contact were formed. After ion implantation, the samples were annealed at high temperature up to $1600^{\circ}C\;and\;1700^{\circ}C$ for 30 min in order to activate the implanted ions electrically. Both the inear TLM and circular TLM method were used for characterization. Ni/Ti metal layer was used for contact metal which is widely used in fabrication of ohmic contacts for n-type SiC. The metal layer was deposited by using RF sputtering and rapid thermal annealed at $950^{\circ}C$ for 90sec. Good ohmic contact characteristics could be obtained regardless of measuring methods. The measured specific contact resistivity for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$ were $1.8{\times}10^{-3}{\Omega}cm^2$, $5.6{\times}10^{-5}{\Omega}cm^2$, respectively. Using the same metal and same process of the ohmic contacts in n-type SiC, it is found possible to make a good ohmic contacts to p-type SiC. It is very helpful for fabricating a integrated SiC devices. In addition, we obtained that the ratio of the electrically activated ions to the implanted Al ions were 10% and 60% for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$, respectively.

We have investigated the structures of copper nanowires encapsulated in carbon nanotubes using a structural optimization process applied to the steepest descent method. The results showed that the stable morphology of the cylindrical ultrathin copper nanowires in carbon nanotubes is multishell packs consisted of coaxial cylindrical shells. As the diameter of copper nanotubes increased, the encapsulated copper nanowires have the face centered cubic structure as the bulk. Both the semiclassical orbits in a circle and the circular rolling of a triangular network can explain the structures of ultrathin multishell copper nanowires encapsulated in carbon nanotubes.

The design rule for 8.5kV LTT was discussed here. An inherent integrated breakover diode (BOD) for self -protection function and multi-amplified gate (AG) for improved di/dt capability of LTT was introduced in principle. The trade-off between light triggering input source and high dV/dt limitation has been treated via narrow grooved P-base for gate design. Key process technology for LTT was given, too.

Replacement of aluminum by copper for interconnections in the semiconductor industry has raised a number of important issues. The integration of copper interconnection can be carried out by CMP(chemical mechanical polishing) is used to planarize the surface topography. In this experiments, we evaluated the optimization of several conditions for chemical additives during Cu CMP process. It was presented that the main cause of grown particle size is tartaric acid. The particle size was in inverse propotion to a quantity of bead and the time of milling process. The slurry stabilizer and oxidizer have been shown to have very good effect by addition in later milling process.

The mesoporous TiO2 film for the dye-sensitized solar cell was prepared by the spin coating using nano particle $TiO_2$ slurry. In order to obtain the good dispersion of nano size $TiO_2$ particles in slurry, the pH of solvent, the sort and quantity of solvent additive and the quantity of surfactant were adjusted. The experimental range of pH was $2\;{\sim}\;4$. The basic solvent for slurry was dilute $HNO_3$ and the solvent additives were ethylene glycol, propylene glycol and butylene glycol. The degree of particle dispersion was indirectly estimated by the viscosity of slurry and the microstructure after sintering. As results, the lower the pH of solvent was the lower the viscosity of the slurry became. The addition of ethylene glycol and propylene glycol to dilute $HNO_3$ brought about the lowering of viscosity and the enhancement of stability in slurry. The addition of surfactant lowered the viscosity of slurry. It was possible to obtain the homogeneous and uniformly dispersed mesoporous TiO2 film using the dilute HNO3 solvent of pH 2 with the addition of ethylene glycol, propylene glycol and neutral surfactant.

Basic design of RC-GCTs (Reserve-Conducting Gate-Commutated Thyristors) by novel punch-through (PT) concept with 5,500v rated voltage is described here. A PT and NPT (non punch-through) concept for the same blocking voltage has been compared in detail. The simulation work indicates that GCT with such PT design exhibits that the forward breakdown voltage is 6,400V which is enough for supporting 5500V blocking. Additionally, the real IGCT turn-off in the mode of PNP transistor has been realized. However, the carrier extraction from N-base to gate terminal will be drastic slowly in terms of NPT structure except for the high on-state voltage drop.

양자우물 구조를 사용한 HEMT(High Electron Mobility Transistor)는 고속 스위칭 소자와 초고주파 통신용 소자 및 센서에에 우수한 동작특성을 갖고 있다. 본 논문에서는 AlInAs/InP HEMT의 heterostructure를 파동방정식과 Poisson 방정식을 self-consistent 한 방법으로 해석하였다. 파동방정식으로 junction의 전자농도를 계산하고, Poisson 방정식을 해석하여 potential profile에 의한 전자 농도가 heterostructure에서 self-consistent가 되도록 연산하였다. 끝으로 AlInAs/InP 구조에서 positively ionized donor, valance band에서의 hole, conduction band의 free electron과 구조내의 2DEG를 AlGaAs/GaAs 및 AlGaAs/InGaAs/GaAs와 비교하였다.

To match the charge induced by the insulators $CeO_2$ with the remanent polarization of ferro electric SBT thin films, areas of Pt/SBT/Pt (MFM) and those of $Pt/CeO_2/Si$ (MIS) capacitors were ind ependently designed. The area $S_M$ of MIS capacitors to the area $S_F$ of MFM capacitors were varied from 1 to 10, 15, and 20. Top electrode Pt and SBT layers were etched with for various area ratios of $S_M\;/\;S_F$. Bottom electrode Pt and $CeO_2$ layers were respectively deposited by do and rf sputtering in-situ process. SBT thin film were prepared by the metal orgnic decomposition (MOD) technique. $Pt(100nm)/SBT(350nm)/Pt(300nm)/CeO_2(40nm)/p-Si$ (MFMIS) gate structures have been fabricated with the various $S_M\;/\;S_F$ ratios using inductively coupled plasma reactive ion etching (ICP-RIE). The leakage current density of MFMIS gate structures were improved to $6.32{\times}10^{-7}\;A/cm^2$ at the applied gate voltage of 10 V. It is shown that in the memory window increase with the area ratio $S_M\;/\;S_F$ of the MFMIS structures and a larger memory window of 3 V can be obtained for a voltage sweep of ${\pm}9\;V$ for MFMIS structures with an area ratio $S_M\;/\;S_F\;=\;6$ than that of 0.9 V of MFS at the same applied voltage. The maximum memory windows of MFMIS structures were 2.28 V, 3.35 V, and 3.7 V with the are a ratios 1, 2, and 6 at the applied gate voltage of 11 V, respectively. It is concluded that ferroelectric gate capacitors of MFMIS are good candidates for nondestructive readout-nonvolatile memories.

In this paper, a new small size Lateral Trench Electrode Power MOSFET is proposed. This new structure, called "LTEMOSFET"(Lateral Trench Electrode Power MOSFET), is based on the conventional MOSFET. The entire electrode of LTEMOSFET is placed in trench oxide. The forward blocking voltage of the proposed LTEMOSFET is improved by 1.6 times with that of the conventional MOSFET. The forward blocking voltage of LTEMOSFET is 250V. At the same size, a increase of the forward blocking voltage of about 1.6 times relative to the conventional MOSFET is observed by using TMA-MEDICI which is used for analyzing device characteristics. Because the electrodes of the proposed device are formed in trench oxide, the electric field in the device are crowded to trench oxide. We observed that the characteristics of the proposed device was improved by using TMA-MEDICI and that the fabrication of the proposed device is possible by using TMA-TSUPREM4.

In this work, current-voltage characteristics with time of NPT(Non-PunchThrough) IGBT is proposed during turn-on and turn-off by using analytical method. From the results, power loss at turn-off dominates the total electrical loss with respect to that at turn-on. The results have been compared with those of PSPICE and show the identical trend of power loss with each other.

Photovoltaics is considered as one of the most promising new energy technology, because its energy source is omni present, pollution-free and inexhaustive. It is agreed that these solar cells must be thin film type because thin film process is cost-efficive in the fact that it uses much less raw materials and can be continuous. The defect chalcopyrite material $CuIn_3Se_5$ has been identified as playing an essential role in efficient photovoltaic action in $CuInSe_2$-based devicesm It has been reported to be of n-type conductivity, forming a p-n junction with its p-type counterpart $CuInSe_2$. Because the most efficient cells consist of the $Cu(In,Ga)Se_2$ quarternary, knowledge of some physical properties of the Ga-containing defect chalcopyrite $Cu(In,Ga)_3Se_5$ may help us better understand the junction phenomena in such devices.

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-layer dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding $1\;{\mu}m$ in size, which could cause micro-scratch on the wafer surface. In this paper, we have studied aging effect the of CMP sin as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

The corrosion characteristics of Copper by oxidizers in Cu CMP slurry has been investigated. Key experimental variables that has been investigate are the corrosion rate by different oxidizers containing slurry of Cu CMP. Oxidizers in Cu CMP slurry reacts with Cu surfaces to raise the oxidation state of the metal via a reduction-oxidation reaction, resulting in either dissolution of the Cu or the formation of Ta surface film on the metal.[1] When Cu films were corroded adding each oxidizer, corrosion rate increased as much as higher Icorrosion. The corrosion rate of Cu was the largest as added $(NH_4)_2S_2O_8$. The higher content of Urea Hydrogen peroxide was, the higher corrosion rate was measured. Putting in tartaric acid as complexing agent, the corrosion rates of the compounds(Urea hydrogen peroxide+$H_2O_2$) are uniformly. As a result of Cu corrosion by $Cu(NO_3)_2$, the high corrosion rate was determined by even small amounts of $Cu(NO_3)_2$. Consequently, this can be explained by assuming that corrosion by oxidizers has primary effects on the removal rate of Cu and the proper oxidizer needs to be chosen in accordance with relationship of each slurry agent.

A systematic study of Cu CMP in terms of the effect of slurry chemicals(oxidizer, corrosion inhibitor, complexing agent) on the process characteristics has been performed. In acidic media, a corrosion inhibitor, benzotriazole(BTA) and tolytriazol(TTA) was used to control the removal rate and avoid isotropic etching. When complexing agent is added with $H_2O_2$ 2wt% in the slurry, a corrosion rate was presented very good. Most of in, it was appeared that BTA is possible to be replaced by TTA. The tartaric acid was distinguished for the effect among complexing agents. n we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.

A p-$CdIn_2Te_4$ single crystal has been grown by the Bridgman method without a seed crystal in a tree-stage vertical electric furnace. From photocurrent measurements, it was found that three peaks, A, B, and C, corresponded to an intrinsic transition due to the band-to-band transition from the valence band states ${\Gamma}_7(A),\;{\Gamma}_6(B),\;and\;{\Gamma}_7(C)$ to the conduction band state ${\Gamma}_6$, respectively. Also, the valence band splitting of the $CdIn_2Te_4$ crystal has been confirmed by photocurrent spectroscopy. The crystal field splitting and the spin orbit splitting were obtained to be 0.2360 and 0.1119 eV, respectively. Also, the temperature dependence of the band gap energy of the $CdIn_2Te_4$ crystal has been driven as the following equation of $E_g(T)\;=E_g(0)\;-\;(9.43\;{\times}\;10^{-3})T^2/(2676\;+\;T)$. In this equation, the Eg(0) was estimated to be 1.4750, 1.7110, and 1.8229 eV at the valence band state A, B, and C, respectively. The band gap energy of the p-$CdIn_2Te_4$ at room temperature was determined to be 1.2023 eV.

A stoichiometric mixture of evaporating materials for $CuGaSe_2$ single crystal am films was prepared from horizontal electric furnace. Using extrapolation method of X-ray diffraction patterns for the polycrystal $CuGaSe_2$, it was found tetragonal structure whose lattice constant $a_0$ and $c_0$ were $5.615\;{\AA}\;and\;11.025\;{\AA}$, respectively. To obtain the single crystal thin films, $CuGaSe_2$ mixed crystal was deposited on thoroughly etched semi-insulating GaAs(100) substrate by the hot wall epitaxy (HWE) system. The source and substrate temperatures were $610^{\circ}C$ and $450^{\circ}C$, respectively, The crystalline structure of the single crystal thin films was investigated by the photoluminescence and double crystal X-ray diffraction (DCXD). The carrier density and mobility of $CuGaSe_2$ single crystal thin films measured with Hall effect by van der Pauw method are $9.24{\times}10^{16}\;cm^{-3}$ and $295\;cm^2/V{\cdot}s$ at 293 K, respectively. The temperature dependence of the energy band gap of the $CuGaSe_2$ obtained from the absorption spectra was well described by the Varshni's relation, $E_g(T)\;:\;1.7998\;eV\;-\;(8.7489\;{\times}\;10^{-4}\;eV/K)T^2(T\;+\;335\;K)$. After the as-grown $CuGaSe_2$ single crystal thin films was annealed in Cu-, Se-, and Ga-atmospheres, the origin of point defects of $CuGaSe_2$ single crystal thin films has been investigated by the photoluminescence(PL) at 10 K. The native defects of $V_{CU}$, $V_{Se}$, $CU_{int}$, and $Se_{int}$, obtained by PL measurements were classified as a donors or accepters type. And we concluded that the heat-treatment in the Cu-atmosphere converted $CuGaSe_2$ single crystal thin films to an optical n-type. Also, we confirmed that Ga in $CuGaSe_2/GaAs$ did not form the native defects because Ga in $CuGaSe_2$ single crystal thin films existed in the form of stable bonds.

In this paper, we designed 4.5kV/1.5kA IGCT devices. GCT thyristor has many superior characteristics compared with GTO thyristor, for examples; snubberless turn-off capability, short storage time, high turn-on capability, small turn-off gate charge and low total power loss of the application system containing device and peripheral parts such as anode reactor and snubber capacitance. In this paper we designed GCT thyristor devices, and analyzed static and dynamic characteristics of GCT thyristor depending on the minority carrier lifetime, n-base thickness and doping concentration of n-base region, respectively. Especially, turn-on and turn-off characteristics are very important characteristics for GCT thyristor devices. So, we considered above characteristic for design and analysis of GCT devices.

Planar Inductively Coupled Plasma (PICP) etching of InGaP was performed in $BCl_3,\;BCl_3/Ar\;and\;BCl_3/Ne$ plasmas as a function of ICP source power ($0\;{\sim}\;500\;W$), RIE chuck power ($0\;{\sim}\;150\;W$), chamber pressure ($5\;{\sim}\;15\;mTorr$) and gas composition of $BCl_3/Ar\;and\;BCl_3/Ne$. Total gas flow was fixed at 20 sccm (standard cubic centimeter per minute). Increase of ICP source power and RIE chuck power raised etch rate of InGaP, while that of chamber pressure reduced etch rate. We also found that some addition of Ar and Ne in $BCl_3$ plasma improved etch rate of InGaP. InGaP etch rate was varied from $1580\;{\AA}/min$ with pure $BC_3\;to\;2800\;{\AA}/min$ and $4700\;{\AA}/min$ with 25 % Ar and Ne addition, respectively. Other process conditions were fixed at 300 W ICP source power, 100 W RIE chuck power and 7.5 mTorr chamber pressure. SEM (scanning electron microscopy) and AFM (atomic force microscopy) data showed vertical side wall and smooth surface of InGaP at the same condition. Proper addition of noble gases Ar and Ne (less than about 50 %) in $BCl_3$ inductively coupled plasma have resulted in not only increase of etch rate but also minimum preferential loss and smooth surface morphology by ion-assisted effect.

The vertical fountain plating system with the point contact has been used in semiconductor industry. But the plating shape in the opening of photoresist becomes gradated shape, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. So, we designed the tilted electrode ring contact to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha$-step. A photoresist was coated to a thickness of $60{\mu}m$ and vias were patterned by a contact aligner After via opening, solder layer was electroplated using the fountain plating system and the tilted electrode ring contact system. In $\alpha$-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were ${\pm}16%,\;{\pm}3.7%$ respectively. In this study, we could get high uniformity bumps by the tilted electrode ring contact system. So, tilted electrode ring contact system is expected to improve workability and yield in module process.

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical Planarization(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper depostion is a mature process from a historical point of view, but a very young process from a CMP persperspective. While copper electrodepostion has been used and stuidied for dacades, its application to Cu damascene wafer processing is only now ganing complete accptance in the semiconductor industry. The polishing mechanism of Cu CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper pasivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

In this paper, turn on characteristics of (Punch-Through Insulated Gate Bipolar Transistor) PT-IGBT has been studied. Based on the transient power loss, turn on charges first base to collector capacitance. Furthermore we present the charge variation in the base including n+ buffer layer to express the transient turn-on characteristics of the device.

The chemical mechanical polishing (CMP) has been widely accepted for the global planarization of multi-layer structures in semiconductor manufacturing However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

Chemical mechanical polishing(CMP) is an essential process in the production of copper-based chips. On this work, the stability of Hydrogen Peroxide($H_2O_2$) as oxidizer of Cu CMP slurry has been investigated. $H_2O_2$ is known as the most common oxidizer in Cu CMP slurry. Copper slowly dissolves in $H_2O_2$ solutions and the interaction of $H_2O_2$ with copper surface had been studied in the literature. Because hydrogen peroxide is a weak acid in aqueous solutions, a passivation-type slurry chemistry could be achieved only with pH buffered solution.[1] Moreover, $H_2O_2$ is so unstable that its stabilization is needed using as oxidizer. As adding KOH as pH buffering agent, stability of $H_2O_2$ decreased. However, stability went up with putting in small amount of BTA as film forming agent. There was no difference of $H_2O_2$ stability between KOH and TMAH at same pH. On the other hand, $H_2O_2$ dispersion of TMAH is lower than that of KOH. Furthermore, adding $H_2O_2$ in slurry in advance of bead milling lead to better stability than adding after bead milling. Generally, various solutions of phosphoric acids result in a higher stability. Using Alumina C as abrasive was good at stabilizing for $H_2O_2$; moreover, better stability was gotten by adding $H_3PO_4$.

Sing1e crystal $CuAlSe_2$ layers were grown on thoroughly etched semi-insulating GaAs(100) substrate at $410^{\circ}C$ with hot wall epitaxy (HWE) system by evaporating $CuAlSe_2$source at $680^{\circ}C$. The crystalline structure of the single crystal thin films was investigated by the photoluminescence(PL) and double crystal X-ray diffraction (DCXD). The carrier density and mobility of single crystal $CuAlSe_2$ thin films measured with Hall effect by van der Pauw method are $9.24{\times}10^{16}\;cm^{-3}$ and $295\;cm^2/V{\cdot}\;s$ at 293 K, respectively. The temperature dependence of the energy band gap of the $CuAlSe_2$ obtained from the absorption spectra was well described by the Varshni's relation, $E_g(T)\;=\;2.8382\;eV\;-\;(8.86\;{\times}\;10^{-4}\;eV/K)T^2/(T\;+\;155K)$. After the as-grown single crystal $CuAlSe_2$ thin films were annealed in Cu-, Se-, and Al-atmospheres, the origin of point defects of single crystal $CuAlSe_2$ thin films has been investigated by PL at 10 K. The native defects of $V_{Cd}$, $V_{Se}$, $Cd_{int}$, and $Se_{int}$ obtained by PL measurements were classified as donors or accepters. And we concluded that the heat-treatment in the Cu-atmosphere converted single crystal $CuAlSe_2$ thin films to an optical n-type. Also, we confirmed that Al in $CuAlSe_2/GaAs$ did not form the native defects because Al in single crystal $CuAlSe_2$ thin films existed in the form of stable bonds.

For the first time, the new dual trench gate Emitter Switched Thyristor is proposed for eliminating snap-back effect which leads to a lot of serious problems of device applications. Also, the parasitic thyristor that is inherent in the conventional EST is completely eliminated in the proposed EST structure, allowing higher maximum controllable current densities for ESTs. Moreover, the new dual trench gate allows homogenous current distribution throughout device and preserves the unique feature of the gate controlled current saturation of the thyristor current. The conventional EST exhibits snap-back with the anode voltage and current density 2.73V and $354/{\S}^2$, respectively. But the proposed EST exhibits snap-back with the anode voltage and current density 0.93V and $58A/{\S}^2$, respectively. Saturation current density of the proposed EST at anode voltage 6.11V is $3797A/{\S}^2$. The characteristics of 700V forward blocking of the proposed EST obtained from two dimensional numerical simulations (MEDICI) is described and compared with that of the conventional EST.

4H-SiC un diodes with field limiting rings(FLRs) were fabricated and characterized. The dependences of reverse breakdown voltage on the number of FLRs, the distance between p-base main junction and first FLR, and activation temperatures, were investigated. Al and B ions were implanted and activated at high temperature to form p-base region and p+ region in the n-epilayer. We have obtained up to 1782V of reverse breakdown voltage in the un diode with two FLRs on loom thick epilayer. The differential on-resistances of the fabricated diode are $5.3m{\Omega}cm^2$ at $100A/cm^2$ and $2.7m{\Omega}cm^2$ at $1kA/cm^2$, respectively. All pn diodes with FLRs have higher avalanche breakdown voltages than that of diode without an FLR. Regardless of the activation temperature, the un diode with a FLR located 5um apart from main junction has the highest mean breakdown voltage around 1600V among the diodes with one ring. On the other hand, the pn diode with two rings showed different behavior with activation temperature. It reveals that high voltage SiC pn diodes with low on-resistance can be fabricated by using the FLR edge termination.

Etching characteristics of (Pb,Sr)$TiO_3$(PST) thin films were investigated using inductively coupled chlorine based plasma system as functions of gas mixing ratio, RF power and DC bias voltage. It was found that increasing of Ar content in gas mixture lead to sufficient increasing of etch rate and selectivity of PST to Pt. The maximum etch rate of PST film is $562\;{\AA}$/min and the selectivity of PST film to Pt is 0.8 at $Cl_2/(Cl_2+Ar)$ of 20 %. It was proposed that sputter etching is dominant etching mechanism while the contribution of chemical reaction is relatively low due to low volatility of etching products.

Among the ferroeletric thin films that have been widely investigated for ferroelectric random access memory (FRAM) applications, the $SrBi_2Ta_2O_9$ (SBT) thin film is appropriate as a memory capacitor material due to its excellent fatigue endurance. SBT thin films were etched in high-density $Cl_2/Ar$ in inductively coupled plasma. The maximum etch rate of SBT film is $1834\;{\AA}/min$ under $Cl_2/(Cl_2+Ar)$ of 30 %, rf power of 700 W, dc-bias voltage of -250 V, chamber pressure of 11 mTorr and gas flow rate of 20 sccm.

최근 활발하게 연구가 진행되고 있는 마이크로 인덕터는 자기 데이터 저장을 위한 헤드, 자기장 센서, 마이크로 변압기와 휴대폰의 수동 소자와 같은 다양한 분야에 이용되고 있다. 마이크로 인덕터를 제작하기 위해 UV-LIGA 공정을 개발하였다. 도금 공정을 이용하여 마이크로 인덕터의 철심과 구리선 제작하였다. 도금 공정을 위해 필요한 마이크로 몰드는 여러 종류의 thick photoresist를 이용하여 저응력 공정으로 제작하였다. 도금 공정을 이용하여 toroid형 마이크로 인덕터를 제작하였다. 도금 공정에서 발생 할 수 있는 응력을 최소화할 수 있는 공정을 개발하였다.

[ $Si_3N_4$ ] thin film is the good material to fabricate the capacitors at MMIC processes. Normally, $Si_3N_4$ thin films is used to dielectric in the MIM capacitor and film thickness is $2000\;{\AA}$. Insulator(or dielectric) was deposited by PECVD at our MIM structure with air bridge which connect between top metal and contact pad. We optimized PECVD process to fabricate the good capacitors which can be applied at the true MMIC. The thickness of our $Si_3N_4$ thin films was $1000\;{\AA}$ shallower than $2000\;{\AA}$, and their breakdown voltages were above 70V.

There is a growing need for a nonvolatile memory technology with faster speed than existing nonvolatile memories. We studied of phase-change according to temperature and voltage in chalcogenide thin film base on $Ge_2Sb_2Te_5$. Searching for Tg(Glass transition temperature) temperature controlled on hotplate with RT quenching. We measure I-V characteristic through out bottom electrode(ITO) and top electrode(Al) between $Ge_2Sb_2Te_5$. And compared with I-V characteristics after impress the variable stress.

[ $TiO_2$ ] thin films were fabricated by DC magnetron sputtering system at by controlling deposition times, ratios of $Ar:O_2$ partial presser ratio and substrate conditions. And the surface, cross-section morphology, microstructure, and composition ratio of the films were analyzed by FE-SEM, TEM and XPS. Besides, the optical absorption and transmittance of the $TiO_2$ films were measured by a UV-VIS-NIR Spectrophotometer, and photocatalytic properties were studied by G C Analyzer & Data Analysis system. As the result, when $TiO_2$ thin film was made at deposition time of 120[min] and $Ar:O_2$ ratio of 60:40, the best structural and optical properties among many thin films could be accepted. The best results of properties were as follows: thickness; $360{\sim}370[nm]$, grain size; 40[m], gap between two peak binding energy, $5.8{\pm}0.05[eV]$ ($2p_{3/2}$ peak and $2p_{1/2}$ peak of Ti was show at $458.3{\pm}0.05[eV]$ and $464.1{\pm}0.05[eV]$ respectively), binding energy; $530{\pm}0.05\;[eV]$, opticalenergy band gap; 3.4[eV].

We have investigated the microstructural analysis of epitaxial lateral overgrowth (ELO), pendeoepitaxy (PE), and superlattice structures used as technology for the reduction of structural defects like dislocation in nitride semiconductors using transmission electron microscopy. We confirmed that the regrowth process such as ELO and PE is very effective technique on the reduction of threading dislocation (less than $10^6/cm^2$) in the specific area. However, to decrease the defect density in the whole nitride films and the suppress the generation of defect by regrowth, we should find the optimized conditions. Besides, the process using double PE and AlGaN/GaN superlattice structure showed no effect on the defect reduction up to now.

In this paper, the stress induced leakage currents of thin silicon oxides is investigated in the ULSI implementation with nano structure transistors. The stress and transient currents associated with the on and off time of applied voltage were used to measure the distribution of high voltage stress induced traps in thin silicon oxide films. The stress and transient currents were due to the charging and discharging of traps generated by high stress voltage in the silicon oxides. The transient current was caused by the tunnel charging and discharging of the stress generated traps nearby two interfaces. The stress induced leakage current will affect data retention in electrically erasable programmable read only memories. The oxide current for the thickness dependence of stress current, transient current, and stress induced leakage currents has been measured in oxides with thicknesses between $113.4{\AA}$ and $814{\AA}$, which have the gate area 10-3cm2. The stress induced leakage currents will affect data retention and the stress current, transient current is used to estimate to fundamental limitations on oxide thicknesses.

최근 초고압 케이블 절연체로 XLPE(가교 폴리에틸렌)이 널리 사용되어 지면서 XLPE의 여러 물리 화학적 특성에 따른 절연 성능에 관한 연구가 활발히 이루어지고 있다. 이러한 XLPE 절연층은 제조과정에서 압출과정을 거쳐 도체를 감싸게 되는데 이 과정에서 흐름 패턴으로 나타나는 비등방성(anisotropy)을 띠게된다. 본 논문에서는 초고압 XLPE 케이블에서 시계 방향으로 나타나는 비등방성(anisotropy)이 나타내는 기계-전기적 특성을 인장강도(tensile strength), 트리 개시전압 및 개시시간을 측정한 결과를 토대로 고찰해 보았으며, 이러한 비등방성이 초고압 XLPE 케이블의 절연 성능에 영향을 주는 인자로 고려되어야 함을 알 수 있었다.

FRP has been used widely for insulator. FRP consists of fiber and resin. The fiber contributes the high strength and modulus to the composite. The fiber orientation in FRP has a great effect on the strength of FRP because the strength of FRP mainly depends on the strength of fiber. In this study, FRP was made unidirectionally by pultrusion method. Outer part of the FRP was made by filament winding method to give fiber orientation to the FRP. And outer part of FRP was also made by wrapping method. The bending strength and bending stresses of FRP rods were simulated according to the winding orientation of glass fiber. The bending strength of FRP was also evaluated. The results of simulation and evaluation were compared each other to investigate main stresses which affect the fracture of FRP. The main stresses which had a great effect on the strength of FRP were shear stresses. Bending strength of the FRP was different with the winding angle. The bending strength of $15^{\circ}$ winded FRP was the highest.

Recently, with the rapid growth of industry, environmental condition became worse. With the mix of the various contaminants, such as, salts, dust and industrial pollutants, synergy effect could be happened. So, many researches have been focused on the issue. The cause of natural accident could be classified as, lightning, rainstorm and contamination. However, the accident by contamination influences on the larger area than that by lightning, and, in the case of rapid contamination, it takes a shorter time than rainstorm. The salt contaminant is one of the most representative pollutants, and known as the main source of the accident by contamination. So, in this investigation we make a research on the prediction of contamination degree through the relationship analysis between the climatic factor and ESDD.

All objects with some temperature above absolute zero radiate in the infrared. The intensity of the infrared radiated from a object defends on the condition and temperature on the surface of the one. The present, these techniques are frequently adopted into diagnosis for electricity equipments. Simply, however, the applied techniques are passive thermal testing for the detection of loosened terminals and overcurrent. In this paper, a infrared thermal imager was applied to high voltage windings of cast resin transformers, and the accumulated value of the result temperatures was used for evaluating remained lifetime of them. At each aging level, dielectric loss tangent test was carried out. The results offered capabilities for deciding the condition of the transformers suffering difficulties to diagnose.

For this research, we developed the hardware and software of the measurement system for on-line test and evaluation. The software controls the hardware of the measurement data and acts as interface between users and the system hardware. In this paper, we is studied for temperature measurement of main transformer. In order to this test is developed measurement system. Using this system, we obtained important result for main transformer temperature.

[ $ZrO_2$ ] dielectric layers were grown on the p-type Si (100) substrate by metalorganic molecular beam epitaxy(MOMBE). Zrconium t-butoxide, $Zr(O{\cdot}t-C_4H_9)_4$ was used as a Zr precursor and Argon gas was used as a carrier gas. The thickness of the layers was measured by scanning electron microscopy (SEM) and the properties of the $ZrO_2$ layers were evaluated by X-ray diffraction, high frequency capacitance-voltage measurement. and HF C-V measurements have shown that $ZrO_2$ layer grown by MOMBE has a high dielectric constant (k=18-19). The growth rate is affected by various process variables such as substrate temperature, bubbler temperature, Ar, and $O_2$ gas flows.

Polychloroprene(CR) is well known as elastomer commonly utilized in the electrical. It is mainly used for cable jacket and insulator. The irradiation degradation property of polymer materials is very important to prevent unexpected accidents in the Nuclear Power Plant(NPP). The irradiation degradation is caused by the oxidation of polymer materials, and this oxidation is occurred by oxygen radical produced from air. In this study, we evaluate the oxidation properties of CR. CR is irradiated for 200, 400, 600, 1000 kGy radiation dose. The oxidation properties of irradiated CR are investigated by differential scanning calorimetry, dynamic mechanical properties and FT-IR/ATR. Glass transition temperature(Tg), decomposition onset temperature(DOT), loss modulus and mechanical tan $\delta$ values are compared together. The irradiation limit of CR in the NPP, is known for 500 kGy, and this is exactly matched with investigated results.

In this paper, we present the properties of water absorption of elastic epoxy for high voltage. The ratio of water absorption shows linearly increase according to ${\sqrt}t$ till 66 hours. And rigid epoxy is 0.053 [%], elastic epoxy at addictives 35 [phr] is 0.309 and it at addictives 70 [phr] is 0.44 [%]. The reason where absorption of elastic epoxy is high is because of micro void. It can be confirmed by SEM analysis. Dieletric constant increased linearly by addictives' concentration and tans is also increased by addictives' concentration.

In this paper, we analyzed on the characteristics of the stranded wire disconnected by bending stress. The stranded wire that used in the experiment are PVC insulated flexible cords(VCTFK) of $0.75mm^2,\;1.25mm^2,\;and\;2.0mm^2$. They are used to connect the load in low voltage. The stranded wires disconnected by bending stress were magnified with optical microscope. Using X-ray, the disconnected wire were photographed. we compared mechanical characteristics of the stranded wire between disconnected tendency and allowable current. On the mechanical strength of vinyl captyre ellipse type cords under bending stress, $1.25mm^2$ VCTFK was the strongest of them. When it was bended $826.3{\pm}7\;times$, it appeared the disconnected tendency that element wires of $1.25mm^2$ VCTFK are more about 1.67 times than element wires of $0.75mm^2$ VCTFK. In mechanical strength, $1.25mm^2$ VCTFK is higher about 1.7 times than $0.75mm^2$ VCTFK. Therefore, we found out that mechanical strength will be higher, if element wire is a lot. In comparison with bending stress, $1.25mm^2$ VCTFK is the strongest among samples, and then it is the most useful in wires of movable type.

Fault of under ground power cable occurs usually from the water tree such as the vented tree, the bow tree and the water-rich halo. The water tree penetrates to the polyethylene cable insulations. Sometimes, the water tree also diffuses to mother cable in the substation. In this paper, instead of replacement of the faulty cable, we tried to cure an electrical power cable degraded by the water trees with silicon injection method. And measured the results with the isothermal relaxation current analysis method. After cable cure, Chonil line was improved from 2.27 to 1.96 in a phase, from 2.148 to 2.020 in b phase, and from badness to 2.192 in c phase. And Keumam line was also improved from 2.419 to 1.920 in a phase, from 2.301 to 2.000 in b phase, and from badness to 1.957 in c phase.

In this paper, insulating varnish has been used for field magnet and armature impregnated insulating material of electric locomotive and traction motor. When it was duplicated coating, it could be accuse internal void, and which could change electrical characteristics. We used to boundary elemental method of simulation tool, and improved optimal insulating design of insulating varnish according to measuring electric distribution in void of specimen.

Polyethylene used as insulating material of power cable is nonpolar and low dielectric loss polymer. But it has defects of tree generation and accumulation of space charge by an applied voltage resulting in the decreased life and performance. To solve these problems, mixed films with LLDPE and EVA that is similar to LLDPE at physical properties in case of low VA contents were made and tested due to the blend ratios of 80:20, 70:30, 60:40 and 50:50[wt%] respectively. We investigated AC electrical treeing characteristics to acquire the best mixture ratio and effect of the tip radius of needle electrode to develop excellent treeproof materials. The degree of crystallity calculated with XRD pattern is higher for pure LLDPE, 50:50 and 70:30. For DSC analysis, it is confirmed that the melting points of mixed specimens are lower than that of pure LLDPE and higher than pure EVA's. The shape of tree propagation showed that pure EVA was electrical tree shape of the branch type, pure LLDPE and blended specimens was able to confirm tree shape of the bush type. As the tip radius go up in the blend ratio 70:30 specimen, the tree inception voltage rise. Probably the reason is the relaxation of electric field in the specimen with bigger tip ratio. As the 6 specimens were applied AC 5[KV],7.5[KV],10[KV] respectively, tree growth length is far shorter in the specimen with blend ratio 70:30, 50:50 than in pure EVA and pure LLDPE specimen. Conclusively, it is confirmed that specimens of which blend ratio are 70:30 and 50:50 are good in electrical tree retardant characteristics, especially, 70:30 has lower dielectric loss than 50:50 and its mixture ratio is the best.

Recently polymer insulators are being used for outdoor high voltage applications. Polymer insulators have significant advantages over porcelain and glass insulators. With the gradual improvement of their design and material, their reliability has also increased. It is however difficult to establish how they will perform after several years of service. Aging of the insulator weathershed may lead to damages such as excessive chalking and crazing, erosion and tracking which affect the insulator performance. In service insulator are subjected to aging stresses such as humidity, pollution and electrical field which act singly or in combination. There have been numerous accelerated laboratory tests developed with the intention of evaluating suitability of polymeric materials. Some of these are strictly material tests, where as, others evaluate full scale devices. Service experience plays a key role in the utility selection of polymer insulator, but is time consuming, and may not always be available. Hence there is a need for a meaningful and reliable accelerated aging test for polymer insulator. This paper describes multi-stress aging test for reliability of polymer insulator This paper presents the rule of multi-stress aging test and test chamber for polymer insulator in korea electrotechnology research institute.

Radiation degradation of Poly(ether ether ketone) (PEEK) has been studied by dielectric analysis and dynamic mechanical analysis. It has been observed that dielectric properties are influenced by radiation degradation of PEEK. For radiation degradation of PEEK, dynamic mechanical properties were insensible.

In this paper, we experimented on the deterioration process of power supply cords and analyzed the heating temperature of each part of those cords. We also analyzed the surface states, metallurgical structures surface structures and compositions of the wire melted by over-current. In the results of the analyses, the covering began to be deteriorated from the inside. The heating temperature of extension cord was higher than that of plug body. The dendrite structures appeared at the melted wire. By the SEM and EDS analyses, the dendrite structure showed the growth of copper oxide. We found out the characteristics of PVC insulated flexible cords by over-current from the above experiments and analyses. These results may be useful data in the analyses of deterioration causes of power supply cords.

Electrical characteristic of tracking resistance, volume resistance, insulation breaking strength etc. and mechanical characteristic are required to high voltage insulation insulator silicone rubber. Tracking resistance is adding much ATH to improve tracking resistance as the most important factor among them. But, there is problem that mechanical strength grows worse rapidly adding much ATH. Therefore, this research studied effect that flame retardant gets to tracking resistance during factor that influence to tracking resistance.

In order to manufacture ceramic capacitors for the industrial electronic parts application using Tape casting method, the dielectric properties as a functions of sintering temperatures and the fabrication conditions of green sheet were investigated to consider the possibility of applications. When the mixing ratio of powder and solvent in slurry was 65:35, the uniform and dense green sheets was obtained. The dielectric constant was increased as the sintering temperature Over 94% of relative density and high were obtained to the specimens sintered at $1000^{\circ}C$. We can find that the device sintered at higher temperature than $1000^{\circ}C$ showed the relative density over 94% and the dielectric constant over 2000.

The accidnet of breaking insulator rod leads to inturruption of moving the subway. We investigate the analysis of analysis of breaking accident of FRP insulator rod installed in dead section for catenary feeding system. To analysis of accident reason, SEM is used to analysis microscopic struture on surface of cross section of broken FRP insulator rod. At the same time, we examine the chage of atomic amount on solace of accident insulator through EDX analysis. Also, the test for tensional breaking load is condoled to check the mechanical strength.

In this paper, the $\Phi$-q-n pattern and average discharge power of silicone rubber have investigated effect of inter impurities. It's changed impurities by silicone oil, water and copper. Applied voltage is AC 3, 4, 4.5, 5, 5.5[kV]. And data acquisition time is 10 second(600 cycles). These results suggest that partial discharge(PD) is shower negative polar than positive polar at 3[kV]. Positive polar's PD value increased with increase of applied voltage. The Conductivities expressed same $\Phi$-q-n pattern in positive polar and negative polar at phase region.

In this paper, we have investigated the physical, dielectric and electrical conduction properties of polyethylene terephthalate(PET) film due to temperature variation. From FT-IR spectrum as an analysis of physical properties, the strong absorption in wavenumber 1019[$cm^{-1}$], 1266[$cm^{-1}$], and 1752[$cm^{-1}$] observed by the C=O and benzene ring. the characteristics of volume resistivity used to highmegohm meter is measured from 1 to 10 minutes when the specimen applied the voltage according to the step voltage appling method. and dielectric characteristics were measured in the temperature range from room temperature to 120[$^{\circ}C$] due to frequency variation.. also we measured in the voltage rang of 1[V] to 20[V] according to the voltage application method.

Polymeric suspended insulators for subway and electrical track line had been designed and manufactured. The main elements to design polymeric insulators were the insulation ability and the optimal structure. To get the insulation ability, electrical and mechanical tests according to standards had done on housing rubbers and FRP cores and selected the sample with best properties as a insulator. The insulator shape and fitting parts with minimum electrical stress was simulated by FEM electrical field analysis program. The manufactured insulator set had been tested and estimated the electrical and mechanical according to ES and KS, and showed good characteristics in these tests.

A new measurement system was developed by fault diagnosis system for traction motor using current signal analysis. The motor current signature analysis method is used for traction motor fault diagnosis. The diagnosis system program is constructed by artificial neural networks algorithm, those results from the program are used to train neural networks. The trained neural networks have the ability to compute adaptive results for non-trained inputs, and to calculate very fast due to original parallel structure of neural networks with high accuracy within destined tolerance. This system suggested that available test for checking, the probable extent of aging, and the rate of which aging is taking place.

기존 애자형 피뢰기의 문제점인 폭발 및 비산으로부터 보다 안전하여 최근 각광을 받고 있는 폴리머 피뢰기에서 필라멘트 와인딩을 망사형 구조로 제작하고 제작된 필라멘트에 실리콘 하우징을 단일 사출 성형한 구조로 시료를 제작하여 기밀특성 및 방압특성에 대해 검증하였다. 시험결과로 제시된 자료는 추후, 제품의 양산 및 현장 적용에 많은 도움을 줄 것으로 사료된다.

The effect of heat treatment on torsion characteristics of high nitrogen steel wire has been studied by using torsion test, micro vickers hardness and scanning electron microscopy. After heat treatment at $600{\sim}700^{\circ}C$, the torsion cycle was increased with increasing temperature. Especially, in case of high nitrogen steel wire heat treated at $600^{\circ}C$, the torsion cycle was sharply increased. It is estimated that the cold-worked high nitrogen steel wire started to recrystallize around at $650^{\circ}C$ in air atmosphere.

Quench behavior of resistive superconducting fault current limiters (SFCLs) with various pattern shapes was investigated. The pattern shapes employed were meander, bi-spiral, and spiral shapes of identical line width, gap and margin. SFCLs were fabricated from YBCO thin films grown on two-inch diameter $Al_2O_3$ substrates under the same conditions. Resistance rise of current limiting elements was low at a spiral shape before the whole quench completion, which may act as a disadvantage for simultaneous quench in serial connection between current limiting elements, but the temperature tended to have similar values at higher voltages. On the other hand, bi-spiral shape was severe at insulation level between current limiting lines. When these aspects were considered, we concluded that a meander shape was appropriate to design for a resistive SFCL based on thin films except the concentration of electric field at edge areas of strip lines.

YIG(Yttrium Iron Garnet) is one of the most widely used ferrites for microwave telecommunication. It used as a passive devices such as isolators and circulators. In order to reduce the insertion losses of these passive devices, it is very important to reduce magnetic loss of the ferrites. In general, the magnetic losses of ferrites is closely related to the microstructure of the ceramics. In the sintering of YIG, pores are easily trapped in grains and grain boundaries. These pores cause to increase magnetic losses of the sinterted bodies. In this paper, the effect of the $SiO_2$ addition on the microstructure was discussed. Increasing the $SiO_2$ addition, the grain size was reduced, which means that added acts as a grain-growth inhibitor. During the sintering, $SiO_2$ settled down on the grain boundaries, and drag the grain growth. Therefore, there is enough time for pores to move out. The relative density of YIG sintered at $1350^{\circ}C$ with 1 mol% $SiO_2$ addition was 99.6%. $\Delta$H of these samples was under 50 Oe.

This study was investigated to fabricate the porcelain materials with high magnetic characteristics. The high characteristics of the magnetic porcelain materials were achieved at the following conditions; powder sizes of isotropic Sr-ferrites with $1{\sim}2\;mm$ and magnetic powder infraction of 30 wt%. The magnetic tea cups with 3-mm-thick at the optimum conditions indicated the high magnetic characteristics such as the surface flux density of 178 G, the remanent flux density of 240 G, and the intrinsic coercivity of 3910 Oe.

Mn-Zn 페라이트의 자심재료가 전자기 부품용 응용될 때, 소형화와 고효율화를 이루기 위한 공정변수에 따른 전자기적 특성변화를 고찰하였다. ZnO 의 몰비가 11 mole일 때, 가장 우수한 특성을 나타내었으며, $SiO_2$와 CaO는 입계 저항층 형성을 통한 손실을 감소시키고, 이로 인해 성능지수는 증가하여 $100\;kHz\;{\sim}\;200\;kHz$ 범위에서 최대값을 나타내어 전자기적 효율이 극대화되었다. 산소분압의 제어는 승온과정부터 산소분압을 제어시켜주어야만 Zn-loss 현상의 증가와 $Fe^{2+}$ 이온 농도의 감소 및 $Fe^{2+}-\;Fe^{3+}$ 이온간의 호핑(hoping)현상 등에 의한 손실을 최소화할 수 있으며, 높은 투자율을 얻을 수 있었다. 그리고 소결 또는 냉각 중 평형 산소분압이 유지되지 못하면 다량의 결함이 출현하게 되고, 특히 $600^{\circ}C$ 이하에서 스피넬 상의 분해-산화반응이 일어나면서 미세구조 상에 결함으로 남게 되어 전자기적 특성이 저하되었다.

The principle of the superconducting vortex flow transistor (SVFT) is based on control of the Abrikosov vortex flowing along a channel. The induced voltage is controlled by a bias current and a control current, instead of external magnetic field. The device is composed of parallel weak links with a nearby current control line. We explained the process to get an I-V characteristic equation and described the method to induce the external and internal magnetic field by the Biot-Savarts law in this paper. The equation can be used to predict the I-V curves for fabricated device. From the equation we demonstrated that the current-voltage characteristics were changed with input parameters. I-V characteristics were simulated to analyze a SVFT with multi-channel by a Matlab program.

We prepared $Co_{77}Cr_{20}Ta_3$ Magnetic layer for perpendicular magnetic recording media with introduce Two-step methode and Amorphous Si Underlayer on slide glass substrate. The thickness of magnetic layer were 100nm, and Underlayer were varied from 5 to 100 nm. The multi layer Properties of crystal structure were examined with XRD. Prepared thin films showed improvement of dispersion angle of c-axis orientation ${\Delta}{\theta}_{50}$ caused by inserting Buffer-layer and amorphous Si underlayer.

금속유기물 용액 증착법(MOD)법은 금속유기물 용액을 스핀 코팅하여 고온 열처리를 통해 대면적의 고온 초전도 박막을 만들 수 있으며, 고가의 진공 시스템이 필요하지 않기 때문에 매우 경제적인 박막 증착 방법이다. 본 연구에서는 MOD법을 이용해서 고온초전도체 마이크로파 필터나 터널접합 소자와 같은 전자 소자 응용 연구를 위해 요구되는 높은 임계전류 특성을 갖도록 박막 성장 조건을 변화시켜서 제작된 고온 초전도체 Bi2Sr2CaCu2O8+d (BSCCO2212) 박막을 제작하였다. 박막 특성은 x-ray diffraction (XRD), scanning electron microscope (SEM)으로 표면적, 구조적 특성을 관찰하고 저항-온도 (R-T) 변화 및 전류-전압 (I-V) 특성 측정을 통해 전기적 특성을 연구하여 임계전류를 향상 시킬 수 있는 박막제작 조건에 관해 논의하였다.

The submicron $YBa_2Cu_3O_x$ powder was prepared by the sol-gel method. The particle size is distributed from 0.2 to $1.0\;{\mu}m$, which benefits to eliminate the micro-cracks formed in the $YBa_2Cu_3O_x$ films deposited by electrophoresis. The powder was single phase of $YBa_2Cu_3O_x$ examined by X-ray diffraction. In the sol-gel process the citrate gel was formed from citric acid and nitrate solution of $Y_2O_3$, $Ba(NO_3)O_2$ and CuO. When pH values were adjusted to $6.4{\sim}6.7,\;Ba(NO_3)O_2$ could be dissolved in the citrate solution completely. Appropriate evaporative temperature of the sol-gel formation is discussed. After the heat treatment the transition temperature($T_c$) and critical current density($J_c$) of the $YBa_2Cu_3O_x$ samples made of the submicron powder were measured.

본 연구는 고온 초전도 자속 흐름 트랜지스터의 채널 식각 두께에 따른 임계 특성의 자동 측정을 위해 나노옴/마이크로 볼트 미터 와 전원공급기 등 측정에 필요한 장비들을 GPIB 인터페이스 보드를 통해 PC와 연결하여 측정 장치를 구축후 직접 제작한 측정 프로그램을 통해 자동으로 시편에 전류, 전압을 가한후 임계 특성값을 효율적인 방법으로 측정하고 측정 결과값들을 시간순서 및 측정 대상에 따라 데이터 베이스화 하는 방법에 대하여 소개한다. 부수적으로 임계 특성의 정확한 측정을 위해 실험에 변수가 되는 요소들을 찾아내고 실험 데이터값들로부터 오차를 발견, 오차의 원인이 되는 식각 방법 및 실험 환경등의 부가적인 요소들을 고려하여 개선된 측정 장치를 구축하는데 경제적, 시간적인 효율성 측면에 대해 언급했다.

2세대 초전도 선재로 알려져 있는 $YBa_2Cu_3O_{7-\delta}$ coated conductor는 금속모재/완충층/초전도층/보호층의 구조를 가진다. 2개 이상의 산화물 다층 박막으로 이루어진 완충층은 금속기판의 집합조직을 초전도층까지 전달하는 역할, 금속기판의 금속이 초전도층으로 확산되어 초전도층의 전기적 특성을 열화시키는 것을 막아주는 확산장벽으로의 역할 등을 수행한다. 1차 완충층은 금속기판의 집합조직을 유지하여야하며, 금속기판의 산화를 방지하면서 증착 되어야 한다. coated conductor 제조를 위한 첫 단계로 Pulsed Laser Deposition법을 이용하여 cube texture된 Ni 기판 위에 $Y_2O_3$ 박막을 증착 하였다. 최적의 증착 조건을 찾기 위해 증착 챔버의 산소 및 $H_2/Ar$ 혼합가스 분압과 기판온도를 변화시키면서 증착 하였다. $Y_2O_3$층의 (100) 집합조직은 기판온도 $600{\sim}700^{\circ}C$와 산소 분압 $0.01{\sim}0.1mTorr$에서 증착된 Y2O3 박막에서 금속기판과 유사한 집합조직을 얻을 수 있었다. 최적의 증착 조건에서 $Y_2O_3$ (222) ${\Phi}-scan$의 full width at half maximum (fwhm)이 $11^{\circ}$이고 (400) ${\omega}-scan$ fwhm은 $6^{\circ}$이었다.

전력선 통신용 LC 공진필터에 사용되는 Ni-Zn 페라이트를 제조하기 위해 Ni0.8Zn0.2Fe2O4를 기본조성으로 선택하고 x (Co mol 비)를 변화시켜 전자기적 특성을 조사하였다. $Bi_2O_3$ CaO가 첨가됨으로써 균일한 입자성장과 입계에 고저항층이 형성되어 주파수 손실이 감소하였으며, $Ni_{0.8-x}Zn_{0.2}Co_xFe_2O_{\delta}$의 기본조성에 Co의 함량을 증가시키면 x = 0.05에서 투자율 75, 공진주파수 20 MHz의 특성을 나타내고 결정 입자 크기와 같은 구조적 특성에는 영향을 거의 미치지 않지만 자기이방성 변화에 따라 전자기적 특성에는 영향을 미친다. 또한, $Ni_{0.75}Zn_{0.2}Co_{0.05}Fe_2O_{4.017}$ 조성의 페라이트 코어의 발열량은 큐리온도 이하에서 일어난다.

HTS superconducting tapes are now commercially available for practical applications such as magnets and cables. Since superconductors in such applications are subjected to high mechanical loads that can significantly degrade the superconducting properties, mechanical properties and the strain tolerance known as the strain effect on superconducting properties are needed to be estimated for developing superconducting devices. Influences of loading mode on the Ic degradation and the interaction on strain effect were discussed in this study.

The magnetostriction of FeCoGe/phenol composites, which is one of the magnetostrictive materials, measured at the external magnetic field. The measurement was carried out using the electrical-resistance strain gage, the wheaten's Bridge for eliminating the unnecessary voltage, and the lock-in-amp for signal amplification and noise filtering. When the external magnetic field was applied in the longitudinal the samples, the maximum strain of 120ppm was taken with regard to the 10wt.% phenol composite. This results indicate that the FeCoGe/phenol composites can be useful as an actuator because it has larger stain than the other solid state actuators such as piezo electric materials.

The phase differences and noise signals are in general serious on output of a instrumentation amplifier for signal conditioning of a sensor driven at high frequency due to a time-varying input signal. In this study, we get the better amplification and S/N ratio using the rectified signal for the input of instrumentation amplifier. This driving circuits were designed and constructed by OrCAD and laboratory PCB process. All of the elements used on the circuit including highly speedy OP-Amp. was SMD type and the MI sensor was fabricated by meander-patterned amorphous ribbon. The output sensitivity of this circuit was $105.3mV/V{\cdot}Oe$. That's why this driving circuit is good at detection of fine magnetic field.

Bi-2223 superconducting wires were fabricated by stacking, drawing process with different precursor powders and different heat-treatment histories. The precursor powders were 2 kinds of Pb content. And a part of the tapes were experienced pre-annealing process which caused tetragonal structure of Bi-2212 phase to orthorhombic structure of it was during drawing process. We confirmed the transformation of Bi-2212 phase from tetragonal structure to orthorhombic structure and reduction of second phases. AC magnetization analysis were performed in order to investigate the fraction of Bi-2223 phase in Bi-2223/Ag HTS tape. The cross sections of 55 filaments and 61 filaments were investigated after rolled in order to understand deformation mechanism of superconducting cores. We could achieve best Ic of 70 A class at the Bi-2223/Ag tape using low Pb content of precursor powder and experienced pre-annealing process. AC magnetization analysis was useful to investigate the fraction of Bi-2223 phase in the Bi-2223/Ag tape.

One important issue in the design and the optimization for conductor of a superconducting cable is the control of the current distribution flowing at each layers. In this paper, we calculated the self inductance of each layer and the mutual inductance between two layers from the magnetic field energy and investigated the effects of design parameters on the self and mutual inductances for 4-layer conductors with transport current distribution at each layer.

A proposed way to prepare $YBa_2Cu_3O_y$ wires or tapes is that Ag is used as substrate and melting point of $YBa_2Cu_3O_y$ is decreased to lower than the melting point of silver ($961\;^{\circ}C$). Therefore after the deposition of $YBa_2Cu_3O_y$ film on Ag substrate, the heat treatment can be carried out below the Ag melting point. Silver (Ag) and Lead oxide(PbO) were selected to be additives for $YBa_2Cu_3O_y$. Different Ag and PbO contents were added in $YBa_2Cu_3O_y$, the melting points of which were measured by DTA. In order to guarantee that the superconductivity of $YBa_2Cu_3O_y$ was not reduced after Ag and PbO added into $YBa_2Cu_3O_y$, their superconductivities were measured. It is proved that as additives, both Ag and PbO can reduce the melting point of $YBa_2Cu_3O_y$. For Ag doped $YBa_2Cu_3O_y$, $T_c$ is about 93K and ${\Delta}Tc$ is $2{\sim}3K$. For PbO doped $YBa_2Cu_3O_y$, $T_c$ is $88K{\sim}92K$ and ${\Delta}T_c$ is $11{\sim}12K$. When 10 wt% of Ag and 10 wt% PbO were added in $YBa_2Cu_3O_y$, the melting point of the mixture of $YBa_2Cu_3O_y$ (80 wt%), Ag (10 wt%) and PbO (l0 wt%) is $943^{\circ}C$. The transition temperatures ($T_c$) of the sample is 91.8 K.

Bi-2223/Ag HTS wires have been fabricated by the PIT(powder in tube)process. Intermediate annealing was carried out to increase the homogenization and uniformity of the superconducting filaments embedded in the silver matrix during the deformation process that is important to sustain the engineering critical current density in long superconducting wire. Intermediate annealing act to release the deformation hardening of the superconducting wires during drawing process. Rolling parameters were investigated to roll the superconducting tapes with uniform thickness, width and winding tensions. Critical current of 60 m long superconducting tapes was measured 54.3 A continuously after final sintering heat treatment. The phase analysis of Bi-2223/Ag superconducting tapes are examined by the XRD.

The magnetic field generated in the iron core, which is required for the magnetic field to link each coil of the flux-lock type reactor, affects the fault current limiting characteristics of the flux-lock type high-Tc superconducting fault current limiter(SFCL). By applying numerical analysis for equivalent circuit of flux-lock type SFCL, the magnetic field induced in the iron core including currents of each coil was investigated. Through the analysis of magnetic field, we have analyzed that the magnetic field linked the 3rd coil, which is wound in the iron core, prevents the saturation of the iron core, but decreases the impedance of the flux-lock type SFCL.