Corrosion Characteristics by Oxidizers for Copper CMP Slurry

구리 CMP 슬러리중 산화제의 부식 특성

The corrosion characteristics of Copper by oxidizers in Cu CMP slurry has been investigated. Key experimental variables that has been investigate are the corrosion rate by different oxidizers containing slurry of Cu CMP. Oxidizers in Cu CMP slurry reacts with Cu surfaces to raise the oxidation state of the metal via a reduction-oxidation reaction, resulting in either dissolution of the Cu or the formation of Ta surface film on the metal.[1] When Cu films were corroded adding each oxidizer, corrosion rate increased as much as higher Icorrosion. The corrosion rate of Cu was the largest as added $(NH_4)_2S_2O_8$. The higher content of Urea Hydrogen peroxide was, the higher corrosion rate was measured. Putting in tartaric acid as complexing agent, the corrosion rates of the compounds(Urea hydrogen peroxide+$H_2O_2$) are uniformly. As a result of Cu corrosion by $Cu(NO_3)_2$, the high corrosion rate was determined by even small amounts of $Cu(NO_3)_2$. Consequently, this can be explained by assuming that corrosion by oxidizers has primary effects on the removal rate of Cu and the proper oxidizer needs to be chosen in accordance with relationship of each slurry agent.