Electronics in modern life have become more miniaturized and precise and new technology of electronic components has made these trends possible. The explosive demand of electronic components needs more high-speed and accurate performance of manufacturing processes. For high-speed actuation, solenoids, voice coil motors and piezo motors have been used. A solenoid actuator characterized by low price, available small size, and convenience is one of the main components of production equipments requiring compact and high-speed actuators. Since these actuators show millisecond order responsiveness, the improvement of 1~2msec is very important in industrial applications. In this paper, the mathematical model of the solenoid is formulated and simulated using SIMULINK$^{(R)}$. To verify the model, the responses for step input with open-loop control is obtained and compared with the simulation result. In order to improve the responsiveness, Hold voltage method is introduced and optimal value between spring constant and hold voltage is suggested.

In this paper, the IC(Integrated Circuit) for multi-channel synchronous communication was designed by using FPGA and VHDL language. The existing chips for synchronous communication that has been used commercially are composed for one to two channels. Therefore, when communication system with three channels or more is made, the cost becomes high and it becomes complicated for communication system to be realized and also has very little buffer, load that is placed into Microprocessor increases heavily in case of high speed communication or transmission of high-capacity data. The designed IC was improved the function and performance of communication system and reduced costs by designing 8 synchronous communication channels with only one IC, and it has the size of transmitter/receiver buffer with 1024 bytes respectively and consequently high speed communication became possible. It was designed with a communication signal of a form various encoding. To detect errors of communications, the CRC-ITU-T logic and channel MUX logic was designed with hardware logics so that the malfunction can be prevented and errors can be detected more easily and input/output port regarding each communication channel can be used flexibly and consequently the reliability of system was improved. In order to show the performance of designed IC, the test was conducted successfully in Quartus simulation and experiment and the excellence was compared with the 85C3016VSC of ZILOG company that are used widely as chips for synchronous communication.

The lithography system installed inside precision industry's (e.g. TFT-LCD) production factories are increasing in size, thereby increasing its dynamic load along with it. Such condition causes vibration within the area where the system is installed, which then negatively affects the production line to produce defective products. To prevent this type of situation, the facilities should adopt dynamic design that considers the lithography system's dynamic load. This study predicts the maximum value allowed for dynamic stiffness (which is a ratio of vibration response against a single unit of the dynamic load) of the lithography system and explains the result of its application on actual structures inside the facilities.

Uniformity of plasma etching processes critically depends on the wafer temperature and its distribution. The wafer temperature is affected by plasma, chucking force, He back side pressure and the surface temperature of ESC(electrostatic chuck). In this work, 3D mathematical modeling is used to investigate the influence of the geometry of coolant path and the temperature distribution of the ESC surface. The model that has the coolant path with less change of the cross-sectional area and the curvature shows low standard deviation of the ESC surface temperature distribution than the model with the coolant path of the larger surface area and more geometric change.

Emerging demands for rechargeable battery for various applications needs more effective battery management system such as the prediction of the usable time about a battery. Many prediction methods have been suggested but none of them come into bounds of reliability. In this paper, we proposed a new prediction algorithm for the remaining capacity of a rechargeable battery by using the transformed curve based on its impedance. Hardware for monitoring a battery was designed and made. Through a series of experiment, we showed the effectiveness of the proposed prediction algorithm of a battery's remaining capacity.

For high efficiency of Si-cells, Si wafers were textured by the KOH and NaOH etching solution to decreas the reflectance at surfaces of the cells. The textured surfaces were shown various types such as isotropic and anisotropic depending on the etching solution. The reflectance at sample of an anisotropic form with pyramid type was lower than that of isotropic form. The surface with isotropic form of general tiny circles on the surface increased the efficiency, however, the reflectance of it was increased. The efficiency was increased on surface with low roughness.

In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.

In this study, we investigated the effects of the post Ar plasma treatment at different RF powers for various durations on electrical, structural, and optical properties of relatively thin Al-doped zinc oxide films. The sheet resistance was observed to decrease rapidly for the first 5min, beyond which the resistance apparently saturated. As the RF power increased, the grain size and the interplanar distance of (002) planes also increased. The observed decrease in sheet resistance was stated to be a consequence of Al and/or Zn interstitials as well as grain growth. It was also found that Ar plasma treatment increased the transmittance of Al-doped zinc oxide films in most of the visible light range below the blue light.

We investigated the substrate surface polishing by the spherical rigid abrasive under the compression using classical molecular dynamics modeling. We performed three-dimensional molecular dynamic simulations using the Morse potential functions for the various slide-to-roll ratios, from 0 to 1, and then, the compressive forces acting on the spherical rigid abrasive were calculated as functions of the time and the slide-to-roll ratio. The friction coefficients obtained from the classical molecular dynamics simulations were compared to those obtained from the experiments; and found that the molecular dynamic simulation results with the slide-to-roll ratio of 0 value were in good agreement with the experimental results.

Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

In order to grow the crystalline solar cells industry continuously, development of alternate low-cost manufacturing processes is required. Plasma doping system is the technique for introducing dopants into semiconductor wafers in CMOS devices. In photovoltaics, plasma doping system could be an interesting alternative to thermal furnace diffusion processes. In this paper, plasma doping system was applied for phosphorus doping in crystalline solar cells. The Plasma doping was carried out in 1~4 KV bias voltages for four minutes. For removing surface damage and formation of pn junction, annealing steps were carried out in the range of $800{\sim}900^{\circ}C$ with $O_2$ ambient using thermal furnace. The junction depth in about $0.35{\sim}0.6{\mu}m$ range have been achieved and the doping profiles were very similar to emitter by thermal diffusion. So, It could be confirmed that plasma doping technique can be used for emitter formation in crystalline solar cells.

These days, printed electronics attract attention from electronics industry. In this paper, the fabrication of the fine patterns by Near Field Electro Spinning (NFES) was studied by using Ag ink on silicon wafer (substrate). Two types of ink, the high viscous ink Ag-200 and low viscous ink Ag-15, were used. The fine and uniform patterns were easily fabricated by using Ag-200 because jet breakup is less occurred in high viscosity solution. As increasing flow rate of solution, aspect ratio of Ag pattern decreased. And there was optimum applied voltage for fine pattern. In case of Ag-200, the optimum applied voltage was about 2.02KV. When pattern was fabricated by NFES, the pattern width and height were affected by many factors such as viscosity, flow rate of solution, applied voltage etc.

This paper presents a production planning methodology for semiconductor manufacturing supply chain network with volatilities caused by uncertainties such as unstable demand and price. In order to take volatilities into account, we develop two approaches; 1) stochastic model with consideration of various cases and 2) deterministic model considering replanning cost, and propose efficient solution methods. Computational experiments show that the performance of the proposed method is superior to that of deterministic approach using various scenarios.

In this paper, suggested is a hybrid-type visual alignment system to align mask and panel in 3-D space, where mask and panel are to be controlled independently by two individual positioning mechanisms in order to compensate for spatial misalignments. In the hybrid visual alignment system, the below 4-PPR parallel mechanism provides in-plain motions to pattern mask like the other conventional alignment systems while the above 4-RPS parallel mechanism is to move glass panel to achieve a complete spatial alignment. For the control of the hybrid alignment system, first, inverse kinematic solutions for the parallel mechanisms are given to determine the driving distance of each active joint, and also an efficient way to determine the spatial alignment error is developed by exploiting three in-plane cameras.

In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, a numerical analysis model of cooling system in thermal NIL was development by CAD/CAE program and the performance of the cooling system was analyzed by the model. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the case that the cooling material is replaced by liquid nitrogen is investigated.

This paper proposes a new method of vehicle brake lights detection and recognition using an R-filtering. Firstly, the proposed method processes the R-filtering with the first input image and then with the second one in order to detect brake lights. Secondly, the method counts the number of red pixels and computes the mean value in each R-filtered image. The difference rates between the numbers of the red pixels and between the mean values of two images are defined in this paper. Through the analysis of the difference rates, it can recognize whether brake lights are turned on or off, and whether the vehicle ahead is being approached or not. The proposed method is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithm is quite successful.

There are various methods in the flat panel display manufacture. The cost reduction effect is very big in case of using the screen printing method. The screen printing method is much used in the process of forming PDP barrier and can apply to the process of arranging the pillars for maintaining the vacuum gap of the vacuum glazing panel. The pillar which is one of the core elements for comprising vacuum glazing maintains the vacuum gap overcoming the vacuum pressure difference with the atmospheric pressure generated in vacuum glazing. At the same time, the deformation phenomenon by vacuum pressure is relived. In this paper, by using FEM about three considered in the pillar design and arrangement kinds of limiting factors, the simulation was performed. The pillar optimum arrangement method at within the maximum allowable tensile stress and heat transfer coefficients according to the arrangement try to be presented based upon the analyzed result data review and this validity tries to be verified by FEM.

This paper is for improving the RF frequency performance of a fabricated 100nm ${\Gamma}$-gate MHEMT, scaling down vertically for the epitaxy-structure layers of the device. Hydrodynamic simulation parameters are calibrated for the fabricated MHEMT with the modulation-doped $In_{0.52}Al_{0.48}As/In_{0.53}Ga_{0.47}$As heterostructure grown on the GaAs substrate. With these calibrated parameters, simulations for the vertically-scaled epitaxial layers of the device are performed and analyzed for DC/RF characteristics, including the quantization effect due to the thickness reduction of InGaAs channel layer. A newly designed epitaxy-structure device shows higher extrinsic transconductance, $g_m$ of 1.556 S/mm, and higher frequency performance, $f_T$ of 222.5 GHz and $f_{max}$ of 849.6 GHz.

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

Flow and temperature field in reactors are important factors for design of thermal chemical vapor deposition system to grow carbon nanotubes. In this study, effects of the variations of the inlet and outlet areas of the CVD reactor to the flow characteristics and temperature field are numerically analyzed. High temperature of the gas in the entrance region is obtained with slow gas speed resulted from the enlarged inlet area. Variation of the exit area has little effects on the flow field and temperature in the reactor. However the largest area among considered cases gives the highest gas temperature though the differences are small.

The recent PCB (Printed Circuit Board) wet etcher has been needed to process pattern within $20{\mu}m$ width on a $20{\mu}m$ thick board. A previous PCB etcher can be used with multiple points of roller rolls or slips off a board. Also, the damage of the board by contacting the roller increases the friction defects. A vertical type boards transporting process is developed to solve the problems of boards friction and sagging in a horizontal etcher. In this research, CFD (Computational Fluid Dynamics) method is used to design an improved spray nozzle including the critical part of etcher, and establish the design method. Meanwhile, major spray characteristics are expected in diverse nozzle types and variables. Lastly, diverse simulation results are adapted to design an improved nozzle and spray system.

We fabricated distributed feedback InGaAsP/InP laser diodes for optical fiber communication module and characterized the lasing properties in continuous wave operation. The active layer of 7-period InGaAsP(1.127 eV)/InGaAsP(0.954 eV) multi-quantum well structure was grown by the metal-organic chemical vapor deposition. The grating for waveguide was also fabricated by the implementation of the Mach-Zehender holographic method of two laser beams interference of He- Cd laser and the fabricated laser diode has the dimension of the laser length of $400{\mu}m$ and the ridge width of $1.2{\mu}m$. The laser diode shows the threshold current of 3.59 mA, the threshold voltage of 1.059 V. For the room-temperature operation with the current of 13.54 mA and the voltage of 1.12 V, the peak wavelength is about 1309.70 nm and optical power is 13.254 mW.

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.