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Numerical Analysis for Improvement of Cooling Performance in Nanoimprint Lithography Process  

Lee, Ki-Yeon (Dept. of Mechanical Engineering, Soonchunhyang University)
Jun, Sang-Bum (Dept. of Mechanical Engineering, Soonchunhyang University)
Kim, Kug-Weon (Dept. of Mechanical Engineering, Soonchunhyang University)
Publication Information
Journal of the Semiconductor & Display Technology / v.10, no.4, 2011 , pp. 89-94 More about this Journal
Abstract
In recent years there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. A major disadvantage of thermal NIL is the thermal cycle, that is, heating over glass transition temperature and then cooling below it, which requires a significant amount of processing time and limits the throughput. One of the methods to overcome this disadvantage is to improve the cooling performance in NIL process. In this paper, a numerical analysis model of cooling system in thermal NIL was development by CAD/CAE program and the performance of the cooling system was analyzed by the model. The calculated temperatures of nanoimprint device were verified by the measurements. By using the analysis model, the case that the cooling material is replaced by liquid nitrogen is investigated.
Keywords
Nanoimprint lithography; Heat Flow; Flow Simulation; Cooling System;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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