CFD를 이용한 CMP장비의 효과적인 공정을 위한 수치해석적 연구

A Numerical Analysis Using CFD for Effective Process at CMP Equipment

  • 이수연 (한국기술교육대학교 대학원 메카트로닉스 공학과) ;
  • 김광선 (한국기술교육대학교 대학원 메카트로닉스 공학과)
  • Lee, Sue-Yeon (Department of Mechatronics Engineering, Korea University of Technology and Education) ;
  • Kim, Kwang-Sun (Department of Mechatronics Engineering, Korea University of Technology and Education)
  • 투고 : 2011.11.30
  • 심사 : 2011.12.15
  • 발행 : 2011.12.31

초록

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

키워드

참고문헌

  1. Jihwan Jang, Doyhung Lee, "Optimization of Groove Sizing in CMP using CFD", 대한 기계학회 추계학술대회 논문집, pp. 1522-1527, 2004
  2. Won-Kook Cho, "Analysis on Propellant Uniformity of KSR-III Manifold", 항공우주기술, pp. 113-122, 2002
  3. Irving H. Shames, "Mechanics of Fluids", Mcgraw Hill, Fourth pp. 149-150, 2002.
  4. Star-CCM UserGuide ver. 6.02, CD-adapco, 2011