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Electrical and Mechanical Properties of CNT-filled Solderable Electrically Conductive Adhesive  

Yim, Byung-Seung (School of Mechanical Engineering, Chung-Ang University)
Jeong, Jin-Sik (School of Mechanical Engineering, Chung-Ang University)
Lee, Jeong-Il (School of Mechanical Engineering, Chung-Ang University)
Oh, Seung-Hoon (School of Mechanical Engineering, Chung-Ang University)
Kim, Jong-Min (School of Mechanical Engineering, Chung-Ang University)
Publication Information
Journal of the Semiconductor & Display Technology / v.10, no.4, 2011 , pp. 37-42 More about this Journal
Abstract
In this paper, novel carbon nanotube (CNT)-filled Solderable electrically conductive adhesive (ECA) and joining process have been developed. To investigate the bonding characteristics of CNT-filled Solderable ECA, three types of Solderable ECAs with different CNT weight percent (0, 0.1, 1wt%) were formulated. For a joining process, the quad flat package (QFP) chip was used. The QFP chip had a size of $14{\times}14{\times}2.7$ mm and a 1 mm lead pitch. The test board had a Cu daisy-chained pattern with 18 ${\mu}m$ thick. After the bonding process, the bonding characteristics such as morphology of conduction path, electrical resistance and pull strength were measured for each formulated ECAs. As a result, the electrical and mechanical bonding characteristics for a QFP joints using CNT-filled ECA were improved about 10% compared to those of QFP joints using ECA without CNT.
Keywords
Carbon nanotube; Electrically Conductive Adhesive; Low-Melting-Point Alloy; QFP; Wettability;
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1 Wu, H. P., Wu, X. J., Ge, M. Y., Zhang, G. Q., Wang, Y. W., and Jiang J., "Properties Investigation on Isotropical Conductive Adhesives Filled with Silver Coated Carbon Nanotubes", Composites Science and Technology, Vol. 67, pp. 1182-1186, 2007.   DOI   ScienceOn
2 Yu, S., Tong, M. N., and Critchlow, G., "Wedge Test of Carbon-Nanotube-Reinforced Epoxy Adhesive Joints", Journal of Applied Polymer Science, Vol. 111, pp. 2957-2962, 2009.   DOI   ScienceOn
3 Li, Y., and Wong, C. P., "Recent Advances of Conductive Adhesives as a Lead-Free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications", Materials Science and Engineering, Vol. 51, pp. 1-35, 2006.   DOI
4 Kim, H. K., and Shi, F. G., "Electrical Reliability of Electrically Conductive Adhesive Joints: Dependence on Curing Condition and Current Density", Microelectronics Journal, Vol. 32, pp. 315-321, 2001.   DOI
5 Wojciechowski, D., Vanfleteren, J., Reese, E., and Hagendorn, H. W., "Electro-Conductive Adhesives for High Density Package and Flip-Chip Interconnections", Microelectronics Reliability, Vol. 40, pp. 1215-1226, 2000.   DOI   ScienceOn
6 Tong, Q. K., Markley, D. K., Frederickson, G., Kuder, R., and Lu, D., "Conductive Adhesives with Stable Contact Resistance and Superior Impact Performance", Electronic Components and Technology Conference, Vol. 1-6, pp. 347-352, 1999.
7 Zhan, G. D., Kuntz, J. D., Wan, J., and Mukherjee, A. K., "Single-Wall Carbon Nanotubes as Attractive Toughening Agents in Alumina-Based Nanocomposites", Nature Materials, Vol. 2, pp. 38-42, 2003.   DOI   ScienceOn
8 Yim, B. S., Kim, J. M., Jeon, S. H., Lee, S. H., Kim, J. H., Han, J. G., and Cho, M. H., "Hybrid Interconnection Process Using Solderable ICAs(Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers", Materials Transactions, Vol. 50, pp. 2649-2655, 2009.   DOI   ScienceOn