Electrical and Mechanical Properties of CNT-filled Solderable Electrically Conductive Adhesive |
Yim, Byung-Seung
(School of Mechanical Engineering, Chung-Ang University)
Jeong, Jin-Sik (School of Mechanical Engineering, Chung-Ang University) Lee, Jeong-Il (School of Mechanical Engineering, Chung-Ang University) Oh, Seung-Hoon (School of Mechanical Engineering, Chung-Ang University) Kim, Jong-Min (School of Mechanical Engineering, Chung-Ang University) |
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