1 |
Samir, T. 2003 Improving Wafer Temperature Uniformity for Etch Applications. A Dissertation in Mechanical Engineering, Texas Tech University.
|
2 |
Daviet, J. and Peccoud L., "Heat Transfer in a Microelectronics Plasma Reactor," J. Appl. Phys., Vol. 73, pp.1471-1479., 1993.
DOI
|
3 |
Kelkar, U.M., Gordon, M. H., Roe, L. A. and Li, Y., "Diagnostics and modeling in a pure argon plasma: Energy balance study," J. Vac. Sci. Technol. A17, pp.125-132., 1999.
|
4 |
Kiihanmaki, J. and Franssila, S., "Deep Silicon Etching in inductively Coupled Plasma Reactor for MEMS," Phisica Scpita., T79, 1999.
|
5 |
Tretheway, D. and Aydil, E. S., "Modeling of Heat Transport and Wafer Heaing Effects during Plasma Etching," J. Electrochem. Soc., Vol. 143, pp. 3674-3680., 1996.
DOI
ScienceOn
|