This study describes the electron beam lithography pattern fabrication using the proximity effect correction. When electron beam exposes into electron beam resist, the beam tends to spread inside the substance (forward scattering). And the electron beam reflected from substrate spreads again (back scattering). These two effects influence to distribution of the energy and give rise to a proximity effect while a small pattern is generated. In this article, an electron energy distribution is modeled using Gaussian shaped beam distribution and those parameters in the model are computed to solidify the model. The proximity effect is analyzed through simulations and appropriate corrections to reducing the proximity effect are suggested. It is found that the proximate effect can be reduced by adopting schemes of dose adjustment, and the optimal dose is determined through simulations. The proposed corrected proximity effect correction is proved by experiments.

The $Sr_{0.7}Bi_{2.3}Nb_2O_9$(SBN) thin films are deposited on Pt-coated electrode(Pt/Ti/$SiO_2$/Si) using RF sputtering method at various $Ar/O_2$ ratio. We investigated the effect of deposition condition(specially $Ar/O_2$ ratio) on the structural properties of SBN thin film. As $Ar/O_2$ ratio was increased, the peaks in the XRD pattern became more sharp. Also, the peaks(008)(115)(220) in 80/20 of $Ar/O_2$ ratio were suddenly appeared. The optimum of the rougness showed about 4.33 nm in 70/30 of $Ar/O_2$ ratio. The crystallinity of SBN thin films were increased with the increase of $Ar/O_2$ ratio. Also, Deposition rate of SBN thin films was about 4.17 nm/min in 70/30 of $Ar/O_2$ ratio. The capacitance of SBN thin films were increased with the increase of $Ar/O_2$ ratio.

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

To increase the data capacity of one-dimensional symbology, 2D barcodes have been proposed a decade ago. In this paper, a new 2D barcode detection algorithm based on Local Binary Pattern is presented. To locate 2D barcode symbols, a texture analysis scheme based on the Local Binary Pattern is adopted, and a gray-scale projection with sub-pixel operation is utilized to separate the symbol precisely from the input image. Finally, the segmented symbol is normalized using the inverse perspective transformation for the decoding process. The proposed method ensures high performances under various lighting/printing conditions and strong perspective deformations. Experiments show that our method is very robust and efficient in detecting the symbol area for the various types of 2D barcodes.

In the silicon wafer polishing process, the mounting stage of silicon wafer on the ceramic carrier block has been using the polishing template which utilizes the porous surface instead of traditional wax mounting method. Here in this article, the experimental study is carried out in order to study the wafer demounting by water jet and the effects of operating conditions such as the water jet flowrate and the number of water jet nozzles on the wafer demounting time. It is found that the measured wafer demounting time is inversely proportional to the water flowrate per nozzle, regardless of number of nozzles used; implying that the stagnation pressure by the water jet impingement is the dominant key factor. Additionally, by using the transparent disk instead of wafer, the air bubble formation and growth is observed under the disk, making the passage of water flow, and subsequently demounting the wafer from the porous pad.

This paper presents an idea of implementation of many semiconductor equipments. The idea is a new design methodology of the Networked Control Systems (NCSs) using CAN (Controller Area Network) will be discussed. The Distributed Control Systems (DCSs) is very useful to control multiple systems that have a distance to communicate. The CAN protocol is very strong to noise, also provides the user with many powerful functionality. Only one communication line (BUS) is used, so that a control and a maintenance of those systems are very easy. This paper is concerned with the speed control of multiple DC motors using CAN Protocol. Experimental systems are made to validate effectiveness of the systems. The results of the experiment show that the NCSs using CAN has excellency in real time control.

Glass forming technology is used to form channels of external electrode flat fluorescent lamps (FFL). The efficiency of FFL depends on the number and the length of the channels. Five FFLs with same size ($300\;mm{\times}80\;mm$), different channel number, and different channel length were fabricated. The electrical and optical characteristics of 5 FFLs were evaluated. It was found that the FFL with one channel with its channel length of 1,110 mm and channel width of 7 mm corner width was shown to have the highest efficiency at room temperature operation.

The oxygen barrier films were formed on poly(ethylene terephthalate) (PET) substrate by a sol-gel process using 3-aminoproprytrimethoxysilane (APTMOS). The effects of solvent type, coating times and incorporation of fumed silica on oxygen permeability coefficient were investigated. The APTMOS coating film prepared from methanol as a solvent exhibited higher oxygen barrier properties than that using THF. The oxygen permeability coefficient of coated film with APTMOS/methanol by coating 7 times was measured to be $2.28{\times}10^{-6}$, while that of PET film was $1.16{\times}10^{-4}$ GPU. The addition of fumed silica does not affect the oxygen barrier properties. It may be explained that silica particles disrupt chain packing, which leads to an increase in free volume for permeation.

Density functional theory was used to investigate the adsorption and reaction of $HfCl_4$ with two hydroxyls on Si (001)-$2{\times}1$ surface in atomic layer deposition (ALD) process. We prepared a reasonable Si substrate which consisted of six inter-dimer dissociated $H_2O$ molecules and two intra-dimer dissociated $H_2O$ molecules. The $HfCl_4$must react with two hydroxyls to be a bulk-like structure. When $HfCl_4$ was adsorbed on a hydroxyl, there was energy benefit of -0.55 eV. Though there was energy loss for $HfCl_4$ to react with H of hydroxyl, thermal energy of ALD chamber would be enough to pass the energy barriers. There were five reaction pathways for $HfCl_4$ to react with two hydroxyls; inter-dimer, intra-dimer, cross-dimer, inter-row, and cross-row. Inter-row, inter-dimer and intra-dimer were relatively favorable among the five reaction pathways based on the energy difference. The electron densities between O and Hf in these three reactions were higher than the others and they had shorter Hf-O and O-O bond lengths than the other two reaction pathways.

In order to check the validation of LC simulation, 0.7 inch LCOS panel in full-HD resolution was fabricated and used for the electro-optical measurement. Compared the measured data with the calculated data, the averaged difference was 1.72% under 0 ~ +6 V bias on pixel electrode. To improve the optical characteristics of full-HD LCOS panel, the planar structure and trench structures (0.1 um, 0.2 um and 0.3 um-in-depth) between adjacent pixels were investigated with LC simulation. The planar structure showed the higher reflectance and faster reflectance-voltage response time than the trench structure. The optical fill factor and contrast ratio of planar structure were also higher than those of trench structures. As compared 1 um-in-depth trench structure resembled to the real structure with the planar structure, the optical fill factor was improved by 1.15% and the contrast ratio was improved by 5.26%. In order to minimize the loss of luminance and contrast ratio, the planar structure need to be applied between adjacent pixels.