Recently, with rapid development of digital media like semiconductor and large flat panel display, the manufacturing equipment is required to have high precision over large travel range. Moreover it should have high product throughput. To achieve high product throughput, a controller should perform fast point-to-point motion and high precision positioning after settling in spite of external disturbances or residual vibrations. We proposed a new mode switching control algorithm with an application to dual stage for long range and high precision positioning. The proposed algorithm uses a proximate time-optimal servomechanism for the fast settling and a time-delay controller for the high precision positioning. Experimental results show that the proposed method enables smooth mode switching and improves the settling time and the precision accuracy after settling by over than 33% and 45%, respectively.

The SCT thin films are deposited on Pt-coated electrode($Pt/TiN/SiO_2/Si$) using RF sputtering method with Sr/Ca ratio. The maximum grain of thin films is obtained by ratio of Ca at 15 mol%. The dielectric constant was increased with increasing the ratio of Ca, while it was decreased if the ratio of Ca exceeded over 15 mol%. The dielectric constant changes almost linearly in temperature ranges of $-80{\sim}+90$. All SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequency, and the relaxation frequency is observed above 200 kHz. The current-voltage characteristics of SCT thin films showed the increasing leakage current as the measuring temperature increases.

Expose equipment system that is used for manufacturing process of Flat Panel Display, is most important equipment in whole process. Expose equipment that is for making pattern of mask on substrate, consists of optical part, stage part and transport part. The stage is an important part that aligns mask and substrate for delivering pattern of mask to substrate exactly. In this paper, control system of expose stage that is able to use mask and substrate of diverse size, with PC controller using GUI interface instead of PLC control system. The existing PLC control system does not have the suitable structure for using mask of diverse size. GUI interface integration control system is based on PC. So it has the advantage of convenient use and active operation. We embodied PLC control system in integration control system based on PC, and verified utility possibility through the standard test course.

In the manufacturing processes of semiconductor, test process is important for quality of products. In the manufacturing process of dynamic memory, memory test is more important. So, automatic test equipment(ATE) is used necessarily. But, according to increase of speed of dynamic memory operation, the rapid test equipment is needed. Impedance matching between ATE and dynamic memory is expected to be an important problem for making a rapid test equipment over 1Gbps. According to increase of speed, inner impedance of ATE also works on important parameter for test. This paper is about the method that is for impedance matching of inner impedance and coaxial cable occurring in manufacturing of ATE. We proved effects of inner impedance by electric theory and verified the method of impedance matching using computer simulation.

Semiconductor industry has been dramatically developed with the information era of 21C, and the trend now is to consider that the technology of management system of the computer utility that has a high efficiency is important. This study investigated the intelligent decision system for residual gas purge process to effectively remove the residual gas in the tube after replacing the cylinder that is used for the gas cabinet or BSGS(Bulk Specialty Gas Supply System) of the semiconductor process. It was suggest from this study that it is possible to decide the type, frequency and volume of purge gas using various toxic gases which is necessary for each process. Also, this result will be utilized for operating the system, increasing the efficiency of management and saving energy.

In order to design an OLED(Organic Luminescent Emitting Device) evaporation system, geometric simulation of film thickness distribution profile is required. For the OLED evaporation process, thin film thickness uniformity is of great practical importance. In this paper, a geometric modeling algorithm is introduced for process simulation of the OLED evaporating process. The physical fact of the evaporating process is modeled mathematically. Based on the developed method, the thickness of the thin-film layer can be successfully controlled.

This paper shows that the effect of exposing on the top area and a solution which using a water circulation system. Semiconductor substrate stage is made from Aluminum and is repeated the sequence of exposing (150), turning OFF shutter, taking 30 sec. interval at the top area of stage. So the temperature of substrate temperature rises continuously. On this, we made a waterway at the inner part of the substrate stage and operated a water circulation system. We measured the temperature of a substrate stage surface with a thermocouple attached to the substrate stage. To analyze the top area's temperature, we used Analysis Program ANSYS for analysis and 3D CAD program Solid-Works for modeling.

Micro vibration isolation, typically originated from ground, is always a prime concern for the nano-measurement instruments such as Atomic Force Microscopes. A four mount active vibration isolation system is proposed in this paper. Modeling and control of such a four mount system was analyzed. Combined active-passive isolation principle is used for vibration isolation by mounting the instrument on a passively damped isolation system made of Elastomer along with the active stage in parallel that consists of very soft actuation system, the Voice Coil Motor. The active stage works in combination with the passive stage for working as a very low frequency vibration attenuator.