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Molecular Dynamics Simulations Study on Surface Polishing by Spherical Abrasive  

Park, Byung-Heung (Department of Chemical and Biological Engineering, Chungju National University)
Kang, Jeong-Won (Department of Computer Engineering, Chungju National University)
Publication Information
Journal of the Semiconductor & Display Technology / v.10, no.4, 2011 , pp. 47-51 More about this Journal
Abstract
We investigated the substrate surface polishing by the spherical rigid abrasive under the compression using classical molecular dynamics modeling. We performed three-dimensional molecular dynamic simulations using the Morse potential functions for the various slide-to-roll ratios, from 0 to 1, and then, the compressive forces acting on the spherical rigid abrasive were calculated as functions of the time and the slide-to-roll ratio. The friction coefficients obtained from the classical molecular dynamics simulations were compared to those obtained from the experiments; and found that the molecular dynamic simulation results with the slide-to-roll ratio of 0 value were in good agreement with the experimental results.
Keywords
Chemical Mechanical Polishing; Molecular Dynamics; Semiconductor Processes;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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