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A Research of Nozzle Spray System of Vertical Type Etcher  

Kim, Jum-Young (Korea University of Technology and Education)
Joo, Kang-Wo (Korea University of Technology and Education)
Yoon, Jong-Kook (Empower)
Ryu, Sun-Joong (Samsung Electro Mechanics)
Kim, Kwang-Sun (Korea University of Technology and Education)
Publication Information
Journal of the Semiconductor & Display Technology / v.10, no.4, 2011 , pp. 125-130 More about this Journal
Abstract
The recent PCB (Printed Circuit Board) wet etcher has been needed to process pattern within $20{\mu}m$ width on a $20{\mu}m$ thick board. A previous PCB etcher can be used with multiple points of roller rolls or slips off a board. Also, the damage of the board by contacting the roller increases the friction defects. A vertical type boards transporting process is developed to solve the problems of boards friction and sagging in a horizontal etcher. In this research, CFD (Computational Fluid Dynamics) method is used to design an improved spray nozzle including the critical part of etcher, and establish the design method. Meanwhile, major spray characteristics are expected in diverse nozzle types and variables. Lastly, diverse simulation results are adapted to design an improved nozzle and spray system.
Keywords
Etcher; Spray Nozzle; Numerical Analysis; CFD; Vertical;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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