White-light-emitting ZnS:Mn, Cu, Cl phosphors with spherical shape and the size of $20\;{\mu}m$ are successfully synthesized. They have the double phases of cubic and hexagonal structures. They are applied to electroluminescent (EL) devices by silk screen method with the following structure: $electrode/BaTiO_3$ insulator layer ($50{\sim}60\;{\mu}m$)/ ZnS:Mn, Cu, Cl phosphor layer ($30{\sim}50\;{\mu}m$)/ITO glass. The EL devices are driven with the voltage of 100 V and the frequency of 400 Hz. The EL devices show the three emission peaks. The blue and green emission bands are originated from $CICu^{2+}$ transition and $ClCu^+$ transition, respectively. The yellow emission band results from $^4T^6A$ transition of $Mn^{2+}$ ion. As an increase of Cu concentrations, the blue and green emission intensities decrease whereas the yellow emission intensity increases; the quality becomes warm white. It is due to the energy transfer from the blue and green bands to the yellow band.

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

A low cost PDP sustain power supply is proposed based on flyback topology. By using Boundary Conduction Method(BCM) to control input current regulation, DCM condition can be met under all load conditions. Another feature of the proposed method is that a excessive voltage stress due to the link voltage increase can be suppressed by removing link capacitor and suggest new 'Level-shifting switch driver'. this new gate driver is improved 66% of efficiency than switching loss of a existed push-pull amplifier. The proposed converter is tested with a 400W(200V-2A output) prototype circuit.

The oxygen barrier films were formed on poly(ethylene terephthalate) (PET) substrate by a sol-gel process using aminoalkoxysilanes. The coating layers were characterized by FT-IR and SEM. The oxygen permeability coefficients of coating films were measured by variable volume method, and then the influences of solvent ratio in sol and film drying temperature on the oxygen barrier properties were investigated. The aminoalkoxysilane coating films exhibited much higher oxygen barrier properties than PET film. The oxygen permeability coefficient of the film coated with each of APTEOS and APTMOS was measured to be $2.96{\times}10^{-6}$ and $3.05{\times}10^{-5}\;GPU$, respectively, while that of PET film was $1.16{\times}10^{-4}\;GPU$.

Recently, Top emission organic light-emitting diode (TEOLED) has been attracted by their potential application for the development of flat panel display (FPD). We have fabricated the high luminance top emission organic-emitting diode (TEOLED) using dual cathode layer and three top emitting structure. These devices were characterized by electroluminescence (EL) and current density-voltage (J-V) measurements. After compared it with Au anode structure, luminance of the device using dual anode was better than using without Al device. Consequently, Al layers are very good candidates for a promising electron-injecting buffer layer for top emission light-emitting diode (TEOLED).

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

To produce a fine structure with uniform surface of barrier ribs in PDP, acid etching process has been used in manufacture process. It is necessary to understand the mechanism of etching, particularly on the interface of ceramic fillers and matrix glass. We investigated the effect of ceramic fillers (ZnO, $Al_2O_3$) on the microstructure of borate glass system to find an etching mechanism of barrier ribs. The barrier ribs was etched with several steps, dissolving a small amount of residual glass, taking out alumina fillers, and removing a cluster type of ZnO fillers and glass matrix.

In this paper, a composition modulation of Dot-matrix display grayscale is presented. There's two method of expression of Dot-matrix Display grayscale. One is PWM by controlling pulse width. The other is PAM by controlling pulse amplitude. Composition modulation of Dot-matrix use PWM and PAM together. Composition modulation shows the number of grayscale as number of grayscale of PWM$\times$number of grayscale of PAM and have the effect of reduced size than existing single modulation.