• Journal of IKEEE
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• v.9 no.1 s.16
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• pp.57-64
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• 2005

This paper presents a built-in current sensor(BICS) that detects defects in CMOS integrated circuits using the current testing technique. This circuit employs a cross-coupled connected PMOS transistors, it is used as a current comparator. The proposed circuit has a negligible impact on the performance of the circuit under test (CUT) and high speed detection time. In addition, in the operation of the normal mode, the BlCS does not have dissipation of extra power, and it can be applied to the deep submicron process. The validity and effectiveness are verified through the HSPICE simulation on circuits with defects. The area overhead of a BlCS versus the entire chip is about 9.2%. The chip was fabricated with Hynix $0.35{\mu}m$ 2-poly 4-metal N-well CMOS standard technology.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.11
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• pp.64-69
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• 2013

In this paper, a high-speed CMOS Image Sensor (CIS) based on a 10-bit two-step single-slope A/D converter is proposed. The A/D converter is composed of both a 5-bit coarse ADC and a 6-bit fine ADC, and the conversion speed is 10 times faster than that of the single-slope A/D converter. In order to have a small noise characteristics, further, a Digital Correlated Double Sampling(D-CDS) is also discussed. The proposed A/D converter has been fabricated with 0.13um 1-poly 4-metal CIS process, and it has a QVGA($320{\times}240$) resolution. The fabricated chip size is $5mm{\times}3mm$, and the power consumption is about 35mW at 3.3V supply voltage. The measured conversion speed is 10us, and the frame rate is 220 frames/s.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.11
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• pp.107-113
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• 2014

A VCO (Voltage Controlled Oscillator) and a divide-by-4 high speed frequency divider are implemented using 65nm CMOS technology for 60GHz wireless communication system. The mm-wave VCO was designed by NMOS cross-coupled LC type using current source. The architecture of the divide-by-4 high speed frequency divider is differential ILFD (Injection Locking Frequency Divider) with varactor to control frequency range. The frequency divider also uses current sources to get good phase noise characteristics. The measured results show that the VCO has 64.36~67.68GHz tuning range and the frequency divider divides the VCO output by 4 exactly. The high output power of 5.47~5.97dBm from the frequency divider is measured. The phase noise of the VCO including the frequency divider are -77.17dBc/Hz at 1MHz and -110.83dBc/Hz at 10MHz offset frequency. The power consumption including VCO is 38.4mW with 1.2V supply voltage.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.2
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• pp.56-62
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• 2002

A new high speed and low voltage swing on-chip BUS using threshold voltage swing driver and dual sense amplifier receiver is proposed. The threshold voltage swing driver reduces the rising time in the bus to 30% of the full CMOS inverter driver and the dual sense amplifier receiver increases twice the throughput. of the conventional reduced-swing buses using sense amplifier receiver. With threshold voltage swing driver and dual sense amplifier receiver combined, approximately 60% speed improvement and 75% power reduction are achieved in the proposed scheme compared to the conventional full CMOS inverter for the on-chip bus.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.7
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• pp.17-26
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• 2016

This work proposes a 12b 60MS/s 0.18um CMOS Flash-SAR ADC for various systems such as wireless communications and portable video processing systems. The proposed Flash-SAR ADC alleviates the weakness of a conventional SAR ADC that the operation speed proportionally increases with a resolution by deciding upper 4bits first with a high-speed flash ADC before deciding lower 9bits with a low-power SAR ADC. The proposed ADC removes a sampling-time mismatch by using the C-R DAC in the SAR ADC as the combined sampling network instead of a T/H circuit which restricts a high speed operation. An interpolation technique implemented in the flash ADC halves the required number of pre-amplifiers, while a switched-bias power reduction scheme minimizes the power consumption of the flash ADC during the SAR operation. The TSPC based D-flip flop in the SAR logic for high-speed operation reduces the propagation delay by 55% and the required number of transistors by half compared to the conventional static D-flip flop. The prototype ADC in a 0.18um CMOS demonstrates a measured DNL and INL within 1.33LSB and 1.90LSB, with a maximum SNDR and SFDR of 58.27dB and 69.29dB at 60MS/s, respectively. The ADC occupies an active die area of $0.54mm^2$ and consumes 5.4mW at a 1.8V supply.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.37 no.2
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• pp.69-76
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• 2000

A dual-modulus prescaler divides the input signal by one of the moduli according to the control signal. In this paper, a new fast dual-modulus prescaler is proposed. The proposed prescaler has a ratioed-NOR structure different from a conventional ratioed-NAND structure. The proposed one can operate at a higher speed by using parallely connected NMOSs instead of using series-connected ones. HSPICE simulation results using HYUNDAI 0.65(m 2-poly 2-metal CMOS process parameters show that the maximum operating frequency of the proposed dual-modulus prescaler is 2.8㎓ with power consumption of 40.7㎽ at 5V supply voltage at $25^{\circ}C$. The proposed dual-modulus prescaler can be utilized for the frequency-synthesis in cellular radio front-ends.

• Journal of IKEEE
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• v.13 no.2
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• pp.118-125
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• 2009

With recent advancement of high-speed, multi-gigabit data transmission capabilities, transmitters usually send data without clock signals for reduction of hardware complexity, power consumption, and cost. Therefore clock and data recovery circuits(CDR) become important to recover the clock and data signals and have been widely studied. This paper presents the design of 10Gbps CDR in 0.18$\mu$m CMOS process. A quarter-rate bang-bang phase detector is designed to reduce the power and circuit complexity, and a 4-stage LC-type VCO is used to improve the jitter characteristics. Simulation results show that the designed CDR consumes 80mW from a 1.8V supply, and exhibits a peak-to-peak jitter of 2.2ps in the recovered clock. The chip layout area excluding pads is 1.26mm$\times$1.05mm.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.11
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• pp.57-65
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• 2014

This paper presents a framework that is based on a reconfigurable macro-model of current-mode logic (CML) high-speed digital circuits enabling equation-based design optimization. The proposed macro-model is compatible with geometric programming, thereby enabling constraint-driven top-level power optimization. The proposed optimization framework is applied to a design of CML based serial-link transmitter with user-defined design specifications as an example of high speed digital circuits using 45nm and 90nm CMOS technology. The proposed optimization framework can derive a design with optimal power efficiency for given transistor technology nodes.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.9
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• pp.685-691
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• 2003

This work describes a 3 V 12b 100 MS/s CMOS digital-to-analog converter (DAC) for high-speed communication system applications. The proposed DAC is composed of a unit current-cell matrix for 8 MSBs and a binary-weighted array for 4 LSBs, considering linearity, power consumption, chip area, and glitch energy. The low-glitch switch driving circuit is employed to improve the linearity and the dynamic performance. Current sources of the DAC are laid out separately from the current-cell switch matrix core. The prototype DAC is implemented in a 0.35 urn n-well single-poly quad-metal CMOS technology. The measured DNL and INL of the prototype DAC are within $\pm$0.75 LSB and $\pm$1.73 LSB, respectively, and the spurious-free dynamic range (SFDR) is 64 dB at 100 MS/s with a 10 MHz input sinewave. The DAC dissipates 91 mW at 3 V and occupies the active die area of 2.2 mm ${\times}$ 2.0 mm.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.34C no.6
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• pp.58-70
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• 1997

In this paper, an 8bit CMOS low power, high-speed current-mode folding and interpolation A/D converter is designed with te LG semicon $0.8\mu\textrm{m}$ N-well single-poly/double-metal CMOS process to be integrated into a portable image signal processing system such as a digital camcoder. For good linearity and low power consumption, folding amplifiers and for high speed performance of the A/D converter, analog circuitries including folding block, current-mode interpolation circuit and current comparator are designed as a differential-mode. The fabricated 8 bit A/D converter occupies the active chip area of TEX>$2.2mm \times 1.6mm$ and shows DNL of $\pm0.2LSB$, INL of <$\pm0.5LSB$, conversion rate of 40M samples/s, and the measured maximum power dissipation of 33.6mW at single +5V supply voltage.