Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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A 3 V 12b 100 MS/s CMOS DAC for High-Speed Communication System Applications

고속통신 시스템 응용을 위한 3 V 12b 100 MS/s CMOS D/A 변환기

  • Published : 2003.09.01
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Abstract

This work describes a 3 V 12b 100 MS/s CMOS digital-to-analog converter (DAC) for high-speed communication system applications. The proposed DAC is composed of a unit current-cell matrix for 8 MSBs and a binary-weighted array for 4 LSBs, considering linearity, power consumption, chip area, and glitch energy. The low-glitch switch driving circuit is employed to improve the linearity and the dynamic performance. Current sources of the DAC are laid out separately from the current-cell switch matrix core. The prototype DAC is implemented in a 0.35 urn n-well single-poly quad-metal CMOS technology. The measured DNL and INL of the prototype DAC are within $\pm$0.75 LSB and $\pm$1.73 LSB, respectively, and the spurious-free dynamic range (SFDR) is 64 dB at 100 MS/s with a 10 MHz input sinewave. The DAC dissipates 91 mW at 3 V and occupies the active die area of 2.2 mm ${\times}$ 2.0 mm.

본 논문에서는 고속 통신 시스템 응용을 위한 12b 100 MS/s CMOS D/A 변환기(DAC) 회로를 제안한다. 제안하는 DAC는 전력소모, 면적, 선형성 및 글리치 에너지 등을 고려하여, 상위 8b는 단위 전류셀 매트릭스 (unit current-cell matrix)로 나머지 하위 4b는 이진 전류열 (binary-weighted array)로 구성하였다. 제안하는 DAC는 동적 성능을 향상시키기 위해 새로운 구조의 스위치 구동 회로를 사용하였다. 시제품 DAC회로 레이아웃을 위해서는 캐스코드 전류원을 단위 전류셀 스위치 매트릭스와 분리하였으며, 제안하는 칩은 0.35 um single-poly quad-metal CMOS 공정을 사용하여 제작되었다. 측정된 시제품의 DNL 및 INL은 12b 해상도에서 각각 ±0.75 LSB와 ±1.73 LSB이내의 수준이며, 100 MS/s 동작 주파수와 10 MHz 입력 주파수에서 64 dB의 SFDR을 보여준다. 전력 소모는 3 V의 전원 전압에서 91 mW이며, 칩 전체 크기는 2.2 mm × 2.0 mm 이다.

Keywords

References

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