• Current Optics and Photonics
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• v.7 no.5
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• pp.485-495
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• 2023

The pixel size in high-resolution complementary metal-oxide-semiconductor (CMOS) image sensors continues to shrink due to chip size limitations. However, the pixel pitch's miniaturization causes deterioration of optical performance. As one solution, a quad color filter (CF) array with pixel binning has been developed to enhance sensitivity. For high sensitivity, the microlens structure also needs to be optimized as the CF arrays change. In this paper, the covered microlens, which consist of four microlenses covered by one large microlens, are proposed for the quad CF array in the backside illumination pixel structure. To evaluate the optical performance, the suggested microlens structure was simulated from 0.5 ㎛ to 1.0 ㎛ pixels at the center and edge of the sensors. Moreover, all pixel structures were compared with and without in-pixel deep trench isolation (DTI), which works to distribute incident light uniformly into each photodiode. The suggested structure was evaluated with an optical simulation using the finite-difference time-domain method for numerical analysis of the optical characteristics. Compared to the conventional microlens, the suggested microlens show 29.1% and 33.9% maximum enhancement of sensitivity at the center and edge of the sensor, respectively. Therefore, the covered microlens demonstrated the highly sensitive image sensor with a quad CF array.

• Korean Journal of Optics and Photonics
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• v.35 no.3
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• pp.95-106
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• 2024

In the 21st century, white light-emitting diodes (LEDs) are widely used as backlighting for liquid crystal displays and as a light source for general illumination. However, white LEDs used in lighting often use a single yellow phosphor on top of a blue LED chip, which lacks the ability to reproduce natural colors in objects under conventional illumination accurately. Recently, researchers have been actively working on realizing high color-rendering lighting by incorporating red quantum dots to improve the spectrum in the long-wavelength band, which is deficient in conventional white LEDs. In particular, how to develop and apply remote quantum dot components to ensure long-term reliability is currently under active research. This paper introduces recent research on remote quantum dot components and the current status of developing high color-rendering lightings with them. Especially, we focus on various factors that are important to consider in optimizing the optical structure of the quantum dot components and discuss the future directions and prospects of research for high color-rendering lighting technology.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.12 s.354
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• pp.15-22
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• 2006

In this paper, 1.8V 8-bit 500MSPS Low-power CMOS Digital-to-Analog Converter(DAC) for UWB(Ultra Wide Band) Communication Systeme is proposed. The architecture of the DAC is based on a current steering 6+2 full matrix type which has low glitch and high linearity. In order to achieve a high speed and good performance, a current cell with a high output impedance and wide swing output range is designed. Further a thermometer decoder with same delay time and low-power switching decoder for high efficiency performance are proposed. The proposed DAC was implemented with TSMC 0.18um 1-poly 6-metal N-well CMOS technology. The measured SFDR was 49dB when the output frequency was 50MHz at 500MS/s sampling frequency. The measured INL and DNL were 0.9LSB and 0.3LSB respectively. The DAC power dissipation was 20mW and the effective chip area was $0.63mm^2$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.6
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• pp.1154-1162
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• 2016

This paper proposes a fast-transient digital LDO(Low dropout) regulator with binary-weighted current control technique. Conventional digital LDO takes a long time to stabilize the output voltage, because it controls the amount of current step by step, thus ringing problem is generated. Binary-weighted current control technique rapidly stabilizes output voltage by removing the ringing problem. When output voltage reliably reaches the target voltage, It added the FRZ mode(Freeze) to stop the operation of digital LDO. The proposed fast response digital LDO is used with a slow response DC-DC converter in the system which rapidly changes output voltage. The proposed digital controller circuit area was reduced by 56% compared to conventional bidirectional shift register, and the ripple voltage was reduced by 87%. A chip was implemented with a $0.18{\mu}F$ CMOS process. The settling time is $3.1{\mu}F$ and the voltage ripple is 6.2mV when $1{\mu}F$ output capacitor is used.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.2
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• pp.93-100
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• 2009

This paper presents a step up four channel DC-DC converter using charge pump voltage doubler structure. Our goal is to design and implement DC-DC converter for capacitive SP4T RF MEMS switch in front end module in wireless transceiver system. Charge pump structure is small and consume low power 3.3V input voltage is boosted by DC-DC Converter to $11.3{\pm}0.1V$, $12.4{\pm}0.1V$, $14.1{\pm}0.2V$ output voltage With 10MHz switching frequency. By using voltage level shifter structure, output of DC-DC converter is selected by 3.3V four channel selection signals and transferred to capacitive MEMS devices. External passive devices are not used for driving DC-DC converter. The total chip area is $2.8{\times}2.1mm^2$ including pads and the power consumption is 7.52mW, 7.82mW, 8.61mW.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.6 s.348
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• pp.53-61
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• 2006

In high speed flash type or pipelining type A/D Converter, the faster sampling frequency is, the more the effect of DC reference fluctuation is increased by clock feed-through and kick-back. When we measure A/D Converter, further, external noise increases reference voltage fluctuation. Thus reference fluctuation reduction circuit must be needed in high speed A/D converter. Conventional circuit simply uses capacitor but layout area is large and it's not efficient. In this paper, a reference fluctuation reduction circuit using transmission gate is proposed. In order to verify the proposed technique, we designed and manufactured 6bit 2GSPS CMOS A/D converter. The A/D converter is based on 0.18um 1-poly 5-metal N-well CMOS technology, and it consumes 145mW at 1.8V power supply. It occupies chip area of $977um\times1040um$. Experimental result shows that SNDR is 36.25 dB and INL/DNL ${\pm}0.5LSB$ when sampling frequency is 2GHz.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.2
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• pp.345-352
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• 2017

In this paper, a unified potentiostat which can measure the current of both $O_2$-based and $H_2O_2$-based blood glucose sensors with low supply voltage of 1.0V has been designed and verified by simulations and measurements. Potentiostat is composed of low-voltage operational transconductance amplifier, cascode current mirrors and mode-selection circuits. It can measure currents of blood glucose chemical reactions occurred by $O_2$ or $H_2O_2$. The body of PMOS input differentional stage of the operational transconductance amplifier is forward-biased to reduce the threshold voltage for low supply voltage operation. Also, cascode current mirror is used to reduce current measurement error generated by channel length modulation effects. The proposed low-voltage potentiostat is designed and simulated using Cadence SPECTRE and fabricated in Magnachip 0.18um CMOS technology with chip size of $110{\mu}m{\times}60{\mu}m$. The measurement results show that consumption current is maximum $46{\mu}A$ at supply voltage of 1.0V. Using the persian potassium($K_3Fe(CN)_6$) equivalent to glucose, the operation of the fabricated potentiostat was confirmed.

• Journal of the Korea Organic Resources Recycling Association
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• v.30 no.3
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• pp.5-12
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• 2022

This study suggests the effective recycling method of sludge waste from various industrial fields to synthesize uniform colloidal silica nanoparticles. In detail, polymers are removed from the sludge waste to attain sludge-extracted silica (s-SiO₂) micron-sized particles, and ammonia assisted sonication is applied to s-SiO₂, which has effectively extracted the silanol precursor. The nano-sized silica (n-SiO₂) particles are successfully synthesized by a typical sol-gel method using silanol precursor. Also, the yield amounts of n-SiO₂ are determined by the function of s-SiO₂ etching time. Finally, n-SiO₂-based slurry is synthesized for the practical CMP application. As a result, rough-surfaced semiconductor chip is successfully polished by the n-SiO₂-based slurry to exhibit the mirror-like clean surface. In this regard, sludge wastes are successfully prepared as valuable semicondutor grade materials.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.12
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• pp.54-60
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• 2007

This paper proposes a built-in-self-repair (BISR) structure using 2-dimensional spare memory to effectively self-repair faults of an embedded memory. In case of multiple faults in the same row (column) of an embedded memory, the previous method using 1-D spare column (row) memory needs the same number of spare memory columns (rows) as the number of faults to self-repair them. while the new method using 2-D spare memory needs only one spare row (column) to self-repair them. Also, the virtual divided memory is adopted to be able to self-repair using not a full spare column memory but the only partial spare column memory corresponding to the faults. A self-repair circuit with $64\times1-bit$ core memory and $2\times8$ 2-D spare memory is designed. And the circuit includes a built-in-self-test block using the 13N March algorithm. The circuit has been implemented using the $0.25{\mu}m$ MagnaChip CMOS process and has $1.1\times0.7mm^2$ chip area with 10,658 transistors.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.6
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• pp.122-130
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• 2013

The demand and the supply are increasing sharply in accordance with the growth of the Memory Semiconductor Industry. The Flash Memory above all is being utilized substantially in the Industry of smart phone, the tablet PC and the System on Chip (SoC). The Flash Memory is divided into the NOR-type Flash Memory and the NAND-type Flash Memory. A lot of study such as the Built-In Self Test (BIST), the Built-In Self Repair (BISR) and the Built-In Redundancy Analysis (BIRA), etc. has been progressed in the NOR-type fash Memory, the study for the Built-In Self Test of the NAND-type Flash Memory has not been progressed. At present, the pattern test of the NAND-type Flash Memory is being carried out using the outside test equipment of high price. The NAND-type Flash Memory is being depended on the outside equipment as there is no Built-In Self Test since the erasure of block unit, the reading and writing of page unit are possible in the NAND-type Flash Memory. The Built-In Self Test equipped with 2 kinds of finite state machine based structure is proposed, so as to carry out the pattern test without the outside pattern test equipment from the NAND-type Flash Memory which carried out the test dependant on the outside pattern test equipment of high price.