• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.3
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• pp.401-410
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• 2017

In this work, we show that the excessive lattice heating problem due to parasitic pnp transistor action in the diode electrostatic discharge (ESD) protection device in the diode input protection circuit, which is favorably used in CMOS RF ICs, can be solved by adopting a symmetrical cathode structure. To explain how the recipe works, we construct an equivalent circuit for input human-body model (HBM) test environment of a CMOS chip equipped with the diode protection circuit, and execute mixed-mode transient simulations utilizing a 2-dimensional device simulator. We attempt an in-depth comparison study by varying device structures to suggest valuable design guidelines in designing the protection diodes connected to the $V_{DD}$ and $V_{SS}$ buses. Even though this work is based on mixed-mode simulations utilizing device and circuit simulators, the analysis given in this work clearly explain the mechanism involved, which cannot be done by measurements.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.459-460
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• 2008

In this paper, a 10Gbps clock and data recovery circuit is designed in $0.18{\mu}m$ CMOS technology. The circuit incorporates a multiphase LC oscillator, a quarter-rate Bang-Bang phase detector, a charge pump and a second order loop filter. The simulation results show that the designed circuit has a peak-to-peak clock jitter of 4.2ps and a peak-to-peak recovered data jitter of 8ps while consuming about 80mW from a 1.8V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.4
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• pp.42-50
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• 2003

This paper presents an embedded RC oscillator which has temperature compensation circuits. The conventional RC oscillator has frequency deviation about 15%, which is caused by variation of resistors and the reference voltage of schmitt trigger from the temperature condition. In this paper, the proposed circuit use a CMOS bandgap reference having balanced current temperature coefficients as a triggering voltage of schmitt trigger. The constant current sources consist of current mirror circuit with the positive and negative temperature coefficient. The proposed circuit shows less 3% frequency deviation for variation of temperature, supply voltage and process parameters.

• Proceedings of the IEEK Conference
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• summer
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• pp.221-224
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• 2004

This paper proposed an ultra low-power CMOS exponential voltage-mode circuit using the Pseudo-exponential function for realizing the exponential characteristics. The proposed circuit provides high dB-linear output voltage range at low-voltage applications. In a $0.25\;\mu m$ CMOS process, the simulations show more than 35 dB output voltage range and 26 dB with the linearity error less than $\pm0.5\;dB.$ The average current consumption is less than 80 uA. The proposed circuit can be used for the design of an extremely low-power variable gain amplifier (VGA) and automatic gain control (AGC).

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.197-198
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• 2007

In this paper, a 10Gbps Clock and Data Recovery circuit is designed in $0.18{\mu}m$ CMOS Technology. The circuit incorporates a multiphase LC oscillator, a quarter-rate Bang-Bang phase detector, a Charge Pump and a second order loop filter. The simulation results show that the designed circuit has a peak-to-peak clock jitter of 4.1ps and a peak-to-peak recovered data jitter of 8ps while consuming about 44mW from a 1.8V supply.

• ETRI Journal
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• v.44 no.5
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• pp.837-848
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• 2022

Analog circuit design is comparatively more complex than its digital counterpart due to its nonlinearity and low level of abstraction. This study proposes a novel low-level hybrid of the sine-cosine algorithm (SCA) and modified grey-wolf optimization (mGWO) algorithm for machine learning-based design automation of CMOS analog circuits using an all-CMOS voltage reference circuit in 40-nm standard process. The optimization algorithm's efficiency is further tested using classical functions, showing that it outperforms other competing algorithms. The objective of the optimization is to minimize the variation and power usage, while satisfying all the design limitations. Through the interchange of scripts for information exchange between two environments, the SCA-mGWO algorithm is implemented and simultaneously simulated. The results show the robustness of analog circuit design generated using the SCA-mGWO algorithm, over various corners, resulting in a percentage variation of 0.85%. Monte Carlo analysis is also performed on the presented analog circuit for output voltage and percentage variation resulting in significantly low mean and standard deviation.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1561-1564
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• 2004

A CMOS-based Electronically Tunable Capacitance Multipliers, which can be magnified the value of a grounded unit capacitance, is presented in this article. The multiplication factor is varied by the ratio of the bias currents. The proposed circuit is simple, small in size and suitable for implementing in standard CMOS process. PSPICE simulation results demonstrating the characteristics of the proposed circuit are included.

• Proceedings of the IEEK Conference
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• 2003.11a
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• pp.103-106
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• 2003

An oscillatory neural network circuit has been designed and fabricated in an 0.5 ${\mu}{\textrm}{m}$ double poly CMOS technology. The proposed oscillatory neural network consists of 3 neural oscillator cells with excitatory synapses and a neural oscillator cell with inhibitory synapse. Simulations of a network of oscillators demonstrate cooperative computation. Measurements of the fabricated chip in condition of $\pm$ 2.5 V power supply is shown.

• ETRI Journal
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• v.32 no.3
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• pp.457-459
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• 2010

A low-power down-sampling mixer in a low-power digital 65 nm CMOS technology is presented. The mixer consumes only 830 ${\mu}W$ at 1.2 V supply voltage by combining an NMOS and a PMOS mixer with cascade transistors at the output. The measured gain is (19 ${\pm}$1 dB) at frequencies between 100 MHz and 3 GHz. An IIP3 of -5.9 dBm is achieved.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.