1 |
Bifano, T.G., Bierden, P., Cornelissen, S., Dimas, C., Lee, H., Miller, M. and Perreault, J., 'Large scale metal MEMS mirror array with integrated electronics,' Proceedings of SPIE: Design, Test, Integration, & Packaging of MEMS/MOEMS, Vol. 4755, pp. 467-476, 2002
|
2 |
Hornbeck, L. J., 'Current status of the digital micro mirror device (DMD) for projection television application,' Technical Digest of International Electron Devices Meeting, pp. 381-384, 1993
DOI
|
3 |
Van de Van, E. P., Martin, R. S. and Berman, M. J., 'High Rate PECVD to Reduce Hillock Growth in Aluminum Interconnects,' Proceedings of the 4th International IEEE VLSI Multilevel Interconnection Conference, pp. 434-439, 1987
|
4 |
Nasby, R. D., Sniegowski, J. J., Smith, J. H., Montague, S., Barron, C. C., Eaton, W. P., McWhorter, P. J., Hetherington, D. L., Apblett, C. A. and Fleming, J. G., 'Application of Chemical-Mechanical Polishing to Planarization of Surface-Micromachined Devices,' Technical Digest of the Solid State Sensor and Actuator Workshop, pp. 48-53 1996
|
5 |
Lee, J. B., English, J., Ahn, C. H. and Allen, M. G., 'Planarization Techniques for Viertically Integrated Metallic MEMS on Silicon Foundry Circuits,' Journal of Micromechanics and Microengineering, Vol. 7, pp. 44-54, 1997
DOI
ScienceOn
|
6 |
Zheng, Y., Dutta, M., Kotecki, C. and Zincke, C. 'Planarization for the Integration of CMOS and Micro Mirror Arrays,' Proceedings of SPIE: Metrology, inspection, and process control for microlithography XVI, Vol. 4689, pp. 1070-1076, 2002
DOI
|
7 |
Ryan, J. G., Geffken, R. M., Poulin, N. R. and Paraszczak, J. R., 'The Evolution of Interconnection Technology at IBM,' IBM Journal of Research and Development, Vol. 39, No. 4, pp. 371-381, 1995
DOI
|
8 |
Sniegowski, J. J., Rodgers, M. S., 'Multi-Layer Enhancement to Polysilicon Surface Micromachining Technology,' Technical Digest of International Electron Devices, pp. 903-906, 1997
DOI
|
9 |
Cote, D. R., Nguyen, S. V., Cote, W. J., Pennington, S. L., Stamper, A. K. and Podlesnik, D. V., 'Low Temperature Chemical Vapor Deposition Processes and Dielectrics for Microelectric Circuit Manufacturing at IBM,' IBM Journal of Research and Development, Vol. 39, No. 4, pp. 437-463, 1995
DOI
|