• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.4
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• pp.314-321
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• 2006

There have been great demands for higher density SRAM in all area of SRAM applications, such as mobile, network, cache, and embedded applications. Therefore, aggressive shrinkage of 6 T Full CMOS SRAM had been continued as the technology advances. However, conventional 6 T Full CMOS SRAM has a basic limitation in the cell size because it needs 6 transistors on a silicon substrate compared to 1 transistor in a DRAM cell. The typical cell area of 6 T Full CMOS SRAM is $70{\sim}90\;F^2$, which is too large compared to $8{\sim}9\;F^2$ of DRAM cell. With 80 nm design rule using 193 nm ArF lithography, the maximum density is 72 Mbits at the most. Therefore, pseudo SRAM or 1 T SRAM, whose memory cell is the same as DRAM cell, is being adopted for the solution of the high density SRAM applications more than 64 M bits. However, the refresh time limits not only the maximum operation temperature but also nearly all critical electrical characteristics of the products such as stand_by current and random access time. In order to overcome both the size penalty of the conventional 6 T Full CMOS SRAM cell and the poor characteristics of the TFT load cell, we have developed S3 cell. The Load pMOS and the Pass nMOS on ILD have nearly single crystal silicon channel according to the TEM and electron diffraction pattern analysis. In this study, we present $S^3$ SRAM cell technology with 100 nm design rule in further detail, including the process integration and the basic characteristics of stacked single crystal silicon TFT.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.35S no.9
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• pp.9-18
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• 1998

A single RF transceiver chip for an extended GSM handset application was designedm, fabricated and evaluated. A RFIC was fabricated by using silicon BiCMOS process, and then packaged in 80 pin TQFP of $10 {\times} 10 mm^{2}$ in size. As a result, it was achieved guite reasonable integraty and good RF performance at the operation voltage of 3.3V. This paper describes development results of RF receiver section of the RFIC, which includes LNA, down conversion mixer, AGC, switched capacitor filter and down sampling mixer. The test results show that RF receiver section is well operated within frequency range of 925 ~960 MHz, which is defined on the extended GSM specification (E-GSM). The receiver section also reveals moderate power consumption of 67 mA and minimum detectable signal of -105 dBm.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.8
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• pp.1-10
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• 2008

In this paper, we describe a design of a 128bit MRAM based on a new switching architecture which is Local Field Switching(LFS). LFS uses a local magnetic field generated by the current flowing through an MTJ. This mode reduces the writing current since small current can induce large magnetic field because of close distance between MTJ and the current. It also improves the cell selectivity over using conventional MTJ architecture because it doesn't need a digit line for writing. The MRAM has 1-Transistor 1-Magnetic Tunnel Junction (IT-1MTJ) memory cell structure and uses a bidirectional write driver, a mid-point reference cell block and a current mode sense amplifier. CMOS emulation cell is adopted as an LFS-MTJ cell to verify the operation of the circuit without the MTJ process. The memory circuit is fabricated using a $0.18{\mu}m$ CMOS technology with six layers o) metal and tested on custom board.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.12
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• pp.941-947
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• 2017

This paper reports a fractional-N phase-locked-loop(PLL) frequency synthesizer that is implemented in a $0.35-{\mu}m$ standard CMOS process and generates a quadrature signal for an FRS terminal. The synthesizer consists of a voltage-controlled oscillator(VCO), a charge pump(CP), loop filter(LF), a phase frequency detector(PFD), and a frequency divider. The VCO has been designed with an LC resonant circuit to provide better phase noise and power characteristics, and the CP is designed to be able to adjust the pumping current according to the PFD output. The frequency divider has been designed by a 16-divider pre-scaler and fractional-N divider based on the third delta-sigma modulator($3^{rd}$ DSM). The LF is a third-order RC filter. The measured results show that the proposed device has a dynamic frequency range of 460~510 MHz and -3.86 dBm radio-frequency output power. The phase noise of the output signal is -94.8 dBc/Hz, and the lock-in time is $300{\mu}s$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.11
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• pp.35-42
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• 2004

A CMOS folding ADC with transistor differential pair folding circuit for low power consumption and high speed operation is presented in this paper. This paper explains the theory of transistor differential pair folding technique and many advantages compared with conventional folding and interpolation circuits. A ADC based on transistor differential pair folding circuit uses 16 fine comparators and 32 interpolation resistors. So it is possible to achieve low power consumption, high speed operation and small chip size. Design technology is based on fully standard 0.25${\mu}{\textrm}{m}$ double poly 2 metal n-well CMOS process. A power consumption is 45mW at 2.5V applied voltage and 250MHz sampling frequency. The INL and DNL are within $\pm$0.15LSB and $\pm$0.15LSB respectively. The SNDR is approximately 50dB at 10MHz input frequency.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.8A
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• pp.1252-1258
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• 1999

This paper describes a COMS IF transceiver IC for 10-MHz bandwidth wireless local loops. It interfaces between the RF section and the digital MODEM section and performs the IF-to-baseband (Rx) and baseband-to-IF (Tx) frequency conversions. The chip incorporates variable gain amplifiers, phase-locked loops, low pass filters, analog-to-digital and digital-to-analog converters. It has been implemented in a 0.6 -${\mu}{\textrm}{m}$ 2-poly 3-metal CMOS process. The phase-locked loops include voltage-controlled oscillators, dividers, phase detectors, and charge pumps on chip. The only external complonents are the filter and the varactor-tuned LC tank circuit. The chip size is 4 mm $\times$ 4 mm and the total supply current is about 57 mA at 3.3 V.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.6
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• pp.119-124
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• 2008

Transimpedance amplifier(TIA) is the most significant element to determine the performance of the optical receiver, and thus the TIA must satisfy tile design requirements of high gain and wide bandwidth. In f)is paper, we propose a novel single chip optical receiver that exploits an analog adaptive equalizer and a limiting amplifier to enhance the gain and bandwidth performance, respectively. The proposed optical receiver is designed by using a $0.13{\mu}m$ CMOS process and its post-layout simulations show $120dB{\Omgea}$ transimpedance gain and 5.88GHz bandwidth. The chip core occupies the area of $0.088mm^2$, due to utilizing the negative impedance converter circuit rather than using on-chip passive inductors.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.37 no.4
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• pp.28-34
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• 2000

In this paper, a continuous-time filter for low voltage and high frequency applications using fully-balanced current integrators is presented. As the balanced structure of integrator circuits, the designed filter has improved noise characteristics and wide dynamic range since even-order harmonics are cancelled and the input signal range is doubled. Using complementary current mirrors, bias circuits are simplified and the cutoff frequency of filters can be controlled easily by a single DC bias current. As a design example, the 3rd-order lowpass Butterworth filter with a leapfrog realization is designed. The designed fully-balanced current-mode filter is simulated and examined by SPICE using 0.65${\mu}{\textrm}{m}$ CMOS n-well process parameters. The simulation results show 50MHz cutoff frequency, 69㏈ dynamic range with 1% total harmonic distortion(THD), and 4㎽ power dissipation with a 3V supply voltage.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.7
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• pp.23-29
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• 2011

A dB-linearity improved variable gain amplifier (VGA) for GPS receiver is presented. The Proposed dB-linear current generator has improved dB-linearity error of ${\pm}0.15$dB. The VGA for GPS is designed using proposed dB-linear current generator and composed of 3 stage amplifiers. The IF frequency is assumed as 4MHz and the linearity requirement of the VGA for GPS receiver is defined as 24dBm of IIP3 using cascaded IIP3 equation and the VGA satisfies 24dBm when minimum gain mode. The DC-offset voltage is eliminated using DC-offset cancelation loop. The gain range is from -8dB to 52dB and the dB-linearity error satisfies ${\pm}0.2$dB. The 3-dB frequency has range of 35MHz~106MHz for the gain range. The VGA is designed using 0.18${\mu}m$ CMOS process. The power consumption is 3mW with 1.8V supply voltage.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.1
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• pp.52-59
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• 2010

This paper proposes a high-resolution and high-frame rate CMOS image sensor with column-wise cyclic ADC. The proposed ADC uses the sharing techniques of OTAs and capacitors for low-power consumption and small silicon area. The proposed ADC was verified implementing the prototype chip as QVGA image sensor. The measured maximum frame rate is 120 fps, and the power consumption is 130 mW. The power supply is 3.3 V, and the die size is $4.8\;mm\;{\times}\;3.5\;mm$. The prototype chip was fabricated in a 2-poly 3-metal $0.35-{\mu}m$ CMOS process.