• Title/Summary/Keyword: 폴딩 ADC

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A 9-b 2MS/s Cyclic Folding ADC for Battery Management Systems (배터리 관리 시스템을 위한 9-b 2MS/s 사이클릭 폴딩 ADC)

  • Kwon, Min-A;Kim, Dae-Yun;Song, Min-Kyu
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.49 no.3
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    • pp.1-7
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    • 2012
  • A 9b MS/s CMOS cyclic folding A/D converter (ADC) for intelligent battery sensor and battery management systems is proposed. The proposed ADC structure is based on a cyclic architecture to reduce chip area and power consumption. To obtain a high speed ADC performance, further, we use a folding-interpolating structure. The prototype ADC implemented with a 0.35um 2P4M n-well CMOS process shows a measured INL and DNL of maximum 1.5LSB and 1.0LSB, respectively. The ADC demonstrates a maximum SNDR and SFDR of 48dB and 60dB, respectively, and the power consumption is about 110mW at 2MS/s and 3.3V. The occupied active die area is $10mm^2$.

A Design of 250-MSamples/s 8-Bit Folding Analog to Digital Converter using Transistor Differential Pair Folding Technique (트랜지스터 차동쌍 폴딩 기법을 적용한 250-MSamples/s 8-비트 폴딩 아날로그-디지털 변환기의 설계)

  • 이돈섭;곽계달
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.41 no.11
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    • pp.35-42
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    • 2004
  • A CMOS folding ADC with transistor differential pair folding circuit for low power consumption and high speed operation is presented in this paper. This paper explains the theory of transistor differential pair folding technique and many advantages compared with conventional folding and interpolation circuits. A ADC based on transistor differential pair folding circuit uses 16 fine comparators and 32 interpolation resistors. So it is possible to achieve low power consumption, high speed operation and small chip size. Design technology is based on fully standard 0.25${\mu}{\textrm}{m}$ double poly 2 metal n-well CMOS process. A power consumption is 45mW at 2.5V applied voltage and 250MHz sampling frequency. The INL and DNL are within $\pm$0.15LSB and $\pm$0.15LSB respectively. The SNDR is approximately 50dB at 10MHz input frequency.

A 250MS/s 8 Bit CMOS folding and Interpolating AD Converter with 2 Stage Architecture (2단 구조를 사용한 250MS/s 8비트 CMOS 폴딩-인터폴레이팅 AD 변환기)

  • 이돈섭;곽계달
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.8 no.4
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    • pp.826-832
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    • 2004
  • A CMOS 8 bit folding and interpolating ADC for an embedded system inside VLSI is presented in this paper. This folding ADC uses the 2 stage architecture for improving of nonlinearity. repeating the folding and interpolating twice. At a proposed structure, a transistor differential pair operates on the second folder. A ADC with 2 stage architecture reduces the number of comparators and resisters. So it is possible to provide small chip size, low power consumption and high operating speed. The design technology is based on fully standard 0.25m double-Poly 2 metal n-well CMOS Process. The simulated Power consumption is 45mW with an applied voltage of 2.5V and sampling frequency of 250MHz. The INL and DNL are within <ㅆㄸㅌ>$\pm$0.2LSB, respectively. The SNDR is approximately 45dB for input frequency of 10MHz.

An 1.2V 8-bit 800MSPS CMOS A/D Converter with an Odd Number of Folding Block (홀수개의 폴딩 블록으로 구현된 1.2V 8-bit 800MSPS CMOS A/D 변환기)

  • Lee, Dong-Heon;Moon, Jun-Ho;Song, Min-Kyu
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.7
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    • pp.61-69
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    • 2010
  • In this paper, an 1.2V 8b 800MSPS A/D Converter(ADC) with an odd number of folding block to overcome the asymmetrical boundary-condition error is described. The architecture of the proposed ADC is based on a cascaded folding architecture using resistive interpolation technique for low power consumption and high input frequency. The ADC employs a novel odd folding block to improve the distortion of signal linearity and to reduce the offset errors. In the digital block, furthermore, we use a ROM encoder to convert a none-$2^n$-period code into the binary code. The chip has been fabricated with an $0.13{\mu}m$ 1P6M CMOS technology. The effective chip area is $870{\mu}m\times980{\mu}m$. SNDR is 44.84dB (ENOB 7.15bit) and SFDR is 52.17dBc, when the input frequency is 10MHz at sampling frequency of 800MHz.

An 1.2V 10b 500MS/s Single-Channel Folding CMOS ADC (1.2V 10b 500MS/s 단일채널 폴딩 CMOS A/D 변환기)

  • Moon, Jun-Ho;Park, Sung-Hyun;Song, Min-Kyu
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.1
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    • pp.14-21
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    • 2011
  • A 10b 500MS/s $0.13{\mu}m$ CMOS ADC is proposed for 4G wireless communication systems such as a LTE-Advanced and SDR The ADC employs a calibration-free single-channel folding architecture for low power consumption and high speed conversion rate. In order to overcome the disadvantage of high folding rate, at the fine 7b ADC, a cascaded folding-interpolating technique is proposed. Further, a folding amplifier with the folded cascode output stage is also discussed in the block of folding bus, to improve the bandwidth limitation and voltage gain by parasitic capacitances. The chip has been fabricated with $0.13{\mu}m$ 1P6M CMOS technology, the effective chip area is $1.5mm^2$. The measured results of INL and DNL are within 2.95LSB and l.24LSB at 10b resolution, respectively. The SNDR is 54.8dB and SFDR is 63.4dBc when the input frequency is 9.27MHz at sampling frequency of 500MHz. The ADC consumes 150mW($300{\mu}W/MS/s$) including peripheral circuits at 500MS/s and 1.2V(1.5V) power supply.

A 8b 1GS/s Fractional Folding-Interpolation ADC with a Novel Digital Encoding Technique (새로운 디지털 인코딩 기법을 적용한 8비트 1GS/s 프랙셔널 폴딩-인터폴레이션 ADC)

  • Choi, Donggwi;Kim, Daeyun;Song, Minkyu
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.1
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    • pp.137-147
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    • 2013
  • In this paper, an 1.2V 8b 1GS/s A/D Converter(ADC) based on a folding architecture with a resistive interpolation technique is described. In order to overcome the asymmetrical boundary-condition error of conventional folding ADCs, a novel scheme with an odd number of folding blocks and a fractional folding rate are proposed. Further, a new digital encoding technique with an arithmetic adder is described to implement the proposed fractional folding technique. The proposed ADC employs an iterating offset self-calibration technique and a digital error correction circuit to minimize device mismatch and external noise The chip has been fabricated with a 1.2V 0.13um 1-poly 6-metal CMOS technology. The effective chip area is $2.1mm^2$ (ADC core : $1.4mm^2$, calibration engine : $0.7mm^2$) and the power dissipation is about 350mW including calibration engine at 1.2V power supply. The measured result of SNDR is 46.22dB, when Fin = 10MHz at Fs = 1GHz. Both the INL and DNL are within 1LSB with the self-calibration circuit.

A 500MSamples/s 6-Bit CMOS Folding and Interpolating AD Converter (500MSamples/s 6-비트 CMOS 폴딩-인터폴레이팅 아날로그-디지털 변환기)

  • Lee Don-Suep;Kwack Kae-Dal
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.8 no.7
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    • pp.1442-1447
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    • 2004
  • In this paper, a 6-Bit CMOS Folding and Interpolating AD Converter is presented. The converter is considered to be useful as an integrated part of a VLSI circuit handling both analog and digital signals as in the case of HDD or LAN applications. A built-in analog circuit for VLSI of a high-speed data communication requires a small chip area, low power consumption, and fast data processing. The proposed folding and interpolating AD Converter uses a very small number of comparators and interpolation resistors, which is achieved by cascading a couple of folders working in different principles. This reduced number of parts is a big advantage for a built-in AD converter design. The design is based on 0.25m double-poly 2 metal n-well CMOS process. In the simulation, with the applied 2.5V and a sampling frequency of 500MHz, the measurements are as follows: power consumption of 27mw, INL and DNL of $\pm$0.1LSB, $\pm$0.15LSB each, SNDR of 42dB with an input signal of 10MHz.

Design of a Low Power 3V 6-bit 100MSPS CMOS ADC for DBS Receiver (위성방송 수신기용 저전력 3V 6-bit 100MSPS COMS ADC의 설계)

  • Moon, Jae-Jun;Song, Min-Kyu
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.36C no.12
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    • pp.20-26
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    • 1999
  • A CMOS 6-bit 100MSPS ADC for DBS receiver is designed. The proposed ADC is composed of folding block, latch block, and digital block. The cascode interpolating block and kickback reduced latch are proposed with a high speed architecture. To verify the performance of ADC, simulations are carried out by HSPICE. The ADC achieves a clock frequency of 100MHz with a power dissipation of 40mW for 3 V supply voltage. The active chip area is $1500{\mu}m{\times}1000{\mu}m$with $0.65{\mu}m$ 2-poly 2-metal CMOS process. Further, INL and DNL are within ${\pm}0.6LSB$, ${\pm}0.5LSB$, respectively. SNDR is about 33dB at 10MHz input frequency.

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Design of a programmable current-mode folding/interpolation CMOS A/D converter (프로그래머블 전류모드 폴딩 . 인터폴레이션 CMOS A/D 변환기 설계)

  • 김형훈
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.45-48
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    • 2001
  • An programmable current-mode folding and interpolation analog to digital converter (ADC) with programmable interpolator is proposed in this paper. A programmable interpolator is employed not only to vary the resolution of data converter, but also to decrease a power dissipation within the ADC. Because of varying the number of interpolation circuits, resolution is vary from 6 to 10bit. The designed ADC fabricated by a 0.6${\mu}{\textrm}{m}$ n-well CMOS double metal/single poly process. The experimental result shows the power dissipation from 26 to 87mW with a power supply of 3.3V.

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Design of a 12 bit current-mode folding/interpolation CMOS A/D converter (12비트 전류구동 폴딩.인터폴레이션 CMOS A/D 변환기 설계)

  • 김형훈;윤광섭
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.986-989
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    • 1999
  • An 12bit current-mode folding and interpolation analog to digital converter (ADC) with multiplied folding amplifiers is proposed in this paper. A current - mode multiplied folding amplifier is employed not only to reduced the number of reference current source, but also to decrease a power dissipation within the ADC. The designed ADC fabricated by a 0.6${\mu}{\textrm}{m}$ n-well CMOS double metal/single poly process. The simulation result shows the power dissipation of 280㎽ with a power supply of 5V.

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