• Journal of IKEEE
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• v.1 no.1 s.1
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• pp.11-18
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• 1997

By utilizing the technique to monitor the DC cell node voltages through circuit simulation, degradation of the static read operating margin In high load-resistor SRAM cell was examined, which is caused by parasitic resistances and transistor asymmetries in this cell structure. By selectively adding the parasitic resistances to an ideal cell, the influence of each parasitic resistance on the operating margin was examined, and then the cases with parasitic resistances in pairs were also examined. By selectively changing the channel width of cell transistors to generate cell asymmetry, the influence of cell asymmetry on the operating margin was also examined. Analyses on the operating margins were performed by comparing the supply voltage values at which two cell node voltages merge to a single value and the differences of cell node voltages at VDD=5V in the simulated node voltage characteristics. By determining the parasitic resistances and the transistor asymmetries which give the most serious effect on the static read-operation of SRAM cell from this analysis based on circuit simulated, a criteria was provided, which can be referred in the design of new SRAM cell structures.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.9
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• pp.673-684
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• 2003

A degenerated differential pair has been widely used as a standard topology for digitally programmable CMOS VGAs. A variable degeneration resistor has been implemented using a resistor string or R-2R ladder with MOSFET switches. However, in the VGAs using these conventional methods, low-voltage and high-speed operation is very hard to achieve due to the dc voltage drop over the degeneration resistor. To overcome this problem a new variable degeneration resistor is proposed where the dc voltage drop is almost removed. Using the proposed gain control scheme, a low-voltage and high-speed CMOS VGA is designed. HSPICE simulation results using a 0.25${\mu}{\textrm}{m}$ CMOS process parameters show that the designed VGA provides a 3dB bandwidth of 360MHz and a 80dB gain control range in 2dB step. Gain errors are less than 0.4dB at 200MHz and less than l.4dB at 300MHz. The designed circuit consumes 10.8mA from a 2.5V supply and its die area is 1190${\mu}{\textrm}{m}$${\times}$360${\mu}{\textrm}{m}$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.3
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• pp.486-495
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• 2006

In this paper, a low-power 1Kb synchronous EEPROM is designed with flash cells for passive UHF RFID tag chips. To make a low-power EEPROM, four techniques are newly proposed. Firstly, dual power supply voltages VDD(1.5V) and VDDP(2.5V), are used. Secondly, CKE signal is used to remove switching current due to clocking of synchronous circuits. Thirdly, a low-speed but low-power sensing scheme using clocked inverters is used instead of the conventional current sensing method. Lastly, the low-voltage, VDD for the reference voltage generator is supplied by using the Voltage-up converter in write cycle. An EEPROM is fabricated with the $0.25{\mu}m$ EEPROM process. Simulation results show that power dissipations are $4.25{\mu}W$ in the read cycle and $25{\mu}W$ in the write cycle, respectively. The layout area is $646.3\times657.68{\mu}m^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.6
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• pp.18-24
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• 2012

This paper reports the test results of a 50MHz/s 10 bits DAC developed with $0.18{\mu}m$ CMOS process for the wireless sensor network application. The 10bits DAC, not likely a typical segmented type, has been designed as a current driving type with double step thermometer decoding architecture in which 10bits are divided into 6bits of MSB and 4bits of LSB. MSB 6bits are converted into 3 bits row thermal codes and 3 bits column thermal codes to control high current cells, and LSB 4 bits are also converted into thermal codes to control the lower current cells. The high and the lower current cells use the same cell size while a bias circuit has been designed to make the amount of lower unit current become 1/16 of high unit current. All thermal codes are synchronized with output latches to prevent glitches on the output signals. The test results show that the DAC consumes 4.3mA DC current with 3.3V DC supply for 2.2Vpp output at 50MHz clock. The linearity characteristics of DAC are the maximum SFDR of 62.02dB, maximum DNL of 0.37 LSB, and maximum INL of 0.67 LSB.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.13-20
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• 2008

This paper describes the design of low power 12bit Digital-to-Analog Converter(D/A Converter) using Pseudo-Segmentation method which shows the conversion rate of 80MHz and the power supply of 1.8V with 0.18um CMOS n-well 1-poly 6-metal process for advanced wireless communication system. Pseudo-segmentation method used in binary decoder consists of simple parallel buffer is employed for low power because of simpler configuration than that of thermometer decoder. Also, using deglitch circuit and swing reduced drivel reduces a switching noise. The measurement results of the proposed low power 12bit 80MHz CMOS D/A Converter shows SFDR is 66.01dBc at sampling frequency 80MHz, input frequency 1MHz and ENOB is 10.67bit. Integral nonlinearity(INL) / Differential nonlinearity(DNL) have been measured ${\pm}1.6LSB/{\pm}1.2LSB$. Glich energy is measured $49pV{\cdot}s$. Power dissipation is 46.8mW at 80MHz(Maximum sampling frequency) at a 1.8V power supply.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.6
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• pp.2747-2753
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• 2011

In this paper, a PWM current-mode DC-DC boost converter for mobile phone flash application has been proposed. The converter which is operated with 5 Mhz high switching frequency is capable of reducing mounting area of passive devices such as inductor and capacitor, consequently is suitable for compact mobile phones. This boost converter consists of a power stage and a control block. Circuit elements of the power stage are inductor, output capacitor, MOS transistors and feedback resistors. Meanwhile, the control block consists of pulse width modulator, error amplifier, oscillator etc. Proposed boost converter has been designed and verified in a $0.5\;{\mu}m$ 1-poly 2-metal CMOS process technology. Simulation results show that the output voltage is 4.26 V in 3.7 V input voltage, output current 100 mA which is larger than 25 ~ 50 mA in conventional 500 Khz driven converter when the duty ratio is 0.15.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.12 s.354
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• pp.55-64
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• 2006

This work proposes a calibration-free 14b 70MS/s 0.13um CMOS ADC for high-performance integrated systems such as WLAN and high-definition video systems simultaneously requiring high resolution, low power, and small size at high speed. The proposed ADC employs signal insensitive 3-D fully symmetric layout techniques in two MDACs for high matching accuracy without any calibration. A three-stage pipeline architecture minimizes power consumption and chip area at the target resolution and sampling rate. The input SHA with a controlled trans-conductance ratio of two amplifier stages simultaneously achieves high gain and high phase margin with gate-bootstrapped sampling switches for 14b input accuracy at the Nyquist frequency. A back-end sub-ranging flash ADC with open-loop offset cancellation and interpolation achieves 6b accuracy at 70MS/s. Low-noise current and voltage references are employed on chip with optional off-chip reference voltages. The prototype ADC implemented in a 0.13um CMOS is based on a 0.35um minimum channel length for 2.5V applications. The measured DNL and INL are within 0.65LSB and l.80LSB, respectively. The prototype ADC shows maximum SNDR and SFDR of 66dB and 81dB and a power consumption of 235mW at 70MS/s. The active die area is $3.3mm^2$.

• Fire Science and Engineering
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• v.31 no.3
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• pp.63-72
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• 2017

This study fabricated a low-voltage 10 circuit distribution board based on the KEMC (Korea Electrical Manufacturers Cooperative) 2102-610 standard and performed a characteristics assessment of the developed 10 circuit distribution board to secure product stability. The developed 10 circuit distribution board is designed to have the characteristics of insulation materials, as well as resistance to corrosion ultraviolet radiation and mechanical impact. The developed distribution board is fabricated to have an appropriate protection class of enclosure, electric shock prevention and protection circuits, switchgear and its components, internal electrical circuits and connectors, external conduct terminal, insulation characteristics, temperature rise test, heat resistance, etc. The developed 10 circuit distribution board consists of a single phase circuit and 3-phase circuits. It is possible to measure in real time the leakage current generated from the load distribution line by installing a sensor module at the load side of each of the branched switchgears. In addition, it is possible to increase a circuit according to the use and purpose of the load and to also manage and check the load in real time. Temperature rise tests were performed on the developed 10 circuit distribution board at 18 places including the inlet connection, main circuit and distribution circuit bus bars and bus bar supports, etc. The highest temperature of $65.3^{\circ}C$ was measured at the R-Phase of the connection of the MCCB power supply for the branch circuit bus bar and a temperature rise of $61.6^{\circ}C$ was measured at the T-Phase of the load side. When applying thermal stress to an MCCB for 6 hours at $180^{\circ}C$ using a heat resistant experimental device, it was found that the actuator lever was transformed and moved in the tripped state.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.6
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• pp.55-66
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• 2016

Power gating is one of effective techniques for reducing leakage current in semiconductor chip. However, power gating cell (PGC) which is used to switch the power source causes performance degradation and the associated reliability problem by increasing IR drop. However, the newly raised problem caused by different scaling properties between gates and metal wires demands additional considerations in power gating design. In this paper, we propose a robust cell placement based power gating design method for reducing the area for power gating cell and metal routing thus to meet IR drop requirement. Experimental results by applying the proposed techniques on the application processor for smartphone fabricated in 28nm CMOS process show that power gating cell area is reduced by 16.16% and maximum IR drop value is also decreased by 8.49% compared to existing power gating cell placement techniques.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.9
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• pp.74-80
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• 2009

This paper describes a $2{\sim}6GHz$ CMOS frequency synthesizer that employs only one LC-tank voltage controlled oscillator (VCO). For wide-band operation, optimized LO signal generator is used. The LC-tank VCO oscillating in $6{\sim}8GHz$ provides the required LO frequency by dividing and mixing the VCO output clocks appropriately. The frequency synthesizer is based on a fractional-N phase locked loop (PLL) employing third-order 1-1-1 MASH type sigma-delta modulator. Implemented in a $0.18{\mu}m$ CMOS technology, the frequency synthesizer occupies the area of $0.92mm^2$ with of-chip loop filter and consumes 36mW from a 1.8V supply. The PLL is completed in less than $8{\mu}s$. The phase noise is -110dBC/Hz at 1MHz offset from the carrier.