• 제목/요약/키워드: p-type doping

검색결과 254건 처리시간 0.035초

RF Sputtering 방법으로 증착시킨 ZnO:Ag 박막의 광학적 특성 연구

  • 안병곤;강현철
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.424-424
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    • 2012
  • 나노 구조의 반도성 산화물은 독특한 구조적 특성으로 전기적, 광학적 특성을 향상 시킬 수 있다. 현재 연구되고 있는 나노 구조의 반도성 산화물 중 Zinc oxide (ZnO)는 3.37 eV의 bandgap를 갖는 wurtzite 구조체로서 상온에서 60 meV의 exciton binding energy 등 우수한 특성으로 인하여 최근 많이 연구되고 있다. 특히 단파장 light emitting diode 재료로써 기대를 모으고 있는데, 이를 실현하기 위한 가장 큰 문제점이 바로 안정적인 p-type ZnO 박막의 제조이다. 지금까지 알려진 바에 따르면 P를 doping한 후 급속 열처리한 경우 p-type의 전기전도도를 갖는 ZnO 박막을 제조할 수 있다고 보고되어 있으나 vacancy 농도에 따른 불안정적인 요소가 해결해야 할 문제로 남아 있다. 최근 Ag를 doping 시킨 ZnO 박막의 p-type 반도체로서 가능성에 대한 보고가 제기되고 있다. 합성 방법과 조건에 따라서 수 nm에서 수십 또는 수백 nm 크기의 구형 입자나, 리본, 와이어, 로드 그리고 꽃모영 등 다양한 형상을 갖는 나노 구조체를 합성 할 수 있다. 본 연구에서는 ZnO:Ag 박막을 radio-frequency sputtering 방법으로 증착하여 그 물성을 분석하였다. 보통의 sputtering 증착법에서 사용되는 sintering된 타겟과 달리 본 실험은 분말 타겟을 이용하여 박막을 증착하였다. 타겟은 95 wt% ZnO와 5 wt% Ag를 서로 혼합하여 제조하였다. 본 발표에서는 박막의 증착압력 및 증착 온도의 변화에 따른 ZnO:Ag 박막의 구조적, 광학적 특성에 대하여 논의 할 것이다.

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P-Type Doping of Graphene Films by Hybridization with Nickel Nanoparticles

  • Lee, Su Il;Song, Wooseok;Kim, Yooseok;song, Inkyung;Park, Sangeun;Cha, Myung-Jun;Jung, Dae Sung;Jung, Min Wook;An, Ki-Seok;Park, Chong-Yun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.208-208
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    • 2013
  • Graphene has emerged as a fascinating material for next-generation nanoelectronics due to its outstanding electronic properties. In particular, graphene-based field effect transistors (GFETs) have been a promising research subject due to their superior response times, which are due to extremely high electron mobility at room temperature. The biggest challenges in GFET applications are control of carrier concentration and opening the bandgap of graphene. To overcome these problems, three approaches to doping graphene have been developed. Here we demonstrate the decoration of Ni nanoparticles (NPs) on graphene films by simple annealing for p-type doping of graphene. Ni NPs/graphene films were fabricated by coating a $NiCl2{\cdot}6H2O$ solution onto graphene followedby annealing. Scanning electron microscopy and atomic force microscopy revealed that high-density, uniformly sized Ni NPs were formed on the graphene films and the density of the Ni NPs increased gradually with increasing $NiCl2{\cdot}6H2O$ concentration. The formation of Ni NPs on graphene films was explained by heat-driven dechlorination and subsequent particlization, as investigated by X-ray photoelectron spectroscopy. The doping effect of Ni NPs onto graphene films was verified by Raman spectroscopy and electrical transport measurements.

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대기압 플라즈마의 선택적 도핑 공정에서 온도에 의한 인(Phosphorus)의 확산연구 (Study of the Diffusion of Phosphorus Dependent on Temperatures for Selective Emitter Doping Process of Atmospheric Pressure Plasma)

  • 김상훈;윤명수;박종인;구제환;김인태;최은하;조광섭;권기청
    • 한국표면공학회지
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    • 제47권5호
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    • pp.227-232
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    • 2014
  • In this study, we propose the application of doping process technology for atmospheric pressure plasma. The plasma treatment means the wafer is warmed via resistance heating from current paths. These paths are induced by the surface charge density in the presence of illuminating Argon atmospheric plasmas. Furthermore, it is investigated on the high-concentration doping to a selective partial region in P type solar cell wafer. It is identified that diffusion of impurities is related to the wafer temperature. For the fixed plasma treatment time, plasma currents were set with 40, 70, 120 mA. For the processing time, IR(Infra-Red) images are analyzed via a camera dependent on the temperature of the P type wafer. Phosphorus concentrations are also analyzed through SIMS profiles from doped wafer. According to the analysis for doping process, as applied plasma currents increase, so the doping depth becomes deeper. As the junction depth is deeper, so the surface resistance is to be lowered. In addition, the surface charge density has a tendency inversely proportional to the initial phosphorus concentration. Overall, when the plasma current increases, then it becomes higher temperatures in wafer. It is shown that the diffusion of the impurity is critically dependent on the temperature of wafers.

Effect of Sn Doping on the Thermoelectric Properties of P-Type Mg3Sb2 Synthesized by Controlled Melting, Pulverizing Followed by Vacuum Hot Pressing

  • Rahman, Md. Mahmudur;Kim, Il-Ho;Ur, Soon-Chul
    • 한국재료학회지
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    • 제32권3호
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    • pp.132-138
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    • 2022
  • Zintl phase Mg3Sb2 is a promising thermoelectric material in medium to high temperature range due to its low band gap energy and characteristic electron-crystal phonon-glass behavior. P-type Mg3Sb2 has conventionally exhibited lower thermoelectric properties compared to its n-type counterparts, which have poor electrical conductivity. To address these problems, a small amount of Sn doping was considered in this alloy system. P-type Mg3Sb2 was synthesized by controlled melting, pulverizing, and subsequent vacuum hot pressing (VHP) method. X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to investigate phases and microstructure development during the process. Single phase Mg3Sb2 was successfully formed when 16 at.% of Mg was excessively added to the system. Nominal compositions of Mg3.8Sb2-xSnx (0 ≤ x ≤ 0.008) were considered in this study. Thermoelectric properties were evaluated in terms of Seebeck coefficient, electrical conductivity, and thermal conductivity. A peak ZT value ≈ 0.32 was found for the specimen Mg3.8Sb1.994Sn0.006 at 873 K, showing an improved ZT value compared to intrinsic one. Transport properties were also evaluated and discussed.

Photocatalytic study of Zinc Oxide with bismuth doping prepared by spray pyrolysis

  • Lin, Tzu-Yang;Hsu, Yu-Ting;Lan, Wen-How;Huang, Chien-Jung;Chen, Lung-Chien;Huang, Yu-Hsuan;Lin, Jia-Ching;Chang, Kuo-Jen;Lin, Wen-Jen;Huang, Kai-Feng
    • Advances in nano research
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    • 제3권3호
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    • pp.123-131
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    • 2015
  • The unintentionally doped and bismuth (Bi) doped zinc oxide (ZnO) films were prepared by spray pyrolysis at $450^{\circ}C$ with zinc acetate and bismuth nitrate precursor. The n-type conduction with concentration $6.13{\times}10^{16}cm^{-3}$ can be observed for the unintentionally doped ZnO. With the increasing of bismuth nitrate concentration in precursor, the p-type conduction can be observed. The p-type concentration $4.44{\times}10^{17}cm^{-3}$ can be achieved for the film with the Bi/Zn atomic ratio 5% in the precursor. The photoluminescence spectroscopy with HeCd laser light source was studied for films with different Bi doping. The photocatalytic activity for the unintentionally doped and Bi-doped ZnO films was studied through the photodegradation of Congo red under UV light illumination. The effects of different Bi contents on photocatalytic activity are studied and discussed. Results show that appropriate Bi doping in ZnO can increase photocatalytic activity.

p-Type Doping of GaSb by Beryllium Grown on GaAs (001) Substrate by Molecular Beam Epitaxy

  • Benyahia, Djalal;Kubiszyn, Lkasz;Michalczewski, Krystian;Keblwski, Artur;Martyniuk, Piotr;Piotrowski, Jozef;Rogalski, Antoni
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제16권5호
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    • pp.695-701
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    • 2016
  • Be-doped GaSb layers were grown on highly mismatched semi-insulating GaAs substrate (001) with $2^{\circ}$ offcut towards <110> at low growth temperature, by molecular beam epitaxy (MBE). The influence of Be doping on the crystallographic quality, surface morphology, and electrical properties, was assessed by X-ray diffraction, Nomarski microscopy, and Hall effect measurements, respectively. Be impurities are well behaved acceptors with hole concentrations as high as $9{\times}10^{17}cm^{-3}$. In addition, the reduction of GaSb lattice parameter with Be doping was studied.

Effect of Counter-doping Thickness on Double-gate MOSFET Characteristics

  • George, James T.;Joseph, Saji;Mathew, Vincent
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제10권2호
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    • pp.130-133
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    • 2010
  • This paper presents a study of the influence of variation of counter doping thickness on short channel effect in symmetric double-gate (DG) nano MOSFETs. Short channel effects are estimated from the computed values of current-voltage (I-V) characteristics. Two dimensional Quantum transport equations and Poisson equations are used to compute DG MOSFET characteristics. We found that the transconductance ($g_m$) and the drain conductance ($g_d$) increase with an increase in p-type counter-doping thickness ($T_c$). Very high value of transconductance ($g_m=38\;mS/{\mu}m$) is observed at 2.2 nm channel thickness. We have established that the threshold voltage of DG MOSFETs can be tuned by selecting the thickness of counter-doping in such device.

BF3 생산에 관한 연구 (Study for an BF3 Specialty Gas Production)

  • 이택홍;김재영
    • 한국가스학회지
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    • 제15권3호
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    • pp.74-78
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    • 2011
  • 반도체용 특수가스인 BF3는 반도체 생산공정에서 웨이퍼의 플라즈마 식각 공정과 화학증기증착(CVD : Chemical vapor deposition) chamber 세정공정 등에 사용되며, $BF_3$ 가스는 boron Ion Implant 공정에서 p-type doping을 위한 원료 등으로 사용된다. 본 연구에서는 간단한 공정으로 $NaBF_4$$KBF_4$의 열분해를 통하여 $BF_3$ 가스의 생산에 대해서 연구 하였다.

DBD-PLD 방법을 이용하여 N 도핑된 ZnO 박막의 특성 조사 (Properties of N doped ZnO grown by DBD-PLD)

  • 임재현;강민석;송용원;이상렬
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.15-16
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    • 2008
  • We have grown N-doped ZnO thin films on sapphire substrate by employing dielectric barrier discharge in pulsed laser deposition (DBD-PLD). DBD guarantees an effective way for massive in-situ generation of N-plasma under the conventional PLD process condition. Low-temperature photoluminescence spectra of the N-doped ZnO film provided near band-edge emission after thermal annealing process. The emission peak was resolved by Gaussian fitting and showed a dominant acceptor-bound exciton peak ($A^0X$) that indicated the successful p-type doping of ZnO with N.

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[ 0.1\;μm ] SOI-MOSFET의 적정 채널도핑농도에 관한 시뮬레이션 연구 (Investigation of Optimal Channel Doping Concentration for 0.1\;μm SOI-MOSFET by Process and Device Simulation)

  • 최광수
    • 한국재료학회지
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    • 제18권5호
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    • pp.272-276
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    • 2008
  • In submicron MOSFET devices, maintaining the ratio between the channel length (L) and the channel depth (D) at 3 : 1 or larger is known to be critical in preventing deleterious short-channel effects. In this study, n-type SOI-MOSFETs with a channel length of $0.1\;{\mu}m$ and a Si film thickness (channel depth) of $0.033\;{\mu}m$ (L : D = 3 : 1) were virtually fabricated using a TSUPREM-4 process simulator. To form functioning transistors on the very thin Si film, a protective layer of $0.08\;{\mu}m$-thick surface oxide was deposited prior to the source/drain ion implantation so as to dampen the speed of the incoming As ions. The p-type boron doping concentration of the Si film, in which the device channel is formed, was used as the key variable in the process simulation. The finished devices were electrically tested with a Medici device simulator. The result showed that, for a given channel doping concentration of $1.9{\sim}2.5\;{\times}\;10^{18}\;cm^{-3}$, the threshold voltage was $0.5{\sim}0.7\;V$, and the subthreshold swing was $70{\sim}80\;mV/dec$. These value ranges are all fairly reasonable and should form a 'magic region' in which SOI-MOSFETs run optimally.