• JSTS:Journal of Semiconductor Technology and Science
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• 제1권2호
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• pp.125-131
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• 2001

When the program voltage is applied to a word line, a part of the boosted channel charge in inhibited bit lines is lost due to the coupling between the string select line (SSL) and the adjacent word line. This phenomenon causes the program disturbance in the cells connected to the inhibited bit lines. This program disturbance becomes more serious, as the word line pitch is decreased. To reduce the word line coupling, the rising edge of the word-line voltage waveform was changed from a pulse step into a ramp waveform with a controlled slope. The word-line ramping circuit was composed of a timer, a decoder, a 8 b D/A converter, a comparator, and a high voltage switch pump (HVSP). The ramping voltage was generated by using a stepping waveform. The rising time and the stepping number of the word-line voltage for programming were set to $\mutextrm{m}-$ and 8, respectively,. The ramping circuit was used in a 512Mb NAND flash memory fabricated with a $0.15-\mutextrm{m}$ CMOS technology, reducing the SSL coupling voltage from 1.4V into a value below 0.4V.

• 제어로봇시스템학회논문지
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• 제10권2호
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• pp.178-184
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• 2004

In this paper, we designed an image processing system for the high speed line-scan camera which adopts the new memory model we proposed. As a resolution and a data rate of the line-scan camera are becoming higher, the faster image processing systems are needed. But many conventional systems are not sufficient to process the image data from the line-scan camera during a very short time. We designed the memory controller which eliminates the time for transferring image data from the line-scan camera to the main memory with high-speed SRAM and has a dual-port configuration therefore the DSP can access the main memory even though the memory controller are writing the image data. The memory controller is implemented by VHDL and Xilinx SPARTAN-IIE FPGA.

• 대한전자공학회논문지SD
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• 제47권12호
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• pp.31-38
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• 2010

본 논문에서는 QVGA급 LCD Driver IC(LDI)의 그래픽 메모리를 설계한다. 저면적을 위해 pseudo-SRAM 구조로 설계하고, 센싱 특성 개선과 line-read 동작 시 구동력 향상을 위해 bit line을 분할한 cell array 구조를 적용한다. 또한, C-gate를 이용한 저면적의 충돌방지 회로를 사용하여 그래픽 메모리의 line-read/self-refresh 동작과 기존의 write/read 동작 상호간의 충돌을 효과적으로 제어하는 방식을 제안한다. QVGA급 LDI의 그래픽 메모리는 $0.18{\mu}m$ CMOS공정을 이용하여 트랜지스터 레벨로 설계하고 회로 시뮬레이션을 통해 그래픽 메모리의 write, read, line-read, self-refresh 등의 기본 동작을 확인하고, 제안된 충돌방지 블록에 대한 동작을 확인하였다. 개선된 cell array를 통해 bit/bitb line 전압차 ${\Delta}V$는 약 15% 증가하고, bit/bitb line의 charge sharing time $T_{CHGSH}$는 약 30% 감소하여 센싱 특성이 향상되었으며, line-read 동작 시 발생하는 전류는 약 40% 크게 감소되었다.

• 대한전자공학회논문지
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• 제27권6호
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• pp.901-909
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• 1990

With a wide spread of 32 bit personal computers, a simple structure and high performance memory system have been highly required. In this paper, a memory block is constructed by using a modified hierarchical bit line in which the DRAM bit line and the latch which works as a SRAM cell are integrated by an interface gate. And the new architecture memory DSRAM(Dynamic Static RAM) is proposed by interleaving the 16 memory block. Because the DSRAM works with 16 page, the page is miss ratio becomes small and the RAS precharge time which is incurred by page miss is shortened. So the DSRAM can implement an optimum page interleaving and it has good compatibility to the existing DRAMs. The DSRAM can be widely used in small computers as well as a high performance memory system.

• 대한전자공학회논문지SD
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• 제37권6호
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• pp.1-8
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• 2000

본 논문에서는 플래시 메모리의 비트라인 공유에 따른 간섭현상을 최소화한 센스 엠프를 제시하였다. 외부소자에서 내부 플래시 메모리를 읽고자 하였을 때 발생할 수 있는 간섭현상은 공유된 비트라인으로 인하여 출력에서 에러가 발생할 수 있다. 주된 원인으로는 칩의 소형화에 따른 얇은 부유 게이트 옥사이드층의 사용에 따른 전하의 이동에 따라 발생한다. 본 논문에서는 전하의 이동을 최소화 하기 위해서는 공유된 비트라인에 인가되는 전압을 낮추었으며, 낮은 비트라인 전압으로도 플래시 셀의 데이터의 값을 판정할 수 있는 센스 앰프를 설계, 구현, 검증하였다.

• 대한전자공학회논문지SD
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• 제46권9호
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• pp.14-24
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• 2009

System on panel 프레임 버퍼를 위한 메모리 셀 어레이와 주변회로가 설계되었다. 또한, system on panel 공정의 낮은 yield를 극복하기 위해, 블럭 단위의 parallel test 방안이 제안되었다. 기존의 메모리 테스트 보다 빠르게 fault detection이 가능하며, 다양한 embedded memory나 일반 SRAM 테스트 분야에도 적용 가능하다. 또한 기존의 다양한 test vector pattern이 그대로 적용될 수 있어 fault coverage가 높고, 최근의 추세인 hierarchical bit line과 divided word line 구조에도 적용될 수 있다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권2호
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• pp.286-291
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• 2015

For highly scalable NAND flash memory applications, a compact ($4F^2/cell$) nonvolatile memory architecture is proposed and investigated via three-dimensional device simulations. The back-channel program/erase is conducted independently from the front-channel read operation as information is stored in the form of charge at the backside of the channel, and hence, read disturbance is avoided. The memory cell structure is essentially equivalent to that of the fully-depleted transistor, which allows a high cell read current and a steep subthreshold slope, to enable lower voltage operation in comparison with conventional NAND flash devices. To minimize memory cell disturbance during programming, a charge depletion method using appropriate biasing of a buried back-gate line that runs parallel to the bit line is introduced. This design is a new candidate for scaling NAND flash memory to sub-20 nm lateral dimensions.

• 전자통신동향분석
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• 제35권3호
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• pp.55-65
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• 2020

With the development of nonvolatile memory technology, Intel has released the Optane datacenter persistent memory module (DCPMM) that can be deployed in the dual in-line memory module. The results of research and experiments on Optane DCPMMs are significantly different from the anticipated results in previous studies through emulation. The DCPMM can be used in two different modes, namely, memory mode (similar to volatile DRAM: Dynamic Random Access Memory) and app direct mode (similar to file storage). It has buffers in 256-byte granularity; this is four times the CPU (Central Processing Unit) cache line (i.e., 64 bytes). However, these properties are not easy to use correctly, and the incorrect use of these properties may result in performance degradation. Optane has the same characteristics of DRAM and storage devices. To take advantage of the performance characteristics of this device, operating systems and applications require new approaches. However, this change in computing environments will require a significant number of researches in the future.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.26-31
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• 2002

To realize a high integrated Flash memory utilizing SONOS memory devices, the NOR type 1TC(one Transistor Cell) SONOS Flash arrays are fabricated and characterized. This SONOS Flash arrays with common source lines are designed and fabricated by conventional 0.35$\mu\textrm{m}$ CMOS process. The thickness of ONO for memory cell is tunnel oxide of 34${\AA}$, nitride of 73${\AA}$ and blocking oxide of 34${\AA}$. To investigate operating characteristics, CHEI(Channel Hot Electron Injection) method and Bit line erase method are selected as the write operation and the erase method, respectively. The disturbance characteristics according to the write/erase/read cycling are also examined. The degradation characteristics are investigated and then the reliability of SONOS flash memory is guaranteed.

• 대한임베디드공학회논문지
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• 제12권3호
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• pp.177-184
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• 2017

High performance non-volatile memory system can mitigate the gap between main memory and storage. However, no single memory devices fulfill the requirements. Non-volatile Dual In-line Memory Module (NVDIMM) consisted of DRAMs and NAND Flashes has been proposed to achieve the performance and non-volatility simultaneously. When power outage occurs, data in DRAM is backed up into NAND Flash using a small-size external energy storage such as a supercapacitor. Backup and restore operations of NVDIMM do not cooperate with the operating system in the NVDIMM standard, thus there is room to optimize its operation. This paper analysis the operation of NVDIMM and proposes a method to reduce backup and restore time. Particularly, data compression is introduced to reduce the amount of data that to be backed up and restored. The simulation results show that the proposed method reduces up to 72.6% of backup and restore time.