• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.2
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• pp.67-75
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• 2004

This paper presents a buffer insertion method for RLC-class interconnect structured as a sin91e line or a tree. First, a closed form expression for the interconnect delay of a CMOS buffer driving single RLC line is represented. This expression has been derived by the n-th power law for deep submicrometer technology and occurs to be within 9 percentage of maximal relative error in accuracy compared with the results of HSPICE simulation for various RLC loads. This paper proposes a closed form expression based on this for the buffer insertion of single RLC lines and the buffer sizing algorithms for RLC tree interconnects to optimize path delays. The proposed buffer insertion algorithms are applied to insert buffers for several interconnect trees with a 0.25${\mu}{\textrm}{m}$ CMOS technology and the results are compared against those of HSPICE.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.8
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• pp.350-354
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• 2005

This paper proposes a new method for delay time calculation in RLC interconnects. This method is simple, but precise. The proposed method can calculate delay time of RLC interconnects by simple numerical formula calculation without complex moment calculation using reduced model in RLC interconnects. The results using the proposed method for RLC circuits show that average relative error is within $10\%$ in comparison with HSPICE simulation results.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.7 s.349
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• pp.20-28
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• 2006

A new TWA(Traveling-wave-based Waveform Approximation)-based signal integrity verification method for practical interconnect layout structures which are composed of non-uniform RLC lines with various discontinuities is presented. Transforming the non-uniform lines into virtual uniform lines, signal integrity of the practical layout structures can be very efficiently estimated by using the TWA-technique. It is shown that the proposed technique can estimate the signal integrity much more efficiently than generic SPICE circuit model with 5% timing error and 10% crosstalk error.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.2
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• pp.77-83
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• 2004

Cross-talk noise which can occur between on-chip interconnects is significant factor which influence signal integrity. Therefore, this paper presents an analytical method for estimating maximum cross-talk noise. We consider inductance effect of interconnects and use arbitary ramp inputs to estimate noise magnitude exactly. Also, we have used a virtual source for the easy of analytically caculating maximum cross-talk noise from complex cross-talk noise model. The accuracy of the has been shown that be within 4.3 percent maximum relative error compared with the results of HSPICE simulation. Hence, this study can be utilized in various CAD tools for guaranteeing signal integrity.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.7 s.349
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• pp.29-37
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• 2006

This paper presents a new analytical model to suppress RLC resonance effects which inevitably occur in power/ground lines due to on-chip decoupling capacitor and other interconnect circuit parasitics (i.e., package inductance, on-chip decoupling capacitor, and output drivers, etc.). To characterize the resonance effects, the resonance frequency of the circuit is accurately estimated in an analytical manner. Thereby, a decoupling capacitor size to suppress the resonance for a suitable circuit operation is accurately determined by using the estimated resonance frequency. The developed novel design methodology is verified by using $0.18{\mu}m$ process-based-HSPICE simulation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.4
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• pp.260-266
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• 2007

Analytical compact form models for the signal transients and crosstalk noise of inductive-effect-prominent multi-coupled RLC lines are developed. Capacitive and inductive coupling effects are investigated and formulated in terms of the equivalent transmission line model and transmission line parameters for fundamental modes. The signal transients and crosstalk noise expressions of two coupled lines are derived by using a waveform approximation technique. It is shown that the models have excellent agreement with SPICE simulation.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.5
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• pp.13-26
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• 1999

This paper presents a metric that can guide to optimal circuit models for interconnects among various models, given interconnect parameters and operating environment. To get this goal, we categorize interconnects into RC~c1ass and RLC-c1ass model domains based on the quantitative modeling error analysis using total resistance, inductance and capacitance of interconnects as well as operating frequency. RC~c1ass circuit models, which include most on~chip interconnects, can be efficiently analyzed by using the model~order reduction techniques. RLC-c1ass circuit models are constructed using one of three candidates, ILC(Iterative Ladder Circuit) macromodels, MC(Method of Characteristics) macromodels, and state-based convolution method, the selection process of which is based upon the allowable modeling error and electrical parameters of interconnects. We propose the model domain diagram leading to optimal circuit models and the division of model domains has been achieved considering the simulation cost of macromodels under the environmental assumption of the general purpose circuit simulator such as SPICE. The macromodeling method presented in this paper keeps the passivity of the original interconnects and accordingly guarantees the unconditional stability of circuit models.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.3
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• pp.26-34
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• 1999

A new silicon-based IC interconnect transmission line parameter extraction methodology is presented and experimentally examined. Unlike the PCB or MCM interconnects, a dominant energy propagation mode in the silicon-based IC interconnects is not quasi-TEM but slow wave mode(SWM). The transmission line parameters are extracted taking the silicon substrate effect (i.e., slow wave mode) into account. The capacitances are calculated considering silicon substrate surface as a ground. Whereas the inductances are calculated by using an effective dielectric constant. In order to verify the proposed method, test patterns were designed. Experimental data have agreement within 10%. Further, crosstalk noise simulation shows excellent agreements with the measurements which are performed with high-speed time domain measurement ( i.e., TDR/TDT measurements) for test pattern, while RC model or RLC model without silicon substrate effect show about 20~25% underestimation error.