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A New TWA-Based Efficient Signal Integrity Verification Technique for Complicated Multi-Layer RLC Interconnect Lines  

Jo Chan-Min (Hanyang University, Dept. of Electrical and Computer Engineering)
Eo Yung-Seon (Hanyang University, Dept. of Electrical and Computer Engineering)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.43, no.7, 2006 , pp. 20-28 More about this Journal
Abstract
A new TWA(Traveling-wave-based Waveform Approximation)-based signal integrity verification method for practical interconnect layout structures which are composed of non-uniform RLC lines with various discontinuities is presented. Transforming the non-uniform lines into virtual uniform lines, signal integrity of the practical layout structures can be very efficiently estimated by using the TWA-technique. It is shown that the proposed technique can estimate the signal integrity much more efficiently than generic SPICE circuit model with 5% timing error and 10% crosstalk error.
Keywords
interconnect; multi-layer; capacitance; signal integrity; TWA;
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