• Title/Summary/Keyword: Interfacial property

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Interface and Surface Properties by Surface Treatment of Zirconia for All Ceramic Crown (전부도재관용 지르코니아의 표면처리에 따른 표면특성 및 계면특성 관찰)

  • Kim, Chi-Young;Chung, In-Sung;Choi, Sung-Min
    • Journal of Technologic Dentistry
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    • v.35 no.2
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    • pp.137-142
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    • 2013
  • Purpose: This study was to observe the surface and interfacial characteristic of Zirconia by surface treatment. And it was observed the roughness and contact angle according to processing, and the interfacial properties by surface treatment on zirconia. Methods: The oxide formation and ion diffusion between core and veneer ceramic were determined by the X-ray Dot Mapping of EPMA(Electron probe micro analyzer). The roughness was measured by 3D Digital microscope and the contact angle according to processing of zirconia was observed using distilled water on the surface. Results: The surface roughness of the specimens Z04, Z12, Z15 was measured $0.67({\pm}0.03){\mu}m$, $0.50({\pm}0.12){\mu}m$, $0.35({\pm}0.09){\mu}m$, respectively. As results of contact angle test, Z04, Z12, Z15 of specimen group without binder treatment was measured $46.79({\pm}3.17)^{\circ}$, $57.47({\pm}4.83)^{\circ}$, $56.19({\pm}2.66)^{\circ}$, respectively. but, L04, L12, L15 of specimen group without binder treatment was measured $63.84({\pm}2.20)^{\circ}$, $66.08({\pm}0.16)^{\circ}$, $65.10({\pm}1.01)^{\circ}$, respectively. Average contact angle of L15 was measured $65.10({\pm}1.01)^{\circ}$. In X-ray Dot Mapping results, thickness of binder including Al element was measured that each of L04, L12, L15 were $20{\mu}m$, $15{\mu}m$, $10{\mu}m$. Conclusion: The more rough surface increases the wettability, but the sintered exclusive binder decreases the wettability.

Preparation of graphene oxide incorporated polyamide thin-film composite membranes for PPCPs removal

  • Wang, Xiaoping;Li, Nana;Zhao, Yu;Xia, Shengji
    • Membrane and Water Treatment
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    • v.9 no.4
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    • pp.211-220
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    • 2018
  • Incorporating nano-materials in thin-film composite (TFC) membranes has been considered to be an approach to achieve higher membrane performance in various water treatment processes. This study investigated the rejection efficiency of three target compounds, i.e., reserpine, norfloxacin and tetracycline hydrochloride, by TFC membranes with different graphene oxide proportions. Graphene oxide (GO) was incorporated into the polyamide active layer of a TFC membrane via an interfacial polymerization (IP) reaction. The TFC membranes were characterized with FTIR, FE-SEM, AFM; in addition, the water contact angle measurements as well as the permeation and separation performance were evaluated. The prepared GO-TFC membranes exhibited a much higher flux ($3.11{\pm}0.04L/m2{\cdot}h{\cdot}bar$) than the pristine TFC membranes ($2.12{\pm}0.05L/m2{\cdot}h{\cdot}bar$) without sacrificing their foulant rejection abilities. At the same time, the GO-modified membrane appeared to be less sensitive to pH changes than the pure TFC membrane. A significant improvement in the anti-fouling property of the membrane was observed, which was ascribed to the favorable change in the membrane's hydrophilicity, surface morphology and surface charge through the addition of an appropriate amount of GO. This study predominantly improved the understanding of the different PA/GO membranes and outlined improved industrial applications of such membranes in the future.

Optimum Condition of Pencil Drawing Paper Sensor(PDPS) for Temperature Detecting (온도 감지용 연필 선 종이 센서 최적화 연구)

  • Kwon, Dong-Jun;Shin, Pyeong-Su;Kim, Jong-Hyun;Beak, Young-Min;Park, Ha-Sung;Park, Joung-Man
    • Journal of Adhesion and Interface
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    • v.18 no.1
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    • pp.1-7
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    • 2017
  • This study is about basic sensor experiment using PDPS by common pencil. 20 mm length, 3 mm thickness of line using 4B pencil is optimum condition. In order to be stable at point of contact between pencil line and copper wire, silver paste is needed. At using the PDPS, thermal detecting is able and thermal properties is inversely proportional to electrical resistance in the based on empirical formula. The sensor can be also used in the composites mold via the empirical formula by the relationship between thermal impact and electrical resistance. The change of electrical resistance relates the interfacial property of composites. It leads to expectation of properties.

Influence of Sizing Agent on Interfacial Adhesion and Mechanical Properties of Glass Fiber/Unsaturated Polyester Composites (사이징제에 따른 유리섬유/불포화 폴리에스터 복합재료의 계면 접착력과 기계적 물성)

  • 박수진;김택진;이재락;홍성권;김영근
    • Polymer(Korea)
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    • v.24 no.3
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    • pp.326-332
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    • 2000
  • The effects of sizing agent on the final mechanical properties of the glass fiber/unsaturated polyester composites were investigated by contact angle measurements at room temperature. In this work, glass fibers were coated by poly(vinyl alcohol), polyester, and epoxy type sizing agent and each property was compared. Contact angles of the sized glass fiber were measured by the wicking method based on Washburn equation using deionized water and diiodomethane as testing liquids. As an experimental result, the surface free energy calculated from contact angle showed the highest value in case of the glass fiber coated by epoxy sizing agent. From measurements of interlaminar shear strength (ILSS) and fracture toughness ( $K_{IC}$ ) of the composites, it was found that the sizing treatment on fibers could improve the fiber/matrix interfacial adhesion, resulting in growing the final mechanical properties. This was due to the enhanced surface free energy of glass fibers in a composite system.

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Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder (Au 스터드 범프와 Sn-3.5Ag 솔더범프로 플립칩 본딩된 접합부의 미세조직 및 기계적 특성)

  • Lee, Young-Kyu;Ko, Yong-Ho;Yoo, Se-Hoon;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.29 no.6
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    • pp.65-70
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    • 2011
  • The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

Interfacial Reaction and Mechanical Property of BGA Solder Joints with LTCC Substrate (LTCC기판과 BGA 솔더접합부의 계면반응 및 기계적 특성)

  • Yoo, Choong-Sik;Ha, Sang-Su;Kim, Bae-Kyun;Jang, Jin-Kyu;Seo, Won-Chan;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.47 no.3
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    • pp.202-208
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    • 2009
  • The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

Soluble Polyimide Binder for Silicon Electrodes in Lithium Secondary Batteries (리튬이차전지 실리콘 전극용 용해성 폴리이미드 바인더)

  • Song, Danoh;Lee, Seung Hyun;Kim, Kyuman;Ryou, Myung-Hyun;Park, Won Ho;Lee, Yong Min
    • Applied Chemistry for Engineering
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    • v.26 no.6
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    • pp.674-680
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    • 2015
  • A solvent-soluble polyimide (PI) polymeric binder was synthesized by a two-step reaction for silicon (Si) anodes for lithium-ion batteries. Polyamic acid was first prepared through ring opening between two monomers, bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BCDA) and 4,4-oxydianiline (ODA), followed by condensation reaction. Using the synthesized PI polymeric binder (molecular weight = ~10,945), the coating slurry was then prepared and Si anode was fabricated. For the control system, Si anode based on polyvinylidene fluoride (PVDF, molecular weight = ~350,000) having the same constituent ratio was prepared. During precycling, PI polymeric binder revealed much improved discharge capacity ($2,167mAh\;g^{-1}$) compared to that of using PVDF polymeric binder ($1,740mAh\;g^{-1}$), while the Coulombic efficiency of two systems were similar. PI polymeric binder improved the cycle retention ability during cycles compared to that of using PVDF, which is attributed to an improved adhesion property inside Si anode diminishing the dimensional stress during Si volume changes. The adhesion property of each polymeric binder in Si anode was confirmed by surface and interfacial cutting analysis system (SAICAS) (Si anode based on PI polymeric binder = $0.217kN\;m^{-1}$ and Si anode based on PVDF polymeric binder = $0.185kN\;m^{-1}$).

A study on Electrical and Diffusion Barrier Properties of MgO Formed on Surface as well as at the Interface Between Cu(Mg) Alloy and $SiO_2$ (Cu(Mg) alloy의 표면과 계면에서 형성된 MgO의 확산방지능력 및 표면에 형성된 MgO의 전기적 특성 연구)

  • Jo, Heung-Ryeol;Jo, Beom-Seok;Lee, Jae-Gap
    • Korean Journal of Materials Research
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    • v.10 no.2
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    • pp.160-165
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    • 2000
  • We have investigated the electrical and diffusion barrier properties of MgO produced on the surface of Cu (Mg) alloy. Also the diffusion barrier property of the interfacial MgO between Cu alloy and $SiO_2$ has been examined. The results show that the $150\;{\AA}$-MgO layer on the surface remains stable up to $700^{\circ}C$, preventing the interdiffusion of C Cu and Si in Si/MgO/Cu(Mg) structure. It also has the breakdown voltage of 4.5V and leakage current density of $10^{-7}A/\textrm{cm}^2/$. In addition, the combined structure of $Si_3N4(100{\AA})/MgO(100{\AA})$ increases the breakdown voltage up to lOV and reduces the leakage current density to $8{\tiems}10^{-7}A/\textrm{cm}^2$. Furthermore, the interfacial MgO formed by the chemical reac­t tion of Mg and $SiO_2$ reduces the diffusion of copper into $SiO_2$ substrate. Consequently, Cu(Mg) alloy can be applied as a g gate electrode in TFT /LCDs, reducing the process steps.

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Synthesis and Magnetic Property of Nanocrystalline Fe-Ni-Co Alloys during Hydrogen Reduction of Ni0.5Co0.5Fe2O4 (Ni0.5Co0.5Fe2O4의 수소환원에 의한 나노구조 Fe-Ni-Co 합금의 제조 및 자성특성)

  • Paek, Min Kyu;Do, Kyung Hyo;Bahgat, Mohamed;Pak, Jong Jin
    • Korean Journal of Metals and Materials
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    • v.49 no.2
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    • pp.167-173
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    • 2011
  • Nickel cobalt ferrite($Ni_{0.5}Co_{0.5}Fe_2O_4$) powder was prepared through the ceramic route by the calcination of a stoichiometric mixture of NiO, CoO and $Fe_2O_3$ at $1100^{\circ}C$. The pressed pellets of $Ni_{0.5}Co_{0.5}Fe_2O_4$ were isothermally reduced in pure hydrogen at $800{\sim}1100^{\circ}C$. Based on the thermogravimetric analysis, the reduction behavior and the kinetic reaction mechanisms of the synthesized ferrite were studied. The initial ferrite powder and the various reduction products were characterized by X-ray diffraction, scanning electron microscopy, reflected light microscope and vibrating sample magnetometer to reveal the effect of hydrogen reduction on the composition, microstructure and magnetic properties of the produced Fe-Ni-Co alloy. The arrhenius equation with the approved mathematical formulations for the gas solid reaction was applied to calculate the activation energy($E_a$) and detect the controlling reaction mechanisms. In the initial stage of hydrogen reduction, the reduction rate was controlled by the gas diffusion and the interfacial chemical reaction. However, in later stages, the rate was controlled by the interfacial chemical reaction. The nature of the hydrogen reduction and the magnetic property changes for nickel cobalt ferrite were compared with the previous result for nickel ferrite. The microstructural development of the synthesized Fe-Ni-Co alloy with an increase in the reduction temperature improved its soft magnetic properties by increasing the saturation magnetization($M_s$) and by decreasing the coercivity($H_c$). The Fe-Ni-Co alloy showed higher saturation magnetization compared to Fe-Ni alloy.

Emulsifying Properties of Concentrated Red Ginseng Extract: Influence of Concentration, pH, NaCl (홍삼농축액 함유 유화액의 유화특성에 관한연구)

  • You, Kawn-Mo;Jang, Hyeon-Ho;Lee, Eui-Seok;Lee, Ki-Teak;Hong, Soon-Taek
    • Journal of the Korean Applied Science and Technology
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    • v.34 no.3
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    • pp.504-514
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    • 2017
  • This study was carried out to investigate the emulsifying properties of concentrated red ginseng extract (CRGE). First, we determined the interfacial tension of CRGE at the oil-water interface. Second, oil-in-water emulsions were prepared with CRGE and then their physicochemical properties such as fat globule size, zeta-potential, dispersion stability, and microscopic characteristics were determined. It was found that interfacial tension gradually decreased with increasing CRGE concentration, indicative of some surface activity. In emulsions, fat globule size was decreased as CRGE concentration increased, showing a critical value ($d_{43}$$0.39{\mu}m$) at ${\geq}3.5wt%$ of CRGE. In addition, pH and NaCl also influenced on fat globule sizes; they were increased in acidic conditions ($pH{\leq}3$) or in higher NaCl concentration (${\geq}0.4M$) and these results were interpreted in view of the change in zeta potentials. The dispersion stability by separation analyzer ($LUMiFuge^{(R)}$) showed that it was more stable in emulsions with higher CRGE concentration (i.e., ${\geq}3.5wt%$). In conclusion, CRGE was surface-active and it could be used as an emulsifier in preparation of food emulsions.