Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Interfacial Reaction and Mechanical Property of BGA Solder Joints with LTCC Substrate

LTCC기판과 BGA 솔더접합부의 계면반응 및 기계적 특성

  • Yoo, Choong-Sik (Samsung Electro-Mechanics) ;
  • Ha, Sang-Su (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Kim, Bae-Kyun (Samsung Electro-Mechanics) ;
  • Jang, Jin-Kyu (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Seo, Won-Chan (School of Advanced Materials Science & Engineering, Pukyong National University) ;
  • Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
  • Received : 2008.11.25
  • Published : 2009.03.25
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Abstract

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

Keywords

Acknowledgement

Supported by : 지식경제부

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