Interfacial Reaction and Mechanical Property of BGA Solder Joints with LTCC Substrate
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Yoo, Choong-Sik
(Samsung Electro-Mechanics)
Ha, Sang-Su (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Kim, Bae-Kyun (Samsung Electro-Mechanics) Jang, Jin-Kyu (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Seo, Won-Chan (School of Advanced Materials Science & Engineering, Pukyong National University) Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University) |
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