Journal of Welding and Joining

  • 제29권6호
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  • Pages.65-70
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  • 2011
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
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Au 스터드 범프와 Sn-3.5Ag 솔더범프로 플립칩 본딩된 접합부의 미세조직 및 기계적 특성

Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder

  • 이영규 (과학기술연합대학원대학교 전자패키징공학과) ;
  • 고용호 (한국생산기술연구원 용접접합기술센터) ;
  • 유세훈 (한국생산기술연구원 용접접합기술센터) ;
  • 이창우 (한국생산기술연구원 용접접합기술센터)
  • Lee, Young-Kyu (Dept. of Electronic Packaging Engineering, University of Science & Technology) ;
  • Ko, Yong-Ho (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology) ;
  • Yoo, Se-Hoon (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology) ;
  • Lee, Chang-Woo (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology)
  • 투고 : 2011.10.17
  • 심사 : 2011.11.07
  • 발행 : 2011.12.31
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초록

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

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