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http://dx.doi.org/10.5781/KWJS.2011.29.6.685

Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder  

Lee, Young-Kyu (Dept. of Electronic Packaging Engineering, University of Science & Technology)
Ko, Yong-Ho (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology)
Yoo, Se-Hoon (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology)
Lee, Chang-Woo (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology)
Publication Information
Journal of Welding and Joining / v.29, no.6, 2011 , pp. 65-70 More about this Journal
Abstract
The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.
Keywords
Au stud bump; Flip chip bonding; Interfacial reaction; Bonding strength;
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Times Cited By KSCI : 3  (Citation Analysis)
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