• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.11
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• pp.13-20
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• 2008

In this paper, an 1.8V 12-bit 10MSPS CMOS A/D converter (ADC) is described. The architecture of the proposed ADC is based on a folding and interpolation using an even folding technique. For the purpose of improving SNR, cascaded-folding cascaded-interpolation technique, distributed track and hold are adapted. Further, a digital encoder algorithm is proposed for efficient digital process. The chip has been fabricated with $0.18{\mu}m$ 1-poly 4-metal n-well CMOS technology. The effective chip area is $2000{\mu}m{\times}1100{\mu}m$ and it consumes about 250mW at 1.8V power supply. The measured SNDR is about 46dB at 10MHz sampling frequency.

• Journal of IKEEE
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• v.17 no.3
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• pp.275-283
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• 2013

In this paper, a 8bit 10Ms/s CMOS Folding and Interpolation analog-to-digital convertor is proposed. The architecture of the proposed ADC is based on a Folding & Interpolation using FR(Folding Rate)=8, NFB(Number of Folding Block)=4, IR(Interpolation Rate)=8. The proposed ADC adopts a preamplifier sharing method to decrease the number of preamplifier by half comparing to the conventional ones. This chip has been fabricated with a 0.35[um] CMOS technology. The effective chip area is $1.8[mm]{\times}2.11[mm]$ and it consumes 20[mA] at 3.3 power supply with 10[MHz] clock. The INL is -0.57, +0.61 [LSB] and DNL is -0.4, +0.51 [LSB]. The SFDR is 48.9[dB] and SNDR is 47.9[dB](ENOB 7.6b) when the input frequency is 100[kHz] at 10[MHz] conversion rate.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.4
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• pp.14-23
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• 2011

In this paper, a 7-bit 2GSPS folding/interpolation A/D Converter(ADC) with a Self-Calibrated Vector Generator is proposed. The ADC structure is based on a folding/interpolation architecture whose folding/interpolation rate is 4 and 8, respectively. A cascaded preprocessing block is not only used in order to drive the high input signal frequency, but the resistive interpolation is also used to reduce the power consumption. Based on a novel self-calibrated vector generator, further, offset errors due to device mismatch, parasitic resistors. and parasitic capacitance can be reduced. The chip has been fabricated with a 1.2V 0.13um 1-poly 7-metal CMOS technology. The effective chip area including the calibration circuit is 2.5$mm^2$. SNDR is about 39.49dB when the input frequency is 9MHz at 2GHz sampling frequency. The SNDR is improved by 3dB with the calibration circuit.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.3
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• pp.44-44
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• 2001

본 논문에서는 CMOS로 구현된 3.3V 8-bit 200MSPS의 Folding / Interpolation 구조의 A/D 변환기를 제안한다. 회로에 사용된 구조는 FR(Folding Rate)이 8, NFB(Number of Folding Block)가 4, Interpolation rate 이 8이며, 분산 Track and Hold 구조를 회로를 사용하여 Sampling시 입력주파수를 Hold하여 높은 SNDR을 얻을 수 있었다. 고속동작과 저 전력 기능을 위하여 향상된 래치와 디지털 Encoder를 제안하였고 지연시간 보정을 위한 회로도 제안하였다. 제안된 ADC는 0.35㎛, 2-Poly, 3-Metal, n-well CMOS 공정을 사용하여 제작되었으며, 유효 칩 면적은 1070㎛×650㎛ 이고, 3.3V전압에서 230mW의 전력소모를 나타내었다. 입력 주파수 10MHz, 샘플링 주파수 200MHz에서의 INL과 DNL은 ±1LSB 이내로 측정되었으며, SNDR은 43㏈로 측정되었다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.3
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• pp.18-27
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• 2010

In this paper, a 1.2V 7-bit 1GSPS A/D converter with offset self-calibration is proposed. The proposed A/D converter structure is based on the folding-interpolation whose folding rate is 2, interpolation rate is 8. Further, for the purpose of improving the chip performance, an offset self-calibration circuit is used. The offset self-calibration circuit reduce the variation of the offset-voltage，due to process mismatch, parasitic resistor, and parasitic capacitance. The chip has been fabricated with a 1.2V 65nm 1-poly 6-metal CMOS technology. The effective chip area is $0.87mm^2$ and the power dissipates about 110mW at 1.2V power supply. The measured SNDR is about 39.1dB when the input frequency is 250MHz at 800MHz sampling frequency. The measured SNDR is 3dB higher than the same circuit without any calibration.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.421-425
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• 2008

In this research, a 8-bit CMOS 2 stage folding A/D converter is designed, For low power consumption and small chip size, the A/D converter is designed by using folding and interpolation circuit. Folding circuit is composed of the transistor differential pairs which are connected in parallel. It reduces the number of comparator drastically. The analog block composed of folding block, current interpolation circuit, and three stage current comparator is designed with differential-mode for high speed operation. The simulation in a $0.35\;{\mu}m$ CMOS process. shows DNL and SNDR of 0.5LSB and 47 dB at 250 MHz/s sampling frequency.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.3
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• pp.198-204
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• 2001

In this paper, a 3V 8-bit 200MSPS CMOS folding / interpolation A/D Converter is proposed. It employs an efficient architecture whose FR(Folding Rate) is 8, NFB(Number of Folding Block) is 4, and IR (Interpolating Rate) is 8. For the purpose of improved SNDR by to be low input frequency, distributed track and hold circuits are included. In order to obtain a high speed and low power operation, further, a novel dynamic latch and digital encoder based on a novel delay error correction are proposed. The chip has been fabricated with a 0.35${\mu}{\textrm}{m}$ 2-poly 3-metal n-well CMOS technology. The effective chip area is 1070${\mu}{\textrm}{m}$$\times$650${\mu}{\textrm}{m}$ and it dissipates about 230mW at 3.3V power supply. The INL is within $\pm$1LSB and DNL is within $\pm$1LSB, respectively. The SNDR is about 43㏈, when the input frequency is 10MHz at 200MHz clock frequency.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.986-989
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• 1999

An 12bit current-mode folding and interpolation analog to digital converter (ADC) with multiplied folding amplifiers is proposed in this paper. A current - mode multiplied folding amplifier is employed not only to reduced the number of reference current source, but also to decrease a power dissipation within the ADC. The designed ADC fabricated by a 0.6${\mu}{\textrm}{m}$ n-well CMOS double metal/single poly process. The simulation result shows the power dissipation of 280㎽ with a power supply of 5V.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.34C no.6
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• pp.58-70
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• 1997

In this paper, an 8bit CMOS low power, high-speed current-mode folding and interpolation A/D converter is designed with te LG semicon $0.8\mu\textrm{m}$ N-well single-poly/double-metal CMOS process to be integrated into a portable image signal processing system such as a digital camcoder. For good linearity and low power consumption, folding amplifiers and for high speed performance of the A/D converter, analog circuitries including folding block, current-mode interpolation circuit and current comparator are designed as a differential-mode. The fabricated 8 bit A/D converter occupies the active chip area of TEX>$2.2mm \times 1.6mm$ and shows DNL of $\pm0.2LSB$, INL of <$\pm0.5LSB$, conversion rate of 40M samples/s, and the measured maximum power dissipation of 33.6mW at single +5V supply voltage.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.45-48
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• 2001

An programmable current-mode folding and interpolation analog to digital converter (ADC) with programmable interpolator is proposed in this paper. A programmable interpolator is employed not only to vary the resolution of data converter, but also to decrease a power dissipation within the ADC. Because of varying the number of interpolation circuits, resolution is vary from 6 to 10bit. The designed ADC fabricated by a 0.6${\mu}{\textrm}{m}$ n-well CMOS double metal/single poly process. The experimental result shows the power dissipation from 26 to 87mW with a power supply of 3.3V.