• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.6
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• pp.428-435
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• 1998

SOI-like-bulk CMOS device is proposed, which having the advantages of SOI(Silicon On Insulator) and protects short channel effects efficiently with adding partial epitaxial process at standard CMOS process. SOI-like-bulk NMOS and PMOS with 0.25${\mu}{\textrm}{m}$ gate length have designed and optimized through analyzing the characteristics of these devices and applying again to the design of processes. The threshold voltages of the designed NMOS and PMOS are 0.3[V], -0.35[V] respectively and those have shown the stable characteristics under 1.5[V] gate and drain voltages. The leakage current of typical bulk-CMOS increase with shortening the channel length, but the proposed structures on this a study reduce the leakage current and improve the subthreshold characteristics at the same time. In addition, subthreshold swing value, S is 70.91[mV/decade] in SOI-like-bulk NMOS and 63.37[mV/ decade] SOI-like-bulk PMOS. And the characteristics of SOI-like-bulk CMOS are better than those of standard bulk CMOS. To validate the circuit application, CMOS inverter circuit has designed and transient & DC transfer characteristics are analyzed with mixed mode simulation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.93-96
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• 1993

BiCMOS technology, which combines CMOS and bipolar technology, offers the possibility of achieving both very high density and high performance. In this paper, the characteristics of BiCMOS and CMOS circuits, especilly the delay time is studied. BiCMOS inverter, which has high drive ability because of bipolar transistor, drives high load capacitance and has low-power characteristics because the current flows only during switching transient just like the CMOS gate. BiCMOS inverter has the less dependence on load capacitance than CMOS inverter. SPICE that has been used for electronic circuit analysis is chosen to simulate these circuits and the characteristics is discussed.

• Proceedings of the KIEE Conference
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• 2002.11c
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• pp.253-256
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• 2002

A programmable CMOS negative resistor has been designed and fabricated in a 0.5um double poly double metal technology. The proposed CMOS negative resistor consists of a positive feedback OTA and a bump circuit with Gaussian-like I-V curve. Measurements of the fabricated chip confirm that the proposed CMOS resistor shows various negative resistance according to control voltage.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.4
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• pp.65-72
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• 2013

This paper presents design methodology for Memristor-CMOS circuits and its application to primitive IPs design. We proposed a Memristor model and designed basic elements, Memristor AND/OR gates. The primitive IPs based on a Memristor-CMOS technology is proposed for a Memristive system design. The netlists of IPs are extracted from the layouts of Memristor-CMOS and is verified with SPICE-like Memristor model under $0.18{\mu}m$ CMOS technology. As a result, an example design Memristor-CMOS full adder has only 47.6 % of silicon area compare to the CMOS full-adder.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.4A
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• pp.458-465
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• 2004

To reaffirm the use of a mainstream CMOS process for designing passive-like attenuator structures, a linearly controlled variable attenuator is realized with 0.35${\mu}{\textrm}{m}$ 2-poly 4-metal CMOS process. It uses the П configuration for large attenuation range and suitable matching property. Compared to conventional passive-like CMOS attenuators, it is demonstrated that this work advances the frequency band from MHz to ㎓ (DC- l㎓), and reduces the size to 700${\mu}{\textrm}{m}$${\times}$300${\mu}{\textrm}{m}$.. Both simulation results and test results are provided. They show the improved linear relation between attenuation and control voltage. It is very useful in CDMA or GSM band, which uses under 1㎓ frequency band. An alternative topology, Bridged-T configuration, is proposed to get over the limit of applications by elevating operation bandwidth. The proposed topology covers over DC-2㎓ frequency band, which means that the proposed architecture can cover the tripleband (800MHz CDMA/GSM, 1.5㎓ GPS, 1.9㎓z PCS system) in applications as well. The simulation results are provided.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1282-1287
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• 2007

We investigated the damage of the CMOS IC which manufactured three different technologies by high power microwave. The tests separated the two methods in accordance with the types of the CMOS IC located inner waveguide. The only CMOS IC which was located inner waveguide was occurred breakdown below the max electric field (23.94kV/m) without destruction but the CMOS IC which was connected IC to line organically was located inner waveguide and it was occurred breakdown and destruction below the max electric field. Also destructed CMOS IC was removed their surface and a chip condition was analyzed by SEM. The SEM analysis of the damaged devices showed onchuipwire and bondwire destruction like melting due to thermal effect. The tested results are applied to the fundamental data which interprets the combination mechanism of the semiconductors from artificial electromagnetic wave environment and are applied to the data which understand electromagnetic wave effects of electronic equipments.

• Progress in Superconductivity and Cryogenics
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• v.8 no.1
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• pp.26-28
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• 2006

The development technique of digital logic using CMOS device is close reached several limitations These make technical needs that are ultra high speed superconductive systems based on CMOS silicon digital computing technique. Comparing digital logic based on silicon CMOS, the computing technique based on ultra high speed superconductive systems has many advantages which are ultra low power consumption, ultra high operation speed. etc. It is estimated that features like these increasingly improve the possibility of ultra low power and ultra superconductive systems. In this paper digital logics of current CMOS technique and RSFQ superconductive technique are compared with and analyzed.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.5
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.1185-1186
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• 2008

A nuclear explosion emits a transient radiation pulse like gamma rays. Gamma rays have a high energy and cause unexpected effects in semiconductor devices. These effects are mainly referred to dose-rate latcup and dose-rate upset. By transient radiation pulse in CMOS devices, dose-rate latchup is simulated in this paper.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.6
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• pp.131-139
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• 1989

This paper proposes Domino CMOS NOR-NOR Array Logic design method which has the same as characteristic of CMOS and Domino CMOS in Array Logic like PLA, good operation feature, high desity, easy test generation. This testable design method can detect all of faults in the circuit using simple additional circuit and solve the parasitic capacitance problem by improving the pull-down characteristics. A Test generation algorithm and test procedure using concept of PLA product term and personality matrix are proposed, and it was implemented in PASCAL language. This design method is verified by SPICE and P-SPICE simulation.