• ETRI Journal
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• 제28권6호
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• pp.732-738
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• 2006

In this paper, novel CMOS pseudo-exponential circuits operating in a class-AB mode are presented. The pseudo-exponential approximation employed is based on second order equations. Such terms are derived in a straightforward way from the inherent nonlinear currents of class-AB transconductors. The cells are appropriate to be integrated in portable equipment due to their compactness and very low power consumption. Measurement results from a fabricated prototype in a 0.5 ${\mu}m$ technology reveal a range of 45 dB with errors lower than ${\pm}0.5$ dB, a power consumption of 100 ${\mu}W$, and an area of 0.01 $mm^2$.

• ETRI Journal
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• 제19권3호
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• pp.228-241
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• 1997

In this paper, we present a design of modem and vocoder digital signal processor (DSP) chips for CDMA mobile station. The modem chip integrates CDMA reverse link modulator, CDMA forward link demodulator and Viterbi decoder. This chip contains 89,000 gates and 29 kbit RAMs, and the chip size is $10 mm{\times}10.1 mm$ which is fabricated using a $0.8{\mu}m$ 2 metal CMOs technology. To carry out the system-level simulation, models of the base station modulator, the fading channel, the automatic gain control loop, and the microcontroller were developed and interfaced with a gate-level description of the modem application specific integrated circuit (ASIC). The Modem chip is now successfully working in the real CDMA mobile station on its first fab-out. A new DSP architecture was designed to implement the Qualcomm code exited linear prediction (QCELP) vocoder algorithm in an efficient way. The 16 bit vocoder DSP chip has an architecture which supports direct and immediate addressing modes in one instruction cycle, combined with a RISC-type instruction set. This turns out to be effective for the implementation of vocoder algorithm in terms of performance and power consumption. The implementation of QCELP algorithm in our DSP requires only 28 million instruction per second (MIPS) of computation and 290 mW of power consumption. The DSP chip contains 32,000 gates, 32K ($2k{\times}16\;bit$) RAM, and 240k ($10k{\times}24\;bit$) ROM. The die size is $8.7\;mm{\times}8.3\;mm$ and chip is fabricated using $0.8\;{\mu}m$ CMOS technology.

• 센서학회지
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• 제28권2호
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• pp.71-75
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• 2019

This paper proposes the extension of the dynamic range in complementary metal oxide semiconductor (CMOS) image sensors (CIS) using switching operation of in-pixel inverter. A CMOS inverter is integrated in each unit pixel of the proposed CIS for switching operations. The n+/p-substrate photodiode junction capacitances are added to each unit pixel. When the output voltage of the photodiode is less than half of the power supply voltage of the CMOS inverter, the output voltage of the CMOS inverter changes from 0 V to the power supply voltage. Hence, the output voltage of the CMOS inverter is adjusted by changing the supply voltage of the CMOS inverter. Thus, the switching point is adjusted according to light intensity when the supply voltage of the CMOS inverter changes. Switching operations are then performed because the CMOS inverter is integrated with in each unit pixel. The proposed CIS is composed of a pixel array, multiplexers, shift registers, and biasing circuits. The size of the proposed pixel is $10{\mu}m{\times}10{\mu}m$. The number of pixels is $150(H){\times}220(V)$. The proposed CIS was fabricated using a $0.18{\mu}m$ 1-poly 6-metal CMOS standard process and its characteristics were experimentally analyzed.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권3호
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• pp.232-238
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• 2008

In this paper, a wideband power efficient 2.2 GHz - 4.9 GHz Medium Power Amplifier (MPA), has been designed and fabricated using $0.8{\mu}m$ SiGe BiCMOS process technology. Passive elements such as parallel-branch spiral inductor, metal-insulator-metal (MIM) capacitor and three types of resistors are all integrated in this process. This MPA is a two stage amplifier with all matching components and bias circuits integrated on-chip. A P1dB of 17.7 dBm has been measured with a power gain of 8.7 dB at 3.4 GHz with a total current consumption of 30 mA from a 3 V supply voltage at $25^{\circ}C$. The measured 3 dB bandwidth is 2.7 GHz and the maximum Power Added Efficiency (PAE) is 41 %, which are very good results for a fully integrated Medium PA. The fabricated circuit occupies a die area of $1.7mm{\times}0.8mm$.

• 전기전자학회논문지
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• 제9권1호
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• pp.57-64
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• 2005

본 논문에서는 전류 테스팅을 이용하여 CMOS 집적회로에 존재하는 결함을 검출하는 내장형 전류 감지회로를 설계하였다. 이 회로는 일반적인 CMOS 공정으로 구현하였으며 결함전류와 기준전류를 전압으로 변환시켜 시험대상 회로의 결함을 고속으로 검출하며, 미세공정에도 적용가능한 회로이다 제안한 전류 감지회로는 전류원 내장으로 인한 추가적인 전력소모를 문제를 해결하였다. 제안한 회로의 정당성 및 효율성은 HSPICE를 이용한 시뮬레이션으로 그 타당성을 입증하였다. 제안한 전류 감지회로가 칩의 전체 면적에서 차지하는 면적소모는 시험대상회로에서 약 9.2%로, 내장형 전류 감지회로에 의한 면적소모는 무시할 만 하다. 제안한 회로는 Hynix O.35um 2-poly 4-metal N-Well 표준 CMOS 공정으로 제작하였다.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권4호
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• pp.165-169
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• 2004

This paper reports a miniaturized conductor-backed CPW (CBCPW) bandpass filter based on a thin film polyimide layer coated on CMOS-grade silicon. With a 20 ${\mu}{\textrm}{m}$-thick polyimide interface layer and back metallization on the CMOS-grade silicon, the interaction of electromagnetic fields with the lossy silicon substrate has been isolated, and as a result a low-loss and low-dispersive CBCPW line has been obtained. Measured attenuation constant at 20 GHz is below 1.2 ㏈/cm, which is compatible with the CPW on GaAs. In addition, by using the proposed CBCPW geometry, miniaturized BPF for Ku band application is designed and its measured frequency response shows excellent agreement with the predicted value with validating the performances of the proposed CBCPW geometry for RFIC interconnects and filter applications.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권4호
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• pp.302-308
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• 2011

In this paper, we have proposed a new approach for optical failure analysis which employs a CMOS photon-emitting circuitry, consisting of a flip-flop based on a sense amplifier and a photon-emitting device. This method can be used even with deep-submicron processes where conventional optical failure analyses are difficult to use due to the low sensitivity in the near infrared (NIR) region of the spectrum. The effectiveness of our approach has been proved by the failure analysis of a prototype designed and fabricated in 0.18 ${\mu}m$ CMOS process.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권4호
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• pp.256-261
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• 2011

We demonstrate 3-Gb/s wireless link using a 60-GHz receiver front-end fabricated in $0.25-{\mu}m$ SiGe:C bipolar complementary metal oxide semiconductor (BiCMOS) and a mixed-mode quadrature phase-shift keying (QPSK) demodulator fabricated in 60-nm CMOS. The 60-GHz receiver consists of a low-noise amplifier and a down-conversion mixer. It has the peak conversion gain of 16 dB at 62 GHz and the 3-dB intermediate-frequency bandwidth of 6 GHz. The demodulator using 1-bit sampling scheme can demodulate up to 4.8-Gb/s QPSK signals. We achieve successful transmission of 3-Gb/s data in 60 GHz through 2-m wireless link.

• 전자공학회논문지A
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• 제29A권11호
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• pp.97-106
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• 1992

In integrated circuits, protection circuits are required to protect the internal nodes from the harmful ESD(Electrostatic discharge). This paper discusses the characteristics of the circuit components in ESD protection circuitry in order to analyze the ESD phenomina, and the design methodalogy of ESD protection circuits, using test pattern with a variation of the number of diode and transistor. The test devices are fabricated using a 0.8$\mu$m CMOS process. SPICE simulation was also carried out to relate output node voltage and measured ESD voltage. With increasing number of diodes and transistors in protection circuit, the ESD voltage also increases. The ESD voltage of the bi-directional circuit for both input and output was 100-300[V], which in higher than that of only output(uni-directional) circuit. In addition, the ESD protection circuit with the diode under the pad region was useful for the reduction of chip size and parasitic resistance. In this case, ESD voltage was improved to a value about 400[V].

• 대한전자공학회논문지SD
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• 제44권9호
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• pp.54-58
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• 2007

LTPS TFT의 개발과 성능 향상은 패널에 다양한 디지털 회로를 내장하는 SOP의 비약적 발전에 기여하였다. 본 논문에서는 일반적으로 적용되는 낮은 성능의 CMOS 논리게이트를 대체할 수 있는 전류모드 논리(CML) 게이트의 설계 방법을 소개한다. CML 인버터는 낮은 로직스윙, 빠른 응답 특성을 갖도록 설계할 수 있음을 보였으며 높은 소비전력의 단점도 동작 속도가 높아질수록 CMOS의 경우와 근사해졌다. 아울러 전류 구동능력을 키울 필요가 없는 까닭에 많은 수의 소자가 사용되지만 면적은 오히려 감소하는 것을 확인하였다. 특히 비반전 및 반전 출력이 동시에 생성되므로 noise immunity가 우수하다. 다수 입력을 갖는 NAND/AND 및 NOR/OR 게이트는 같은 회로에 입력신호를 바꾸어 구현할 수 있고 MUX와 XNOR/XOR 게이트도 같은 회로를 사용하여 구현할 수 있음을 보였다. 결론적으로 CML 게이트는 다양한 함수를 단순한 몇가지의 회로로 구성할 수 있으며 낮은 소비전력, 적은 면적, 개선된 동작속도 등을 동시에 추구할 수 있는 대안임을 확인하였다.