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http://dx.doi.org/10.5573/JSTS.2011.11.4.302

Optical Failure Analysis Technique in Deep Submicron CMOS Integrated Circuits  

Kim, Sunk-Won (Dep. EE., Seoul National University)
Lee, Hyong-Min (Dep. EE., Seoul National University)
Lee, Hyun-Joong (Dep. EE., Seoul National University)
Woo, Jong-Kwan (Dep. EE., Seoul National University)
Cheon, Jun-Ho (Dep. EE., Seoul National University)
Kim, Hwan-Yong (Dep. EE., Wonkwang University)
Park, Young-June (Dep. EE., Seoul National University)
Kim, Su-Hwan (Dep. EE., Seoul National University)
Publication Information
JSTS:Journal of Semiconductor Technology and Science / v.11, no.4, 2011 , pp. 302-308 More about this Journal
Abstract
In this paper, we have proposed a new approach for optical failure analysis which employs a CMOS photon-emitting circuitry, consisting of a flip-flop based on a sense amplifier and a photon-emitting device. This method can be used even with deep-submicron processes where conventional optical failure analyses are difficult to use due to the low sensitivity in the near infrared (NIR) region of the spectrum. The effectiveness of our approach has been proved by the failure analysis of a prototype designed and fabricated in 0.18 ${\mu}m$ CMOS process.
Keywords
Circuit testing; deep submicron CMOS technology; failure analysis; photon emission; picosecond imaging circuit analysis (PICA);
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1 W. Chunlei, L. Zhai, W. Wang, G. Song, L. Jinglong, Y. Joe, and M. Motohiko, "Defect Localization Using Photon Emission Microscopy Analysis with the Combination of OBIRCH Analysis," 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), pp.1-6, 2010.
2 F. Stellari, F. Zappa, S. Cova, and L. Vendrame, "Tools for non-invasive optical characterization of CMOS circuits," IEDM Tech. Dig., pp.487-490, 1999.
3 A Tosi, A Dalla Mora, F Pozzi, and F Zappa, "Modeling and Probing Hot-Carrier Luminescence From MOSFETs," IEEE Electron Device Lett., Vol.29, No.4, Apr., 2008.
4 Michael J.Y. Williams and James B. Angell, "Enhancing Testability of Large-Scale Integrated Circuits via Test Points and Additional Logic," IEEE Trans. Comput., Vol.22, No.1, pp.46-60, Jan., 1973.   DOI   ScienceOn
5 M. Matsui, H. Hara, Y. Uetani, L. Kim, T. Nagamatsu, and et al., "A 200 MHz 13mm2 2D DCT macrocell using sense-amplifying pipeline flip-flop scheme," IEEE J.Solid-State Circuits, Vol.29, No.12, pp.1482-1490, Dec., 1994.   DOI   ScienceOn
6 C. Boit, R.Schlangen, U.Kerst, and T.Lundquest, "Physical Techniques for Chip-Backside IC Debug in Nanotechnologies," IEEE Design & Test of Computers, 2008, pp.250-257.
7 C. Boit, ''Fundamentals of Photon Emission (PEM) in Silicon- Electroluminescence for Analysis of Electronic Circuit and Device Functionality,'' Microelectronics Failure Analysis Desk Reference, 5th ed., ASM Int'l, pp.356-368, 2004.
8 J. A. Kash and J. C. Tsang, "Dynamic Internal Testing of CMOS Circuits Using Hot Luminescence," IEEE Electron Device Lett., Vol.18, No.7, pp.330- 332, 1997.   DOI   ScienceOn
9 J. Tsang, J. Kash, and D. Vallett, "Picosecond Imaging Circuit Analysis," IBM J. Res. Develop., 44(4) pp.583-603 , 2000.   DOI
10 F. Stellari, A. Tosi, F. Zappa, and S. Cova, "CMOS circuit testing via time-resolved luminescence measurements and simulations," IEEE Trans. Instrum. Measur., Vol.53, No.1, pp.163-169, Feb., 2004.   DOI   ScienceOn
11 E. I. Cole Jr., J. M. Soden, J. L. Rife, D. L. Barton, and C. L. Henderson, "Novel Failure Analysis Techniques Using Photon Probing in a Scanning Optical Microscope," Proc. International Reliability Physics Symposium (IRPS), pp.388-398, Apr., 1994.
12 E. I. Cole Jr., P. Tangyunyong, D. A. Benson, and D. L. Barton, "TIVA and SEI Developments for Enhanced Front and Backside Interconnection Failure Analysis," Proc. European Symposium on Reliability of Electron Devices (ESREF), pp.991- 996, Oct., 1999.
13 K. Nikawa and S. Inoue, "New Capabilities of OBIRCH Method for Fault Localization and Defect Detection," Proc. Sixth Asian Test Symposium (ATS), pp.214-219, Jul., 1997.