• ETRI Journal
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• v.21 no.4
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• pp.1-8
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• 1999

Thick metal 0.8${\mu}m$ CMOS technology on high resistivity substrate(RF CMOS technology) is demonstrated for the L-band RF IC applications, and we successfully implemented it to the monolithic 900 MHz and 1.9 GHz CMOS LNAs for the first time. To enhance the performance of the RF circuits, MOSFET layout was optimized for high frequency operation and inductor quality was improved by modifying the technology. The fabricated 1.9 GHz LNA shows a gain of 15.2 dB and a NF of 2.8 dB at DC consumption current of 15mA that is an excellent noise performance compared with the offchip matched 1.9 GHz CMOS LNAs. The 900 MHz LNA shows a high gain of 19 dB and NF of 3.2 dB despite of the performance degradation due to the integrating of a 26 nH inductor for input match. The proposed RF CMOS technology is a compatibel process for analog CMOS ICs, and the monolithic LNAs employing the technology show a good and uniform RF performance in a five inch wafer.

• Journal of the Institute of Convergence Signal Processing
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• v.6 no.3
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• pp.134-142
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• 2005

The implementation of Multiple-Valued Logic(MVL) based on Current-Mode CMOS Logic(CMCL) circuits has recently been achieved. In this paper, four-valued Unary Multiple-Valued logic functions are synthesized using current-mode CMOS logic circuits. We properly make use of the fact that the CMCL addition of logic values represented using discrete current values can be performed at no cost and that negative logic values are readily available via reversing the direction of current flow. A synthesis process for CMCL circuits is based upon a logically complete set of basic elements. Proposed algorithm results in less expensive realization than those achieved using existing techniques in terms of the number of transistors needed. As an alternative to the cost-table techniques Universal Unary Programmable Circuit (UUPC) for a unary function is also proposed.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.3
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• pp.278-285
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• 2013

In this paper, a 100~110 GHz LNA and A coupler using standard 65 n CMOS process is presented. The LNA consists of three common source FET stages. A few layout types are considered to get high gain characteristic of unit common source cell. Also, optimized performance to achieve low noise characteristic and enough gain. Coupler is composed of broadside coupler using multimetal in CMOS fabrication. In the coupler, the metal strip to meet density rule is used, and the coupler is designed with consideration of the metal strip to function properly. Gain of fabricated LNA is 5.64 dB at 100 GHz and 6.39 dB at 110 GHz. Bandwidth is over 10 % and noise figure is 11.66 dB at 100 GHz. Fabricated coupler has shown insertion loss of 2~3 dB at 100~110 GHz band. Magnitude mismatch of coupler is below 1 dB and phase mismatch of coupler is below $5^{\circ}$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.5
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• pp.9-14
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• 2009

In this paper, we proposed a novel OTP unit bit of CMOS gate oxide antifuse using the standard CMOS process without additional process. The proposed OTP unit bit is composed of 3 transistors including an NMOS gate oxide antifuse and a sense amplifier of inverter type. The layout area of the proposed OTP unit bit is $22{\mu}m^2$ similar to a conventional OTP unit bit. The programming time of the proposed OTP unit bit is 3.6msec that is improved than that of the conventional OTP unit bit because it doesn't use high voltage blocking elements such as high voltage blocking switch transistor and resistor. And the OTP array with the proposed OTP unit bit doesn't need sense amplifier and bias generation circuit that are used in a conventional OTP array because sense amplifier of inverter type is included to the proposed OTP unit bit.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.6
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• pp.595-601
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• 2013

This paper presents an optimized design of a millimeter-wave on-chip dipole antenna using CMOS process. The serious flaw of the antenna using CMOS process is low radiation efficiency because of high permittivity and conductivity. To overcome the weakness, we need to widen radiation area in air and optimize distance between an antenna and a reflector. The radiation efficiency and bandwidth of the designed antenna are respectively 16.5 % and 22.3 % at 80 GHz. Systematic methods are attempt to analyze an effect on the antenna radiation efficiency. To widen radiation area in air, substrate cut angle and distance between the antenna and chip edge are adjusted. In addition, to optimize distance between an antenna and reflector, substrate thickness and distance between the antenna and a circuit ground plane are adjusted.

• Journal of Sensor Science and Technology
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• v.3 no.3
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• pp.16-21
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• 1994

A 3-terminal pin-type photosensor with gate contrail is fabricated using standard silicon CMOS IC process. The photosensor of a $100{\mu}m{\times}120{\mu}m$ size has dark current less than 1nA and its breakdown voltage is -14V with a depletion capacitance 0.75 pF at -5V reverse bias. Responsivity at 0V gate voltage is 0.25A/W at $0.633{\mu}m$ wavelength, 0.19A/W at $0.805{\mu}m$. Responsivity increases with increasing gate voltage. The integrated circuit of photosensor and CMOS inverter shows $22K{\Omega}$ transimpedance and photocurrent of $90{\mu}A$ switchs the output state of digital inverter without additional amplifier.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.199-207
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• 2011

A Ku-band low noise amplifier has been designed and fabricated by using 0.25 um SiGe BiCMOS process. The developed Ku-band LNA RFIC which has been designed with hetero-junction bipolar transistor(HBT) in the BiCMOS process have noise figure about 2.0 dB and linear gain over 19 dB in the frequency range from 9 GHz to 14 GHz. Optimization technique for p-tap value and electro-magnetic(EM) simulation technique had been used to overcome the inaccuracy in the PDK provided from the foundry service company and to supply the insufficient inductor library. The finally fabricated low noise amplifier of two fabrication runs has been implemented with the size of $0.65\;mm{\times}0.55\;mm$. The pure amplifier circuit layout with the reduced size of $0.4\;mm{\times}0.4\;mm$ without the input and output RF pads and DC bais pads has been incorporated as low noise amplication stages in the multi-function RFIC for the active phased array antenna of Ku-band satellite VSAT.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.4
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• pp.367-370
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• 2004

We fabricated SiGe BiCMOS devices, which are important for ultra high speed RF IC chips, by employing $0.35\mu{m}$ CMOS process. To meet with the requirement of low noise level with linear base leakage current at low VBE region, we try to minimize polysilicon/ silicon interface traps by optimizing capping silicon thickness and EDR(emitter drive-in RTA) temperature. We employed $200\AA$and $300\AA$-thick capping silicon, and varied the EDR process condition at temperature of $900-1000^\circ{C}$, and time of 0-30 sec at a given capping silicon thickness. We investigated current gain behavior at each process condition. We suggest that optimum EDR process condition would be $975^\circ{C}$-30 sec with $300\AA$-thick capping silicon for proposed $0.35\mu{m}$-SiGe HBT devices.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1121-1124
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• 1998

A CMOS RF bandpass amplifier which performs both functions of low-noise amplifier and bandpass filter is designed for the application of 1.9 ㎓ RF front-end in wireless receivers. The positive-feedback Q-enhancement technique is used to overcome the low gain and low Q factor of the bandpass amplifier. The designed bandpass amplifier is simulated with HSPICE and fabricated using HYUNDAI $0.8\mu\textrm{m}$ CMOS 2-poly 2-metal full custom process. Under 3 V supply voltage, results of simulation show that the CMOS bandpass amplifier provides the power gain 23dB, noise figure 3.8 dB, and power dissipation 55mW.

• Proceedings of the KIEE Conference
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• 2006.10c
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• pp.609-611
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• 2006

This paper describes a CMOS sub-bandgap reference using Pseudo-Resistors which can be widely used in flash memory, DRAM, ADC and Power management circuits. Bandgap reference circuit operates weak inversion for reducing power consumption and uses Pseudo-Resistors for reducing the chip area, instead of big resistor. It is implemented in 0.35um Standard 1P4M CMOS process. The temperature coefficient is 5ppm/$^{\circ}C$ from $40^{\circ}C$ to $100^{\circ}C$ and minimum power supply voltage is 1.2V The core area is 1177um${\times}$617um. Total current is below 2.8uA and output voltage is 0.598V at $27^{\circ}C$.