한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference) (Proceedings of the International Microelectronics And Packaging Society Conference)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
- 반년간
과학기술표준분류
- 전기/전자 > 전기전자부품
- 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
- 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
- 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
- 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
- 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
- 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
- 한국마이크로전자및패키징학회 2000년도 The IMAPS-Korea Workshop 2000 Emerging Technology on Packaging
- 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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A flexible Packaging scheme, which embedded chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (
$t<50{\mu}m$ ) are fabricated by chemical etching process to avoid possible surface damages on them. These technologies can be use for a real-time monitoring of blood pressure. Our research targets are implantable blood pressure sensor and its telemetric measurement. By winding round the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessel. -
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