• Journal of Korean Institute of Industrial Engineers
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• v.36 no.1
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• pp.42-51
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• 2010

The semiconductor industry is highly capital and technology intensive. Technology advancement on circuit design and process improvement requires chip makers continuously to invest a new fabrication facility that costs more than 3 billion US dollars. Especially major semiconductor companies recently started to discuss 450mm fabrication substituting existing 300mm fabrication of which facilities were initiated to build in 1998. If the plan is consolidated, the yield of 450mm facility would be more than doubled compared to existing 300mm facility. In steps of this important investment, facility layout has been acknowledged as one of the most important factors to be competitive in the market. This research proposes a new concept of semiconductor facility layout using hexagonal floor plan and its compatible material flow pattern. The main objective of this proposal is to improve the productivity of the unified layout that has been popularly used to build existing facilities. In this research, practical characteristics of the semiconductor fabrication are taken into account to develop a new layout alternative based on the analysis of Chung and Tanchoco (2009). The performance of the proposed layout alternative is analyzed using computer simulation and the results show that the new layout alternative outperforms the existing layout alternative, unified layout. However, a few questions on space efficiency to the new alternative were raised in communication with industry practitioners. These questions are left for a future study.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.26 no.2
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• pp.188-197
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• 2016

Objectives: The purpose of this study was to evaluate the ozone exposure levels and the variations in ozone concentration in a semiconductor fabrication facility and office in relation to the ozone concentration in the outdoor air. Methods: This study was performed in an office, semiconductor fabrication facility(such as etching, diffusion, diffusion plenum), and outdoors from June to August, 2015. Measurements were taken six times at the same places using an active sampler(pumped) and real-time equipment. Ozone monitoring by the active sampler method and analysis were carried out by OSHA Method ID-214. Real-time measurement was carried out by ozone measuring equipment using a non-dispersive ultraviolet absorption method. Results: Ozone concentrations in the semiconductor fabrication facility and office were 0.7~7.1 ppb in area samples and 0.72~4.07 ppb in real-time measurement, which were 0.88~8.88% of the occupational exposure limit. The concentration of ozone generated by a laser printer in the office was less than 2 ppb. There was not a significant difference between ozone concentrations before and after using the laser printer. The indoor/outdoor concentration ratio(I/O ratio) in the semiconductor fabrication facility and office was 0.05 and 0.06, respectively. Conclusions: All the samples contained ozone levels lower than the occupational exposure limit and it was confirmed that the concentration of outdoor ozone had no significant effect on indoor ozone concentration.

• Korean Journal of Hazardous Materials
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• v.3 no.1
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• pp.59-64
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• 2015

Semiconductor industry has large number of chemical inventory and is easily exposed to chemical release incidents. Toxic release is one of the most interested area in evaluating consequence to the vicinity of industry facilities handling hazardous materials. Hydrofluoric acid is one of the typical chemical used in semiconductor facility and is selected and toxic release is evaluated to assess the risk impacted to its off-site. Accident scenarios were listed using process safety information. The scenarios having effect to the off-site were selected and assessed further according to guideline provided by Korea government. Worst case and alternative scenarios including other interested scenarios were evaluated using ALOHA. Each evaluated scenario was assessed further considering countermeasures. The results showed that the facility handling hydroflooric acid is safe enough and needed no further protections at the moment.

• Proceedings of the Safety Management and Science Conference
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• 2009.11a
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• pp.187-201
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• 2009

Semiconductor industry is based on equipment industry and timing industry. In particular, semiconductor process is very complex and as semiconductor-chip width tails and is becoming equipment gradually more as a high technology. Equipment operation is primarily engaged in semiconductor manufacturing (engineers and operator) of being conducted by, equipment errors have also been raised. Equipment operational data related to the error of korea occupational safety and health agency were based on data and production engineers involved in the operator's questionnaire was drawn through the error factor. Equipment operating in the error factor of 9 big item and 36 detail item detailed argument based on the errors down, and 9 big item the equipment during operation of the correlation error factor was conducted. Each of the significance level was correlated with the tabulation and analysis. Using the maximum correlation coefficient, the correlation between the error factors to derive the relationship between factors were analyzed. Facility operating with the analysis of error factors (big and detail item) derive a relationship between the model saw. The end of the operation of the facility in operation on the part of the two factors appeared as prevention. Safety aspects and ergonomics aspects of the approach should be guided to the conclusion.

• Journal of Korean Institute of Industrial Engineers
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• v.35 no.4
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• pp.266-279
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• 2009

This paper focuses on the problem of scheduling wafer lots with limited waiting times between pairs of consecutive operations in a semiconductor wafer fabrication facility. For the problem of minimizing total tardiness of orders, we develop a priority rule based scheduling method in which a scheduling decision for an operation is made based on the states of workstations for the operation and its successor or predecessor operation. To evaluate performance of the suggested scheduling method, we perform simulation experiments using real factory data as well as randomly generated data sets. Results of the simulation experiments show that the suggested method performs better than a method suggested in other research and the one that has been used in practice.

• Proceedings of the Korea Society for Simulation Conference
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• 2002.11a
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• pp.115-121
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• 2002

The growth of semiconductor industry attracted to researchers like design, facility technique and making small size chip areas. But nowadays, cause of technology extension and oversupply and price down, yield improvement is the most important point on growth. This paper describes the computer mode]ing technique as the solutions to analyze the problem, to formalize the semiconductor manufacturing process and to build advanced manufacturing environments. The computer models are built referring an existing 8' wafer production line in Korea.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.38-41
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• 2019

Proton beam writing is a direct writing lithography technique for semiconductor fabrication process. The advantage of this technique is that the proton beam does not scatter as they travel through the matter and therefore maintain a straight path as they penetrate into the resist. The experiment has been carried out at Accelerator Mass Spectrometry facility. The focused proton beam with the fluence of $100nC/mm^2$ was exposed on the PMMA coated silicon sample to make a pattern on a photo resist. The results show the potential of proton beam writing as an effective way to produce semiconductor fabrication process.

• Journal of the Korean Society of Industry Convergence
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• v.15 no.1
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• pp.37-42
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• 2012

Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.

• The KSFM Journal of Fluid Machinery
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• v.16 no.2
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• pp.10-14
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• 2013

The present study conducts CFD analyses on the internal flow fields of roots type vacuum pumps of semiconductor fabrication facility, and the computed CFD results for internal pressure and temperature distributions are applied to structural analyses of the pumps. The coupled analysis results between flow and structure show that the deformation of pump structure is mainly resulted from the thermal expansion of gas in pump, and the deformed impeller and housing produce their severe contact and impact phenomena causing mechanical damage and fracture.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.1-5
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• 2023

Most of the production process is performed in a cleanroom in the case of facilities that produce semiconductor chips or display panels. Therefore, environmental management of cleanrooms is very important for product yield and quality control. Among them, airborne particles are a representative management item enough to be the standard for the actual cleanroom rating, and it is a part of the Fab or Facility monitoring system, and the sequential particle monitoring system is mainly used. However, this method has a problem in that measurement efficiency decreases as the length of the sampling tube increases. In addition, a statistically significant test of deterioration in efficiency has rarely been performed. Therefore, in this study, the statistically significant test between the number of particles measured by InSitu and the number of particles measured for each sampling tube ends(Remote). Through this, the efficiency degradation problem of the sequential particle monitoring system was confirmed by a statistical method.