• 제목/요약/키워드: magnetic random access memory(MRAM)

검색결과 49건 처리시간 0.023초

Technology of MRAM (Magneto-resistive Random Access Memory) Using MTJ(Magnetic Tunnel Junction) Cell

  • Park, Wanjun;Song, I-Hun;Park, Sangjin;Kim, Teawan
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제2권3호
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    • pp.197-204
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    • 2002
  • DRAM, SRAM, and FLASH memory are three major memory devices currently used in most electronic applications. But, they have very distinct attributes, therefore, each memory could be used only for limited applications. MRAM (Magneto-resistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. To be a commercially competitive memory device, scalability is an important factor as well. This paper is testing the actual electrical parameters and the scaling factors to limit MRAM technology in the semiconductor based memory device by an actual integration of MRAM core cell. Electrical tuning of MOS/MTJ, and control of resistance are important factors for data sensing, and control of magnetic switching for data writing.

MTJ based MRAM Core Cell

  • Park, Wanjun
    • Journal of Magnetics
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    • 제7권3호
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    • pp.101-105
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    • 2002
  • MRAM (Magnetoresistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. This paper is for testing the actual electrical parameters to adopt MRAM technology in the semiconductor based memory device. The discussed topics are an actual integration of MRAM core cell and its properties such as electrical tuning of MOS/MTJ for data sensing and control of magnetic switching for data writing. It will be also tested that limits of the MRAM technology for a high density memory.

SPIN ENGINEERING OF FERROMAGNETIC FILMS VIA INVERSE PIEZOELECTRIC EFFECT

  • Lee, Jeong-Won;Shin, Sung-Chul;Kim, Sang-Koog
    • 한국자기학회:학술대회 개요집
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    • 한국자기학회 2002년도 동계연구발표회 논문개요집
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    • pp.188-189
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    • 2002
  • One of the current goals in memory device developments is to realize a nonvolatile memory, i.e., the stored information maintains even when the power is turned off. The representative candidates for nonvolatile memories are magnetic random access memory (MRAM) and ferroelectric random access memory (FRAM). In order to achieve a high density memory in MRAM device, the external magnetic field should be localized in a tiny cell to control the direction of spontaneous magnetization. (omitted)

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Macro-Model of Magnetic Tunnel Junction for STT-MRAM including Dynamic Behavior

  • Kim, Kyungmin;Yoo, Changsik
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권6호
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    • pp.728-732
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    • 2014
  • Macro-model of magnetic tunnel junction (MTJ) for spin transfer torque magnetic random access memory (STT-MRAM) has been developed. The macro-model can describe the dynamic behavior such as the state change of MTJ as a function of the pulse width of driving current and voltage. The statistical behavior has been included in the model to represent the variation of the MTJ characteristic due to process variation. The macro-model has been developed in Verilog-A.

MRAM Technology for High Density Memory Application

  • Kim, Chang-Shuk;Jang, In-Woo;Lee, Kye-Nam;Lee, Seaung-Suk;Park, Sung-Hyung;Park, Gun-Sook;Ban, Geun-Do;Park, Young-Jin
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제2권3호
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    • pp.185-196
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    • 2002
  • MRAM(magnetic random access memory) is a promising candidate for a universal memory with non-volatile, fast operation speed and low power consumption. The simplest architecture of MRAM cell is a combination of MTJ(magnetic tunnel junction) as a data storage part and MOS transistor as a data selection part. This article will review the general development status of MRAM and discuss the issues. The key issues of MRAM technology as a future memory candidate are resistance control and low current operation for small enough device size. Switching issues are controllable with a choice of appropriate shape and fine patterning process. The control of fabrication is rather important to realize an actual memory device for MRAM technology.

차세대 자기저항메모리 MRAM 기술의 특허동향 분석 (Patent Analysis of MRAM Technology)

  • 노수정;이지성;조지웅;김도균;김영근;유양미;하미영;서주원
    • 한국자기학회지
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    • 제19권1호
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    • pp.35-42
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    • 2009
  • 차세대 메모리 소자 중 MRAM(Magnetic Random Access Memory)은 자기저항효과를 이용한 비휘발성 메모리로 기존 메모리를 대체할 것으로 주목을 받고 있다. MRAM은 자기터널 접합 소자를 이용해 구동할 수 있는데, 현재 고집적, 저 전력 소모 등의 장점을 극대화하기 위해 수직자화 특성을 갖는 자기터널 접합 개발과 스핀전달토크를 이용해 구동하는 STT-MRAM(Spin Transfer Torque-MRAM) 개발이 활발히 이루어지고 있다. 따라서 미국, 일본 등 MRAM 강국에서 고집적, 스위칭 전류 감소, 열적 안정성 등의 문제를 해결하기 위한 기술 특허 출원이 증가하고 있으며, 국내의 MRAM 연구기관에서의 특허 출원도 꾸준히 이루어지고 있다. 본고에서는 기존 국내외 특허 출원 및 등록 경향을 분석하고 향후 MRAM 개발방향을 제시하였다.

스핀전달토크형 자기저항메모리(STT-MRAM) 기술개발 동향 (Technology Trend of Spin-Transfer-Torque Magnetoresistive Random Access Memory (STT-MRAM))

  • 김도균;조지웅;노수정;김영근
    • 한국자기학회지
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    • 제19권1호
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    • pp.22-27
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    • 2009
  • 자기터널접합 기반의 MRAM(Magnetoresistive Random Access Memory)의 상용화를 위해서 가장 중요한 이슈는 쓰기 과정(writing operation)에서의 자화반전에 필요한 자화반전전류를 감소시키는 것이다. 본고에서는 나노자기소자 기술의 중요한 분야인 MRAM의 기술발전방향과 특히 스핀전달토크(Spin Transfer Torque, STT)를 이용한 자화반전전류의 저감기술 개발동향을 재료기술, 구조기술 등으로 살펴보았다.

MRAM read와 write line의 S-parameter 해석 (S-parameter Analysis for Read and Write Line of MRAM)

  • 박승영;조순철
    • 한국자기학회지
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    • 제13권5호
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    • pp.216-220
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    • 2003
  • 본 연구에서는 MRAM(magnetic random access memory)이 10 GHz까지 높은 주파수에서 동작할 때 쓰기 신호와 읽기 신호가 얼마나 효율적으로 전달되는지 계산하였다. 이를 위해 읽기와 쓰기에 필요한 도선이 있는 시편을 3차원으로 모델링하였다. 모의실험은 쓰기 동작과 읽기 동작으로 나눠서 수행되었고, FEM(finite element method) 알고리즘을 이용하여 S-parameter를 출력하였다. 계산된 결과를 이용하여 실험적으로 설계된 MRAM 시편의 쓰기와 읽기 동작에서 전송계수 S$_{21}$을 각각 DC에서 1 GHz 그리고 100 GHz 까지의 영역에서 해석하였다. 또한 각각의 길이가 600 $\mu$m인 bit line과 sense line사이의 절연체 두께를 500에서 1500$\AA$으로 변화시켰을 때, 3 dB 감쇄 주파수를 135에서 430 MHz까지 약 3.3배 높일 수 있었다. 그리고 계산된 S-parameter를 이용하여 전달 지연을 계산하여 접근시간을 예측하였다.