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MRAM Technology for High Density Memory Application  

Kim, Chang-Shuk (MRAM at the Memory R&D Center in Hynix Semiconductor Inc.)
Jang, In-Woo (MRAM at the Memory R&D Center in Hynix Semiconductor Inc.)
Lee, Kye-Nam (MRAM at the Memory R&D Center in Hynix Semiconductor Inc.)
Lee, Seaung-Suk (MRAM at the Memory R&D Center in Hynix Semiconductor Inc.)
Park, Sung-Hyung (MRAM at the Memory R&D Center in Hynix Semiconductor Inc.)
Park, Gun-Sook (MRAM at the Memory R&D Center in Hynix Semiconductor Inc.)
Ban, Geun-Do (MRAM at the Memory R&D Center in Hynix Semiconductor Inc.)
Park, Young-Jin (MRAM at the Memory R&D Center in Hynix Semiconductor Inc.)
Publication Information
JSTS:Journal of Semiconductor Technology and Science / v.2, no.3, 2002 , pp. 185-196 More about this Journal
Abstract
MRAM(magnetic random access memory) is a promising candidate for a universal memory with non-volatile, fast operation speed and low power consumption. The simplest architecture of MRAM cell is a combination of MTJ(magnetic tunnel junction) as a data storage part and MOS transistor as a data selection part. This article will review the general development status of MRAM and discuss the issues. The key issues of MRAM technology as a future memory candidate are resistance control and low current operation for small enough device size. Switching issues are controllable with a choice of appropriate shape and fine patterning process. The control of fabrication is rather important to realize an actual memory device for MRAM technology.
Keywords
MRAM; MTJ; TMR; non-volatile memory;
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