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Technology of MRAM (Magneto-resistive Random Access Memory) Using MTJ(Magnetic Tunnel Junction) Cell  

Park, Wanjun (SAMSUNG Advanced Institute of Technology, MD Lab)
Song, I-Hun (SAMSUNG Advanced Institute of Technology, MD Lab)
Park, Sangjin (SAMSUNG Advanced Institute of Technology, MD Lab)
Kim, Teawan (SAMSUNG Advanced Institute of Technology, MD Lab)
Publication Information
JSTS:Journal of Semiconductor Technology and Science / v.2, no.3, 2002 , pp. 197-204 More about this Journal
Abstract
DRAM, SRAM, and FLASH memory are three major memory devices currently used in most electronic applications. But, they have very distinct attributes, therefore, each memory could be used only for limited applications. MRAM (Magneto-resistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. To be a commercially competitive memory device, scalability is an important factor as well. This paper is testing the actual electrical parameters and the scaling factors to limit MRAM technology in the semiconductor based memory device by an actual integration of MRAM core cell. Electrical tuning of MOS/MTJ, and control of resistance are important factors for data sensing, and control of magnetic switching for data writing.
Keywords
MRAM(Magneto-resistive Random Access Memory); GMR(Giant Magneto-resistance); MTJ(Magnetic Tunnel Junction);
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