• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.12
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• pp.53-60
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• 2005

This work proposes a 10b 100 MS/s $1.4\;mm^2$ CMOS ADC for low-power multimedia applications. The proposed two-step pipeline ADC minimizes chip area and power dissipation at the target resolution and sampling rate. The wide-band SHA employs a gate-bootstrapping circuit to handle both single-ended and differential inputs with 1.2 Vp-p at 10b accuracy while the second-stage flash ADC employs open-loop offset sampling techniques to achieve 6b resolution. A 3-D fully symmetrical layout reduces the capacitor and device mismatch of the first-stage MDAC. The low-noise references are integrated on chip with optional off-chip voltage references. The prototype 10b ADC implemented in a 0.18 um CMOS shows the maximum measured DNL and INL of 0.59 LSB and 0.77 LSB, respectively. The ADC demonstrates the SNDR of 54 dB, the SFDR of 62 dB, and the power dissipation of 56 mW at 100 MS/s.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.12 s.354
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• pp.55-64
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• 2006

This work proposes a calibration-free 14b 70MS/s 0.13um CMOS ADC for high-performance integrated systems such as WLAN and high-definition video systems simultaneously requiring high resolution, low power, and small size at high speed. The proposed ADC employs signal insensitive 3-D fully symmetric layout techniques in two MDACs for high matching accuracy without any calibration. A three-stage pipeline architecture minimizes power consumption and chip area at the target resolution and sampling rate. The input SHA with a controlled trans-conductance ratio of two amplifier stages simultaneously achieves high gain and high phase margin with gate-bootstrapped sampling switches for 14b input accuracy at the Nyquist frequency. A back-end sub-ranging flash ADC with open-loop offset cancellation and interpolation achieves 6b accuracy at 70MS/s. Low-noise current and voltage references are employed on chip with optional off-chip reference voltages. The prototype ADC implemented in a 0.13um CMOS is based on a 0.35um minimum channel length for 2.5V applications. The measured DNL and INL are within 0.65LSB and l.80LSB, respectively. The prototype ADC shows maximum SNDR and SFDR of 66dB and 81dB and a power consumption of 235mW at 70MS/s. The active die area is $3.3mm^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.3
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• pp.60-68
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• 2008

This work describes a re-configurable 10MS/s to 100MS/s, low-power 10b two-step pipeline ADC operating at a power supply from 0.5V to 1.2V. MOS transistors with a low-threshold voltage are employed partially in the input sampling switches and differential pair of the SHA and MDAC for a proper signal swing margin at a 0.5V supply. The integrated adjustable current reference optimizes the static and dynamic performance of amplifiers at 10b accuracy with a wide range of supply voltages. A signal-isolated layout improves the capacitor mismatch of the MDAC while a switched-bias power-reduction technique reduces the power dissipation of comparators in the flash ADCs. The prototype ADC in a 0.13um CMOS process demonstrates the measured DNL and INL within 0.35LSB and 0.49LSB. The ADC with an active die area of $0.98mm^2$ shows a maximum SNDR and SFDR of 56.0dB and 69.6dB, respectively, and a power consumption of 19.2mW at a nominal condition of 0.8V and 60MS/s.

• Journal of the Institute of Convergence Signal Processing
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• v.12 no.2
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• pp.139-144
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• 2011

The modern digital logic technology does not yet satisfy the speed requirements of real-time DSP circuits due to synchronized operation of multiplication and accumulation. This operation degrades DSP performance. Therefore, the double-base number system (DBNS) has emerged in DSP system as an alternative methodology because of fast multiplication and hardware simplicity. In this paper, authors propose a novel multiplication architecture. One operand is an output of a flash analog-to-digital converter (ADC) in DBNS format, while the other operand is a coefficient in the IEEE standard floating-point number format. The DBNS digital output from ADC is produced through a new double base number encoder (DBNE). The multiplied output is in the format of the IEEE standard floating-point number (FPNS). The proposed circuits process multiplication and conversion together. Compared to a typical multiplier that uses the FPNS, the proposed multiplier also consumes 45% less gates, and 44% faster than the FPNS multiplier on Spartan-3 FPGA board. The design is verified with FIR filter applications.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.3
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• pp.160-165
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• 2009

A 12b 2 MS/s cyclic ADC processing 3.3 Vpp single-ended rail-to-rail input signals is presented. The proposed ADC demonstrates an offset voltage less than 1 mV without well-known calibration and trimming techniques although power supplies are directly employed as voltage references. The SHA-free input sampling scheme and the two-stage switched op-amp discussed in this work reduce power dissipation, while the comparators based on capacitor-divided voltage references show a matched full-scale performance between two flash sub ADCs. The prototype ADC in a $0.18{\mu}m$ 1P6M CMOS demonstrates the effective number of bits of 11.48 for a 100 kHz full-scale input at 2 MS/s. The ADC with an active die area of $0.12\;mm^2$ consumes 3.6 m W at 2 MS/s and 3.3 V (analog)/1.8 V (digital).

• The Journal of Korean Institute of Communications and Information Sciences
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• v.40 no.4
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• pp.613-618
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• 2015

This paper proposed a low power CMOS Flash-SAR A/D converter which consists of a Flash A/D converter for 2 most significant bits and a SAR A/D converter with capacitor D/A converter for 8 least significant bits. Employment of a Flash A/D converter allows the proposed circuit to enhance the conversion speed. The SAR A/D converter with capacitor D/A converter provides a low power dissipation. The proposed A/D converter consumes $136{\mu}W$ with a power supply of 1V under a $0.18{\mu}m$ CMOS process and achieves 9.16 effective number of bits for sampling frequency up to 2MHz. Therefore it results in 120fJ/step of Figure of Merit (FoM).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.6 s.336
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• pp.1-8
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• 2005

In this paper, CMOS A/D converter with 6bit 2GSPS Nyquist input at 1.8V is designed. In order to obtain the resolution of 6bit and the character of high-speed operation, we present an Interpolation type architecture. In order to overcome the problems of high speed operation, a novel One-zero Detecting Encoder, a circuit to reduce the Reference Fluctuation, an Averaging Resistor and a Track & Hold, a novel Buffered Reference for the improved SNR are proposed. The proposed ADC is based on 0.18um 1-poly 3-metal N-well CMOS technology, and it consumes 145mW at 1.8V power supply and occupies chip area of 977um $\times$ 1040um. Experimental result show that SNDR is 36.25 dB when sampling frequency is 2GHz and INL/DNL is $\pm$0.5LSB at static performance.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.31B no.7
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• pp.42-48
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• 1994

In this paper, a low power and high speed flash Analog-to-Digital Converter using current-mode concept is proposed. Current-mode approach offers a number of advantages over conventional voltage-mode approach, such as lower power consumption small chip area improved accuracy etc. Rescently this concept was applied to algorithmic A/D Converter. But, its conversion speed is limited to medium speed. Consequently this converter is not applicable to the high speed signal processing system. This ADC is fabricated in 1.2um double metal CMOS standard process. This ADC's conversion time is measured to be 7MHz, and power consumption is 2.0mW, and differential nonlinearity is less than 1.14LSB and total harmonic distortion is -50dB. The active area of analog chip is about 350 x 550u$m^2$. The proposed ADC seems suitable for a single chip design of digital signal processing system required high conversion speed, high resolution small chip area and low power consumption.

• Journal of Korea Society of Industrial Information Systems
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• v.20 no.1
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• pp.1-7
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• 2015

In this paper, a 12-bit high resolution, power and area efficiency hybrid digital pulse width modulator (DPWM) with process and temperature (PT) calibration has been proposed for digital controlled DC-DC converters. The hybrid structure of DPWM combines a 6-bit differential tapped delay line ring-mux digital-to-time converter (DTC) schema and a 6-bit counter-comparator DTC schema, resulting in a power and area saving solution. Furthermore, since the 6-bit differential delay line ring oscillator serves as the clock to the high 6-bit counter-comparator DTC, a high frequency clock is eliminated, and the power is significantly saved. In order to have a simple delay cell and flexible delay time controllability, a voltage controlled inverter is adopted to build the deferential delay cell, which allows fine-tuning of the delay time. The PT calibration circuit is composed of process and temperature monitors, two 2-bit flash ADCs and a lookup table. The monitor circuits sense the PT (Process and Temperature) variations, and the flash ADC converts the data into a digital code. The complete circuits design has been verified under different corners of CMOS 0.18um process technology node.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.5
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• pp.25-33
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• 2011

This work proposes a skinny-type 10b 50MS/s 0.13um CMOS three-step pipeline ADC for CIS applications. Analog circuits for CIS applications commonly employ a high supply voltage to acquire a sufficiently acceptable dynamic range, while digital circuits use a low supply voltage to minimize power consumption. The proposed ADC converts analog signals in a wide-swing range to low voltage-based digital data using both of the two supply voltages. An op-amp sharing technique employed in residue amplifiers properly controls currents depending on the amplification mode of each pipeline stage, optimizes the performance of op-amps, and improves the power efficiency. In three FLASH ADCs, the number of input stages are reduced in half by the interpolation technique while each comparator consists of only a latch with low kick-back noise based on pull-down switches to separate the input nodes and output nodes. Reference circuits achieve a required settling time only with on-chip low-power drivers and digital correction logic has two kinds of level shifter depending on signal-voltage levels to be processed. The prototype ADC in a 0.13um CMOS to support 0.35um thick-gate-oxide transistors demonstrates the measured DNL and INL within 0.42LSB and 1.19LSB, respectively. The ADC shows a maximum SNDR of 55.4dB and a maximum SFDR of 68.7dB at 50MS/s, respectively. The ADC with an active die area of 0.53$mm^2$ consumes 15.6mW at 50MS/s with an analog voltage of 2.0V and two digital voltages of 2.8V ($=D_H$) and 1.2V ($=D_L$).