• 제목/요약/키워드: SONOS Memory

검색결과 71건 처리시간 0.026초

SONOS 플래시 메모리 소자의 구조와 크기에 따른 특성연구 (Characteristics Analysis Related with Structure and Size of SONOS Flash Memory Device)

  • 양승동;오재섭;박정규;정광석;김유미;윤호진;최득성;이희덕;이가원
    • 한국전기전자재료학회논문지
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    • 제23권9호
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    • pp.676-680
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    • 2010
  • In this paper, Fin-type silicon-oxide-nitride-oxide-silicon (SONOS) flash memory are fabricated and the electrical characteristics are analyzed. Compared to the planar-type SONOS devices, Fin-type SONOS devices show good short channel effect (SCE) immunity due to the enhanced gate controllability. In memory characteristics such as program/erase speed, endurance and data retention, Fin-type SONOS flash memory are also superior to those of conventional planar-type. In addition, Fin-type SONOS device shows improved SCE immunity in accordance with the decrease of Fin width. This is known to be due to the fully depleted mode operation as the Fin width decreases. In Fin-type, however, the memory characteristic improvement is not shown in narrower Fin width. This is thought to be caused by the Fin structure where the electric field of Fin top can interference with the Fin side electric field and be lowered.

NAND 전하트랩 플래시메모리를 위한 p채널 SONOS 트랜지스터의 특성 (The Characteristics of p-channel SONOS Transistor for the NAND Charge-trap Flash Memory)

  • 김병철;김주연
    • 한국전기전자재료학회논문지
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    • 제22권1호
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    • pp.7-11
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    • 2009
  • In this study, p-channel silicon-oxide-nitride-oxide-silicon(SONOS) transistors are fabricated and characterized as an unit cell for NAND flash memory. The SONOS transistors are fabricated by $0.13{\mu}m$ low power standard logic process technology. The thicknesses of gate insulators are 2.0 nm for the tunnel oxide, 1.4 nm for the nitride layer, and 4.9 nm for the blocking oxide. The fabricated SONOS transistors show low programming voltage and fast erase speed. However, the retention and endurance of the devices show poor characteristics.

인공신경망을 위한 SONOS 기억소자의 시냅스특성에 관한 연구 (A Study on the Synaptic Characteristics of SONOS memories for the Artificial Neural Networks)

  • 이성배;김주연;서광열
    • 한국전기전자재료학회논문지
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    • 제11권1호
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    • pp.7-11
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    • 1998
  • In this paper, a new synapse cell with nonvolatile SONOS semiconductor memory device is proposed and it's fundamental function electronically implemented SONOS NVSM has shown characteristics that the memory value, synaptic weights, can be increased or decreased incrementally. A novel SONOS synapse is used to read out the stored analog value. For the purpose of synapse implementation using SONOS NVSM, this work has investigated multiplying characteristics including weight updating characteristics and neuron output characteristics. It is concluded that SONOS synapse cell has good agreement for use as a synapse in artificial neural networks.

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p채널 SONOS 전하트랩 플래시메모리의 제작 및 특성 (The Fabrication and Characteristics of p-channel SONOS Charge-Trap Flash Memory)

  • 김병철;김주연
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2008년도 추계종합학술대회 B
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    • pp.604-607
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    • 2008
  • 본 연구에서는 NAND 플래시메모리를 위한 기본 셀로서 p채널 SONOS (silicon-oxide-nitride-oxide-silicon) 트랜지스터를 제작하고 이것의 메모리특성을 조사하였다. SONOS 트랜지스터의 제작은 $0.13{\mu}m$ low power용 standard logic 공정기술을 사용하였다. 게이트 절연막의 두께는 터널 산화막 $20{\AA}$, 질화막 $14{\AA}$, 그리고 블로킹산화막의 두께는 $49{\AA}$이다. 제작된 SONOS 트랜지스터는 낮은 쓰기/지우기 전압, 빠른 지우기 속도, 그리고 비교적 우수한 기억유지특성과 endurance 특성을 나타내었다.

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Spatial Distribution of Injected Charge Carriers in SONOS Memory Cells

  • Kim Byung-Cheul;Seob Sun-Ae
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2006년도 춘계종합학술대회
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    • pp.894-897
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    • 2006
  • Spatial distribution of injected electrons and holes is evaluated by using single-junction charge pumping technique in SONOS(Poly-silicon/Oxide/Nitride/Oxide/Silicon) memory cells. Injected electron are limited to length of ONO(Oxide/Nitride/oxide) region in locally ONO stacked cell, while are spread widely along with channel in fully ONO stacked cell. Hot-holes are trapped into the oxide as well as the ONO stack in locally ONO stacked cell.

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수직형 4-비트 SONOS를 이용한 고집적화된 3차원 NOR 플래시 메모리 (Highly Integrated 3-dimensional NOR Flash Array with Vertical 4-bit SONOS (V4SONOS))

  • 김윤;윤장근;조성재;박병국
    • 대한전자공학회논문지SD
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    • 제47권2호
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    • pp.1-6
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    • 2010
  • 수직형 채널을 가지는 4-비트 SONOS 플래시 메모리를 이용하여, 고집적화된 3차원 형태의 NOR 플래시 메모리 어레이를 제안하였다. 수직형 채널을 가지기 때문에, 집적도의 제한 없이 충분히 긴 채널을 가질 수 있다. 이로 인하여, 짧은 채널의 멀티 비트 메모리에서 발생할 수 있는 비트 간의 간섭효과, 짧은 채널 효과, 및 전하 재분포 현상을 해결 할 수 있다. 또한, 제시된 어레이는 3차원 형태를 기반으로 고집적화되어, 발표된 NOR 중에서 최소의 셀 크기 값인 $1.5F^2$/bit을 가진다.

Feasibility of ferroelectric materials as a blocking layer in charge trap flash (CTF) memory

  • Zhang, Yong-Jie;An, Ho-Myoung;Kim, Hee-Dong;Nam, Ki-Hyun;Seo, Yu-Jeong;Kim, Tae-Geun
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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    • pp.119-119
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    • 2008
  • The electrical characteristics of Metal-Ferroelectric-Nitride-Oxide-Silicon (MFNOS) structure is studied and compared to the conventional Silicon-Oixde-Nitride-Oxide-Silicon (SONOS) capacitor. The ferroelectric blocking layer is SrBiNbO (SBN with Sr/Bi ratio 1-x/2+x) with the thickness of 200 nm and is fabricated by the RF sputter. The memory windows of MFNOS and SONOS capacitors with sweep voltage from +10 V to -10 V are 6.9 V and 5.9 V, respectively. The effect of ferroelectric blocking layer and charge trapping on the memory window was discussed. The retention of MFNOS capacitor also shows the 10-years and longer retention time than that of the SONOS capacitor. The better retention properties of the MFNOS capacitor may be attributed to the charge holding effect by the polarization of ferroelectric layer.

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ONO Ruptures Caused by ONO Implantation in a SONOS Non-Volatile Memory Device

  • Kim, Sang-Yong;Kim, Il-Soo
    • Transactions on Electrical and Electronic Materials
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    • 제12권1호
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    • pp.16-19
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    • 2011
  • The oxide-nitride-oxide (ONO) deposition process was added to the beginning of a 0.25 ${\mu}m$ embedded polysiliconoxide-nitride-oxide-silicon (SONOS) process before all of the logic well implantation processes in order to maintain the characteristics of basic CMOS(complementary metal-oxide semiconductor) logic technology. The system subsequently suffered severe ONO rupture failure. The damage was caused by the ONO implantation and was responsible for the ONO rupture failure in the embedded SONOS process. Furthermore, based on the experimental results as well as an implanted ion's energy loss model, processes primarily producing permanent displacement damages responsible for the ONO rupture failure were investigated for the embedded SONOS process.

SONOS 구조를 갖는 멀티 비트 소자의 프로그래밍 특성 (Programming Characteristics of the Multi-bit Devices Based on SONOS Structure)

  • 김주연
    • 한국전기전자재료학회논문지
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    • 제16권9호
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    • pp.771-774
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    • 2003
  • In this paper, the programming characteristics of the multi-bit devices based on SONOS structure are investigated. Our devices have been fabricated by 0.35 $\mu\textrm{m}$ complementary metal-oxide-semiconductor (CMOS) process with LOCOS isolation. In order to achieve the multi-bit operation per cell, charges must be locally frapped in the nitride layer above the channel near the source-drain junction. Programming method is selected by Channel Hot Electron (CUE) injection which is available for localized trap in nitride film. To demonstrate CHE injection, substrate current (Isub) and one-shot programming curve are investigated. The multi-bit operation which stores two-bit per cell is investigated. Also, Hot Hole(HH) injection for fast erasing is used. The fabricated SONOS devices have ultra-thinner gate dielectrics and then have lower programming voltage, simpler process and better scalability compared to any other multi-bit storage Flash memory. Our programming characteristics are shown to be the most promising for the multi-bit flash memory.

SONOS 구조의 EAROM Cell제조 및 그 전기적 특성에 관한 연구 (Study on the Fabrication of EAROM with SONOS Structure and Their Characteristics)

  • 정곤;정호선;강진영;김보우
    • 대한전자공학회논문지
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    • 제22권6호
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    • pp.83-88
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    • 1985
  • An electrically alterable read only memory with polysilicon gate is experimently realized employing a SONOS structure. The SONOS memory cells are proposed to achieve lower programming voltage with thin nitride (70A, 170$\AA$) layer. Its programming voltage is 10V (Tnit=70$\AA$), 22V(Tnit=170$\AA$). And the SONOS cell is able to, erasc biasing negative gate pulse, then its voltage is about -24V for nitride thickness of 170$\AA$.

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