• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.2
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• pp.405-413
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• 2013

In this paper, a high-reliability differential paired 24-bit eFuse OTP memory with program-verify-read mode for PMICs is designed. In the proposed program-verify-read mode, the eFuse OTP memory can do a sensing margin test with a variable pull-up load in consideration of programmed eFuse resistance variation and can output a comparison result through a PFb (pass fail bar) pin by comparing a programmed datum with its read one. It is verified by simulation results that the sensing resistance is lower with $4k{\Omega}$ in case of the designed differential paired eFuse OTP memory than $50k{\Omega}$ in case of its dual-port eFuse OTP memory.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.7
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• pp.1455-1462
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• 2012

In this paper, a BCD process based high-reliability 24-bit dual-port eFuse OTP Memory for PMICs is designed. We propose a comparison circuit at program-verify-read mode to test that the program datum is correct by using a dynamic pseudo NMOS logic circuit. The comparison result of the program datum with its read datum is outputted to PFb (pass fail bar) pin. Thus, the normal operation of the designed OTP memory can be verified easily by checking the PFb pin. Also we propose a sensing margin test circuit with a variable pull-up load out of consideration for resistance variations of programmed eFuse at program-verify-read mode. We design a 24-bit eFuse OTP memory which uses Magnachip's $0.35{\mu}m$ BCD process, and the layout size is $289.9{\mu}m{\times}163.65{\mu}m$ ($=0.0475mm^2$).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.1
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• pp.28-35
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• 2007

In this paper, an ultra low voltage SRAM design method based on dual-boosted cell bias technique is described. For each read/write cycle, the wordline and cell power node of the selected SRAM cells are boosted into two different voltage levels. This enhances SNM(Static Noise Margin) to a sufficient amount without an increase of the cell size, even at sub 1-V supply voltage. It also improves the SRAM circuit speed owing to increase of the cell read-out current. The proposed design technique has been demonstrated through 0.8-V, 32K-byte SRAM macro design in a $0.18-{\mu}m$ CMOS technology. Compared to the conventional cell bias technique, the simulation confirms an 135 % enhancement of the cell SNM and a 31 % faster speed at 0.8-V supply voltage. This prototype chip shows an access time of 23 ns and a power dissipation of $125\;{\mu}W/Hz$.

• Journal of Korea Society of Industrial Information Systems
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• v.18 no.5
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• pp.19-23
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• 2013

This paper deals with the analysis of 6T SRAM cell stability for Hi-speed processing Ternary Content Addressable Memory. The higher the operation frequency, the smaller CMOS technology required in the designed TCAM because the purpose of TCAM is high-speed data processing. Decrease of Supply voltage is one cause of unstable TCAM operation. Thus, We should design TCAM through analysis of SRAM cell stability. In this paper we propose methodology to characterize the Static Noise Margin of 6T SRAM. All simulations of the TCAM have been carried out in 180nm CMOS process technology.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.10
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• pp.2359-2368
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• 2013

In this paper, an IRD (internal read data) circuit preventing the reentry into the read mode while keeping the read-out DOUT datum at power-up even if noise such as glitches occurs at signal ports such as an input signal port RD (read) when a power IC is on, is proposed. Also, a pulsed WL (word line) driving method is used to prevent a DC current of several tens of micro amperes from flowing into the read transistor of a differential paired eFuse OTP cell. Thus, reliability is secured by preventing non-blown eFuse links from being blown by the EM (electro-migration). Furthermore, a compared output between a programmed datum and a read-out datum is outputted to the PFb (pass fail bar) pin while performing a sensing margin test with a variable pull-up load in consideration of resistance variation of a programmed eFuse in the program-verify-read mode. The layout size of the 8-bit eFuse OTP IP with a $0.18{\mu}m$ process is $189.625{\mu}m{\times}138.850{\mu}m(=0.0263mm^2)$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.11
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• pp.71-78
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• 1995

Based on the popular 4-transistor SRAM cell, an analytical expression of the minimum cell ratio was derived by modeling the static read operation. By analyzing the relatively simple expression for the minimum cell ratio, which was derived assuming the ideal transistor characteristics, effects of the changes in supply voltage and process parameters on the minimum cell ratio was predicted, and the minimum power supply voltage for read operation was determined. The results were verified by simulations utilizing the suggested simulation method, which is suitable for monitoring the lower limit of supply voltage for proper cell operation. From the analysis, it was shown that the worst condition for cell operation is low temperature and low supply voltage, and that the operation margin can be effectively improved by reducing the threshold voltage of the cell transistors.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.108-114
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• 1995

Recently, along wtih the advance of high-performance system, synchronous DRAM's (SDRAM's) which provide consecutive data output synchronized with an external clock signal, have been reported. However, in the conventional SDRAM's which utilize a multi-stage serial pipelined scheme, the column path is divided into multi-stages depending on CAS latency N. Thus, as the operating speed and CAS latency increase, new stages must be added, thereby causing a large area penalty due to additinal latches and I/O lines. In the proposed register-based parallel pipelined scheme, (N-1) registers are located between the read data bus line pair and the data output buffer and the coming data are sequentially stored. Since the column data path is not divided and the read data is directly transmitted to the registers, the busrt read operation can easily be achieved at higher frequencies without a large area penalty and degradation of internal timing margin. Simulation results for 0.32um-Tech. 4-Bank 64M SDRAM show good operation at 200MHz and an area increment is less than 0.1% when CAS latency N is increased from 3 to 4.. This pipelined scheme is more advantageous as the operating frequency increases.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.293-316
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• 2006

[ $\blacksquare$ ] I/O Signal $\square$ We see adequate margin for the RC B design $\square$ Minimum ODW value is 328ps using Ac to DC measurement for the read case. $\square$ Minimum ODW value is 350ps using AC to DC mesurement method for the write case. $\blacksquare$ CLK Signal $\square$ The slew-rate decreases when the Cterm value increases $\square$ Lower slew-rate could effect delay and jitter. $\square$ There are some ldge issues during transitions with lower Cterm and without Cterm. $\square$ Our recommendation for the Cterm value range is between 1.5pF to 2.4pF. $\blacksquare$ ADD/CMD/Ctrl Signal $\square$ High output slew-rate at low VDD causes ring back that reduces voltage margin because of x-talk. $\square$ 30ohm Rterm for the CTRL signal shows a better signal integrity result compared to 36ohm.

• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1555-1557
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• 2002

We have investigated the precharge type sense amplifier, it is suitable fur voltage sensing in a NOR type single transistor ferroelectric field effect transistor (1T FeFET) memory read operation. The proposed precharge type sense amplifier senses the bit line voltage of 1T FeFET memory. Therefore, the reference celt is not necessary compared to current sensing in 1T FeFET memory, The high noise margin is wider than the low noise margin in the first inverter because requires tile output of precharge type sense amplifier high sensitivity to transition of input signal. The precharge type sense amplifier has very simple structure and can sense the bit line signal of the 1T FeFET memory cell at low voltage.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.1
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• pp.37-50
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• 2009

Evaluation results about area scaling capabilities of various SRAM margin-assist techniques for random $V_T$ variability issues are described. Various efforts to address these issues by not only the cell topology changes from 6T to 8T and 10T but also incorporating multiple voltage-supply for the cell terminal biasing and timing sequence controls of read and write are comprehensively compared in light of an impact on the required area overhead for each design solution given by ever increasing $V_T$ variation (${\sigma}_{VT}$). Two different scenarios which hinge upon the EOT (Effective Oxide Thickness) scaling trend of being pessimistic and optimistic, are assumed to compare the area scaling trends among various SRAM solutions for 32 nm process node and beyond. As a result, it has been shown that 6T SRAM will be allowed long reign even in 15 nm node if ${\sigma}_{VT}$ can be suppressed to < 70 mV thanks to EOT scaling for LSTP (Low Standby Power) process.