• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.8
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• pp.350-354
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• 2005

This paper proposes a new method for delay time calculation in RLC interconnects. This method is simple, but precise. The proposed method can calculate delay time of RLC interconnects by simple numerical formula calculation without complex moment calculation using reduced model in RLC interconnects. The results using the proposed method for RLC circuits show that average relative error is within $10\%$ in comparison with HSPICE simulation results.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.2
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• pp.168-174
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• 2012

This paper describes a novel global on-chip interconnect scheme, in which a one UI-delayed symbol as well as the current symbol is sent for easing the sensing operation at receiver end. With this approach, the voltage swing on the channel for reliable sensing can be reduced, resulting in performance improvement in terms of power consumption, peak current, and delay spread due to PVT variations, as compared to the conventional repeater insertion schemes. Evaluation for on-chip interconnects having various lengths in a 130 nm CMOS process indicated that the proposed on-chip interconnect scheme achieved a power reduction of up to 71.3%. The peak current during data transmission and the delay spread due to PVT variations were also reduced by as much as 52.1% and 65.3%, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.9
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• pp.78-85
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• 2000

A new analytical VLSI interconnect delay model is presented and its accuracy is experimentally verified. In the model, the transmission line parameter variations due to skin effect, proximity effect, and silicon substrate effect are taken into account. That is, the circuit model of the interconnect line that includes these effects is newly developed and analyzed. For the model verification, test patterns combined the coplanar structure with microstrip were designed by using 0.35${\mu}m$ CMOS process technology. It is shown that the accuracy of the model is less than about 10% error.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.8
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• pp.1-9
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• 1999

Timing-level circuit analyses are used to obtain fast and accurate results, and the analysis of gate and interconnect delay is necessary to validate the correctness of circuit design. This paper proposes an efficient algorithm which simultaneously calculates the gate delay and the transition time of linearized voltage source for subsequent interconnect delay calculation. The notion of effective capacitance is used to calculate the gate delay and the transition time of linearized voltage source which considers the on-resistance of driving gate. The procedure for obtaining the gate delay and the transition time of linearized voltage source has been developed through an iterative operation using the precharacterized data of gates. While previous methods require extra information for the transition time calculation of linearized voltage sources, our method uses the derived data during the gate delay calculation process, which does not require any change in the precharacterization process.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.1 s.343
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• pp.37-44
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• 2006

This paper proposes an interconnect delay fault test (IDFT) solution on boards and SoCs based on IEEE 1149.1 and IEEE P1500. A new IDFT system clock rising edge generator which forces output boundary scan cells to update test data at the rising edge of system clock and input boundary scan cells to capture the test data at the next rising edge of the system clock is introduced. Using this proposed circuit, IDFT for interconnects synchronized to different system clocks in frequency can be achieved efficiently. Moreover, the proposed IDFT technique does not require any modification of the boundary scan cells or the standard TAP controller is simple in terms of test procedure and is small in terms of area overhead.

• Journal of KIISE:Computer Systems and Theory
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• v.34 no.2
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• pp.84-92
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• 2007

This paper proposes an interconnect delay fault test (IDFT) solution on boards and SoCs based on IEEE 1149.1 and IEEE P1500. A new IDFT system clock rising edge generator which forces output boundary scan cells to update test data at the rising edge of system clock and input boundary scan cells to capture the test data at the next rising edge of the system clock is introduced. Using this proposed circuit, IDFT for interconnects synchronized to different system clocks in frequency can be achieved efficiently. Moreover, the proposed IDFT technique does not require any modification of the boundary scan cells or the standard TAP controller and simplifies the test procedure and reduces the area overhead.

• Journal of Electrical Engineering and information Science
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• v.2 no.5
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• pp.17-26
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• 1997

Interconnect characterization on a wafer level was performed. Test patterns for single, two-coupled, and triple-coupled lines ere designed by using 0.5$\mu\textrm{m}$ CMOS process. Then interconnect capacitances and resistances were experimentally extracted by using tow port network measurements, Particularly to eliminate parasitic effects, the Y-parameter de-embedding was performed with specially designed de-embedding patterns. Also, for the purpose of comparisons, capacitance matrices were calculated by using the existing CAD model and field-solver-based commercial simulator, METAL and MEDICI. This work experimentally verifies that existing CAD models or parameter extraction may have large deviation from real values. The signal transient simulation with the experimental data and other methodologies such as field-solver-based simulation and existing model was performed. as expected, the significantly affect on the signal delay and crosstalk. The signal delay due to interconnects dominates the sub-micron-based a gate delay (e.g., inverter). Particularly, coupling capacitance deviation is so large (about more than 45% in the worst case) that signal integrity cannot e guaranteed with the existing methodologies. The characterization methodologies of this paper can be very usefully employed for the signal integrity verification or he electrical design rule establishments of IC interconnects in the industry.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.52 no.5
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• pp.193-193
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• 2003

This Paper analyses several model-order reduction methods and then proposes an improved n model and a new delay calculation method to be used in analyzing RC-class interconnects, which does not involve moment calculation processes. The proposed delay calculation method has been derived by combining the unproved $\pi$ model, the concept of effective capacitance and Elmore delay. This method has an advantage in that it can be applied in the calculation of end-to-end delay as well as incremental delay.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.5
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• pp.193-200
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• 2003

This Paper analyses several model-order reduction methods and then proposes an improved n model and a new delay calculation method to be used in analyzing RC-class interconnects, which does not involve moment calculation processes. The proposed delay calculation method has been derived by combining the unproved $\pi$ model, the concept of effective capacitance and Elmore delay. This method has an advantage in that it can be applied in the calculation of end-to-end delay as well as incremental delay.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.2
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• pp.67-75
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• 2004

This paper presents a buffer insertion method for RLC-class interconnect structured as a sin91e line or a tree. First, a closed form expression for the interconnect delay of a CMOS buffer driving single RLC line is represented. This expression has been derived by the n-th power law for deep submicrometer technology and occurs to be within 9 percentage of maximal relative error in accuracy compared with the results of HSPICE simulation for various RLC loads. This paper proposes a closed form expression based on this for the buffer insertion of single RLC lines and the buffer sizing algorithms for RLC tree interconnects to optimize path delays. The proposed buffer insertion algorithms are applied to insert buffers for several interconnect trees with a 0.25${\mu}{\textrm}{m}$ CMOS technology and the results are compared against those of HSPICE.