• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1753-1756
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• 2005

The sheet parts are formed with dies conventionally. But this conventional forming process is not suited to small volume and varied production for the reason of high cost. For the solution of this problem, a new forming process, which is called CNC incremental sheet forming, is being introduced. This process can form sheet parts without die, and is very well suited to small volume and varied production in space flight and automobile. In this paper, dieless CNC forming system based on a machining center is developed. A special device to grasp and pull the blank sheet built in the machining center and tool path generation S/W from STL file of 3-D model are developed. Several sheet parts are incrementally formed to verify the effectiveness of the developed system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.3
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• pp.1014-1020
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• 2012

This paper focuses on the development of a supporting S/W tool that can minimize designer's manual operations and errors in metal mold design based on a 3D solid model. The scope in this work includes the offset surface modeling, the computation of the padding force, the generation of material table, the decision of hole position, the estimation of the size of raw material, which are the essential parts of press die and mold design in automotive industry. The proposed system has been developed as a plug-in type using Pro/E API and Visual C++ in order to put the system into the menu functions of Pro/E which is one major 3D CAD systems in the manufacturing industry.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.3
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• pp.198-206
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• 2013

This paper presents a wide band, fine-resolution digitally controlled oscillator (DCO) with an on-chip 3-D solenoid inductor using the 0.13 ${\mu}m$ digital CMOS process. The on-chip solenoid inductor is vertically constructed by using Metal and Via layers with a horizontal scalability. Compared to a spiral inductor, it has the advantage of occupying a small area and this is due to its 3-D structure. To control the frequency of the DCO, active capacitor and active inductor are tuned digitally. To cover the wide tuning range, a three-step coarse tuning scheme is used. In addition, the DCO gain needs to be calibrated digitally to compensate for gain variations. The DCO with solenoid inductor is fabricated in 0.13 ${\mu}m$ process and the die area of the solenoid inductor is 0.013 $mm^2$. The DCO tuning range is about 54 % at 4.1 GHz, and the power consumption is 6.6 mW from a 1.2 V supply voltage. An effective frequency resolution is 0.14 kHz. The measured phase noise of the DCO output at 5.195 GHz is -110.61 dBc/Hz at 1 MHz offset.

• ETRI Journal
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• v.33 no.3
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• pp.366-373
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• 2011

In this paper, we propose a low-power all-digital phase-locked loop (ADPLL) with a wide input range and a high resolution time-to-digital converter (TDC). The resolution of the proposed TDC is improved by using a phase-interpolator and the time amplifier. The phase noise of the proposed ADPLL is improved by using a fine resolution digitally controlled oscillator (DCO) with an active inductor. In order to control the frequency of the DCO, the transconductance of the active inductor is tuned digitally. The die area of the ADPLL is 0.8 $mm^2$ using 0.13 ${\mu}m$ CMOS technology. The frequency resolution of the TDC is 1 ps. The DCO tuning range is 58% at 2.4 GHz and the effective DCO frequency resolution is 0.14 kHz. The phase noise of the ADPLL output at 2.4 GHz is -120.5 dBc/Hz with a 1 MHz offset. The total power consumption of the ADPLL is 12 mW from a 1.2 V supply voltage.

• Journal of electromagnetic engineering and science
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• v.6 no.1
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• pp.30-35
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• 2006

This paper describes fully integrated low phase noise MMIC voltage controlled oscillators(VCOs). The Asymmetrical Inductance Tank VCO(AIT-VCO), which optimize the shortcoming of the previous tank's inductance optimization approach, has lower phase noise performance due to achieving higher equivalent parallel resistance and Q value of the tank. This VCO features an output power signal in the range of - 11.53 dBm and a tuning range of 261 MHz or 15.2 % of its operating frequency. This VCO exhibits a phase noise of - 117.3 dBc/Hz at a frequency offset of 100 kHz from carrier. A phase noise reduction of 15 dB was achieved relative to only one spiral inductor. The AIT-VCO achieved low very low figure of merit of -184.6 dBc/Hz. The die area, including buffers and bond pads, is $0.9{\times}0.9mm^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.5 s.347
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• pp.54-63
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• 2006

This work proposes a 14b 100MS/s 0.18um CMOS ADC with optimized resolution, conversion speed, die area, and power dissipation to obtain the performance required in the fourth-generation mobile communication systems. The 3-stage pipeline ADC, whose optimized architecture is analyzed and verified with behavioral model simulations, employs a wide-band low-noise SHA to achieve a 14b level ENOB at the Nyquist input frequency, 3-D fully symmetric layout techniques to minimize capacitor mismatch in two MDACs, and a back-end 6b flash ADC based on open-loop offset sampling and interpolation to obtain 6b accuracy and small chip area at 100MS/s. The prototype ADC implemented in a 0.18um CMOS process shows the measured DNL and INL of maximum 1.03LSB and 5.47LSB, respectively. The ADC demonstrates a maximum SNDR and SFDR of 59dB and 72dB, respectively, and a power consumption of 145mW at 100MS/s and 1.8V. The occupied active die area is $3.4mm^2$.

• The Journal of the Acoustical Society of Korea
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• v.16 no.4
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• pp.76-84
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• 1997

In this paper, one of the core components of a mobile communication system, VCO(Voltage Controlled Oscillator) IC is designed. The VCO IC was designed, have realized as LC turned oscillator using varicap. LC sinusoidal tuned oscillator generally requires external inductors and thus remainding circuit is implemneted in monolithic IC. The circuit is fabricated using an 15 mask IC process and has a die size of 1150um${\times}$780um. The tests showed that VCO was operated at frequencies in the regions between 880MHz-915MHz in the control voltage range of 1V to 3V at 5V supply voltage and as the power supply was varied from 4.5V to 5.5V, the frequency varied 425KHz/V. The VCO IC has frequency shift of 1.97MHz/T, carrier level of -7dBm and power consumption of 16.7mA. Also it has phase noise of -80dBc/Hz, offset at 50KHz and harmonic response of center frequency is -41dBm. For the future development of the transceiver 1 chip, the previously mentioned external devices need to be incorporated into Si MMIC.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.2
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• pp.189-197
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• 2014

This work proposes a 12b 100 MS/s $0.11{\mu}m$ CMOS three-step hybrid pipeline ADC for high-speed communication and mobile display systems requiring high resolution, low power, and small size. The first stage based on time-interleaved dual-channel SAR ADCs properly handles the Nyquist-rate input without a dedicated SHA. An input sampling clock for each SAR ADC is synchronized to a reference clock to minimize a sampling-time mismatch between the channels. Only one residue amplifier is employed and shared in the proposed ADC for the first-stage SAR ADCs as well as the MDAC of back-end pipeline stages. The shared amplifier, in particular, reduces performance degradation caused by offset and gain mismatches between two channels of the SAR ADCs. Two separate reference voltages relieve a reference disturbance due to the different operating frequencies of the front-end SAR ADCs and the back-end pipeline stages. The prototype ADC in a $0.11{\mu}m$ CMOS shows the measured DNL and INL within 0.38 LSB and 1.21 LSB, respectively. The ADC occupies an active die area of $1.34mm^2$ and consumes 25.3 mW with a maximum SNDR and SFDR of 60.2 dB and 69.5 dB, respectively, at 1.1 V and 100 MS/s.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.6 s.336
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• pp.59-66
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• 2005

CMOS LC VCO for tri-bind wireless LAN applications was designed in 1.8V 0.18$\mu$m CMOS process. PMOS transistors were chosen for VCO core to reduce flicker noise. The possible operation was verified for 5.8GHz band (5.725$\~$5.825GHz), 5.2GHz band (5.150$\~$5.325GHz), and 2.4GHz band (2.412$\~$2.484GHz) using the switchable L-C resonators. To linearize its frequency-voltage gain (Kvco), optimized multiple MOS varactor biasing technique was used for capacitance linearization and PLL stability improvement. VCO core consumed 2mA current and $570{\mu}m{\times}600{\mu}m$ die area. The phase noise was lower than -110dBc/Hz at 1MHz offset for tri-band frequencies.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.2
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• pp.95-103
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• 2011

This paper proposes a 6b 1.2 GS/s 47.8 mW 0.17 $mm^2$ 65 nm CMOS ADC for high-rate wireless personal area network systems. The proposed ADC employs a source follower-free flash architecture with a wide input range of 1.0 $V_{p-p}$ at a 1.2 V supply voltage to minimize power consumption and high comparator offset effects in a nanometer CMOS technology. The track-and-hold circuits without source followers, the differential difference amplifiers with active loads in pre-amps, and the output averaging layout scheme properly handle a wide-range input signal with low distortion. The interpolation scheme halves the required number of pre-amps while three-stage cascaded latches implement a skew-free GS/s operation. The two-step bubble correction logic removes a maximum of three consecutive bubble code errors. The prototype ADC in a 65 nm CMOS demonstrates a measured DNL and INL within 0.77 LSB and 0.98 LSB, respectively. The ADC shows a maximum SNDR of 33.2 dB and a maximum SFDR of 44.7 dB at 1.2 GS/s. The ADC with an active die area of 0.17 $mm^2$ consumes 47.8 mW at 1.2 V and 1.2 GS/s.