• 공업화학
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• 제33권6호
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• pp.574-580
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• 2022

Dendrite 형태의 구리 입자 표면을 은으로 무전해 도금을 하는 과정에서, 치환도금(displacement plating)과 화학 환원도금(reducing electroless plating)을 병용하여 다양한 silver-coated copper (Ag@Cu) 입자들을 제조하였다. Ag@Cu 입자들의 물리화학적 특성은 SEM-EDS, TGA, XPS, XRD 및 BET 등으로 분석하였으며, 환원반응에 의하여 코팅되는 은은 구리 입자 표면에 나노 입자 형태로 형성되는 것을 확인할 수 있었다. Ag@Cu 입자들을 에폭시 수지와 복합화하여 도전성 필름을 제조하고 그의 열적 안정성을 평가하였다. 치환 반응과 환원 반응의 차이가 Ag@Cu 필름의 초기 저항 및 열적 안정성에 미치는 영향에 관하여 연구하였다.

• 한국분말재료학회지
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• 제9권6호
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• pp.441-448
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• 2002

Dispersions of non-soluble ceramic particles in a metallic matrix can enhance the strength and heat resistance of materials. With the advent of mechanical alloying it became possible to put the theoretical concept into practice by incorporating very fine particles in a flirty uniform distribution into often oxidation- and corrosion- resistant metal matrices. e.g. superalloys. The present paper will give an overview about the mechanical alloying technique as a dry, high energy ball milling process for producing composite metal powders with a fine controlled microstructure. The common way is milling of a mixture of metallic and nonmetallic powders (e.g. oxides. carbides, nitrides, borides) in a high energy ball mill. The heavy mechanical deformation during milling causes also fracture of the ceramic particles to be distributed homogeneously by further milling. The mechanisms of the process are described. To obtain a homogeneous distribution of nano-sized dispersoids in a more ductile matrix (e.g. aluminium-or copper based alloys) a reaction milling is suitable. Dispersoid can be formed in a solid state reaction by introducing materials that react with the matrix either during milling or during a subsequent heat treatment. The pre-conditions for obtaining high quality materials, which require a homogeneous distribution of small dis-persoids, are: milling behaviour of the ductile phase (Al, Cu) will be improved by the additives (e.g. graphite), homogeneous introduction of the additives into the granules is possible and the additive reacts with the matrix or an alloying element to form hard particles that are inert with respect to the matrix also at elevated temperatures. The mechanism of the in-situ formation of dispersoids is described using copper-based alloys as an example. A comparison between the in-situ formation of dispersoids (TiC) in the copper matrix and the milling of Cu-TiC mixtures is given with respect to the microstructure and properties, obtained.

• 한국표면공학회지
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• 제41권1호
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• pp.23-27
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• 2008

The effect of solution agitation on the copper electroless deposition process of ULSI (ultra large scale integration) interconnections was investigated by using physical, electrochemical and electrical techniques. It was found that proper solution agitation was effective to obtain superconformal copper configuration within the trenches of $130{\sim}80nm$ width. The transition of open potential during electroless deposition process showed that solution agitation induced compact structure of copper deposits by suppressing mass transfer of cuprous ions toward substrate. Also, the specific resistivity of copper layers was lowered by increasing agitation speed, which made the deposited copper particles smaller. Considering both copper deposit configuration and electric property, around 500 rpm of solution agitation was the most suitable for the homogeneous electroless copper filling within the ultra-fine patterns.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1382-1385
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• 2006

We have studied ink-jet printing method for patterning of conductive line on flexible plastic substrates. Synthesized copper nano-particles of ${\sim}40\;nm$ were used for the conductive ink and the printed patterns exhibit a smooth line whose line width is about $100\;{\mu}m$.

• 한국분말재료학회지
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• 제21권1호
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• pp.39-43
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• 2014

Bulk nanostructured copper was fabricated by a shock compaction method using the planar shock wave generated by a single gas gun system. Nano sized powders, average diameter of 100 nm, were compacted into the capsule and target die, which were designed to eliminate the effect of undesired shock wave, and then impacted with an aluminum alloy target at 400 m/s. Microstructure and mechanical properties of the shock compact specimen were analyzed using an optical microscope (OM), scanning electron microscope (SEM), and micro indentation. Hardness results showed low values (approximately 45~80 Hv) similar or slightly higher than those of conventional coarse grained commercial purity copper. This result indicates the poor quality of bonding between particles. Images from OM and SEM also confirmed that no strong bonding was achieved between them due to the insufficient energy and surface oxygen layer of the powders.

• 대한화학회지
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• 제60권5호
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• pp.317-320
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• 2016

Efficient copper removal from water was achieved by using surface modified silica spheres with 3-mercaptopropyltrimethoxysilane (MPTMS) using base catalyst. The surface modification of silica spheres was performed by hydrolysis and condensation reactions of the MPTMS. The characteristic infrared absorption peaks at 2929, 1454, and 1343 cm⁻¹ represent the −CH₂ stretching vibration, asymmetric deformation, and deformation, respectively. The absorption peaks at 2580 and 693 cm⁻¹ corresponding the −SH stretching vibration and the C-S stretching vibration indicate the incorporation of MPTMS to the surface of silica spheres. Field emission scanning electron microscope (FESEM) image of the surface modified silica sphere (SMSS) shows nano-particles of MPTMS on the surface of silica spheres. High concentration of copper solution (1000 ppm) was used to test the copper removal efficiency and uptake capacity. The FESEM image of SMSS treated with the copper solution shows large number of copper lumps on the surface of SMSS. The copper concentration drastically decreased with increasing the amount of SMSS. The residual copper concentrations were analyzed using inductively coupled plasma mass spectrometer. The copper removal efficiency and uptake capacity with 1000 ppm of copper solution were 99.99 % and 125 mg/g, respectively.

• Bulletin of the Korean Chemical Society
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• 제31권1호
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• pp.100-103
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• 2010

In this study, NO reduction behaviors of copper-loaded mesoporous molecular sieves (Cu/MCM-41) have been investigated. The Cu loading on MCM-41 surfaces was accomplished by a chemical reduction method with different Cu contents (5, 10, 20, and 40%). $N_2/77$ K adsorption isotherm characteristics, including the specific surface area and pore volume, were studied by BET's equation. NO reduction behaviors were confirmed by a gas chromatography. From the experimental results, the Cu loading amount on MCM-41 led to the increase of NO reduction efficiency in spite of decreasing the specific surface area of catalysts. This result indicates that highly ordered porous structure in the MCM-41 and the presence of active metal particles lead the synergistical NO reduction reactions due to the increase in adsorption energy of MCM-41 surfaces by the Cu particles.

• 공업화학
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• 제16권4호
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• pp.485-490
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• 2005

유동층 전극 반응기에서 기체의 주입이 산업폐수로부터 동입자의 회수에 미치는 영향을 고찰하였다. 유동층 전극 반응기에서 액체유속(0.1~0.4 cm/s), 전류밀도($2.0{\sim}3.5A/dm^2$) 그리고 투입되는 유동 고체입자의 양(1.0~4.0 wt%)의 일정조건에서 기체의 주입(0.1~0.4 cm/s)이 각 상들의 체류량과 동입자 회수효율에 미치는 영향을 검토하였다. 유동 고체 입자로는 폴리 스틸렌과 DVB (Divinyl Benzene)로 구성된 직경 0.5 mm의 구형입자(swelling 밀도: $1100kg/m^3$)를 사용하였다. 유동층 전극반응기에서 주입되는 기체 유속이 증가함에 따라 고체 체류량과 기체 체류량은 증가하는 반면 액체 체류량은 감소하는 경향을 나타내었다. 반응기내에 기체를 0.1~0.2 cm/s 정도 주입한 경우 기체 주입전에 비해 동 회수율이 증가한 반면 0.3~0.4 cm/s 이상 주입하면 기체 주입전보다 동 회수율은 오히려 감소하는 것으로 나타났다. 유동층 반응기에서 기체 및 액체 유속, 두 전극간 거리 그리고 유동고체입자의 양이 증가함에 따라 동의 회수율은 증가하다가 최대의 회수율을 나타낸 후 점점 감소하는 경향을 나타내었다. 전류밀도가 증가함에 따라서 동의 회수율은 패러데이 법칙에 의해 거의 선형적인 증가를 나타내었다.

• 한국분말재료학회지
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• 제23권3호
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• pp.228-234
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• 2016

Copper nanoparticles attract much attention as substitutes of noble metals such as silver and can help reduce the manufacturing cost of electronic products due to their lower cost and good conductivity. In the present work, the chemical reduction is examined to optimize the synthesis of nano-sized copper particles from copper sulfate. Sodium borohydride and ascorbic acid are used as reducing and antioxidant agents, respectively. Polyethylene glycol (PEG) is used as a size-control and capping agent. An appropriate dose of PEG inhibits the abnormal growth of copper nanoparticles, maintaining chemical stability. The addition of ascorbic acid prevents the oxidation of nanoparticles during synthesis and storage. Transmission electron microscopy (TEM) and Fourier transform infrared spectroscopy (FTIR) are used to investigate the size of the synthesized nanoparticles and the coordination between copper nanoparticles and PEG. For chemical reduction, copper nanoparticles less than 100 nm in size without oxidized layers are successfully obtained by the present method.

• 한국분말재료학회지
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• 제10권6호
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• pp.443-447
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• 2003

Nano-sized $TiB_2$ was in situ synthesized in copper matrix through self-propagating high temperature synthesis (SHS) with high-energy ball milled Ti-B-Cu elemental mixtures as powder precursors. The size of $TiB_2$ particles in the product of SHS reaction decreases with time of preliminary mechanical treatment ranging from 1 in untreated mixture to 0.1 in mixtures milled for 3 min. Subsequent mechanical treatment of the product of SHS reaction allowed the $TiB_2$ particles to be reduced down to 30-50 nm. Microstructural change of $TiB_2$-Cu nanocomposite during spark plasma sintering (SPS) was also investigated. Under simultaneous action of pressure, temperature and electric current, titanium diboride nanoparticles distributed in copper matrix move, agglomerate and form a interpenetrating phase composite with a fine-grained skeleton.