Applied Chemistry for Engineering (공업화학)

The Korean Society of Industrial and Engineering Chemistry (한국공업화학회)
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Study on Improvement of Thermal Stability of Dendrite-shape Copper Particles by Electroless Silver Plating

Dendrite 형상 구리 입자의 무전해 은 도금에 의한 열적 안정성 향상에 관한 연구

  • Received : 2022.10.05
  • Accepted : 2022.10.11
  • Published : 2022.12.10
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Abstract

While in the process of electroless plating of dendrite-shape copper with silver, various silver-coated copper (Ag@Cu) particles were prepared by using both displacement plating and reducing electroless plating. The physicochemical properties of Ag@Cu particles were analyzed by scanning electron microscope- energy-dispersive X-ray spectroscopy (SEM-EDS), thermogravimetric analysis (TGA), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and Brunauer-Emmett-Teller analysis (BET), and it was confirmed that the silver coated by the reducing electroless plating was formed as nano-particles on the copper surface. Ag@Cu particles were compounded with an epoxy resin to prepare a conductive film, and its thermal stability was evaluated. We investigated the effect of the difference between the displacement plating and reducing electroless plating on the initial resistance and thermal stability of conductive films.

Dendrite 형태의 구리 입자 표면을 은으로 무전해 도금을 하는 과정에서, 치환도금(displacement plating)과 화학 환원도금(reducing electroless plating)을 병용하여 다양한 silver-coated copper (Ag@Cu) 입자들을 제조하였다. Ag@Cu 입자들의 물리화학적 특성은 SEM-EDS, TGA, XPS, XRD 및 BET 등으로 분석하였으며, 환원반응에 의하여 코팅되는 은은 구리 입자 표면에 나노 입자 형태로 형성되는 것을 확인할 수 있었다. Ag@Cu 입자들을 에폭시 수지와 복합화하여 도전성 필름을 제조하고 그의 열적 안정성을 평가하였다. 치환 반응과 환원 반응의 차이가 Ag@Cu 필름의 초기 저항 및 열적 안정성에 미치는 영향에 관하여 연구하였다.

Keywords

Acknowledgement

본 논문은 중소벤처기업부의 2020년 구매조건부신제품개발사업 연구비에서 지원된 연구(과제번호 : S2951389, 과제명 : 저온 소결이 가능한 전도성 접착제용 은 나노입자 결합형 하이브리드 금속분말 개발)이며, 이에 감사를 드립니다.

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