• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.4
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• pp.7-14
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• 2012

A image quality is limited by a sample-and-hold circuit of the X-ray CMOS image sensor even though simple mos switch or bootstrapped clock circuit are used to get high quality sampled signal. Because distortion of sampled signal is produced by the charge injection from sample-and-hold circuit even using bootstrapped. This paper presents the 3D micro-inductor design methode in the CMOS process. Using this methode, it is possible to increase the ENOB (effective number of bit) through the use of micro-inductor which is calculated and designed in standard CMOS process in this paper. The ENOB is improved 0.7 bit from 17.64 bit to 18.34 bit without any circuit just by optimized inductor value resulting in verified simulation result. Because of this feature, micro-inductor methode suggested in this paper is able to adapt a mamography that is needed high resolution so that it help to decrease patients dose amount.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.8
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• pp.79-85
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• 2009

In this paper, an accurate current reference using temperature and process compensation current mirror (TPC-CM) is proposed. The temperature independent reference current is generated by summing a proportional to absolute temperature (PTAT) current and a complementary to absolute temperature (CTAT) current. However, the temperature coefficient and magnitude of the reference current are influenced by the process variation. To calibrate the process variation, the proposed TPC-CM uses two binary weighted current mirrors which control the temperature coefficient and magnitude of the reference current. After the PTAT and CTAT current is measured, the switch codes of the TPC-CM is fixed in order that the magnitude of reference current is independent to temperature. And, the codes are stored in the non-volatile memory. In the simulation, the effect of the process variation is reduced to 0.52% from 19.7% after the calibration using a TPC-CM in chip-by-chip. A current reference chip is fabricated with a 3.3V 0.35um CMOS process. The measured calibrated reference current has 0.42% variation for $20^{\circ}$C${\sim}$100$^{\circ}$C.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.129-132
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• 2000

In this paper, a 1.8㎓ low noise amplifier was designed and simulated using 0.2$\mu\textrm{m}$ Si CMOS process. Noise characteristics and s parameters were extracted for the 300$\mu\textrm{m}$ gate width and 0.25$\mu\textrm{m}$ gate length NMOS transistors. For high available power gain, each stage was designed cascode type. It revealed available power gain of 23.5dB, noise figure of 2.0dB, power consumption of 15㎽ at 2.5V. It was shown that designed low noise amplifier had good RF performance. Designed Si CMOS LNA is expected to be used for RF front-end in transceiver.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.189-192
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• 2000

In this paper, we propose the novel test method to detect short and open faults in CMOS Op-amp. The proposed method is composed of two test steps - the offset and the high frequency test. Using HSPICE simulation, we get a 100％ fault coverage. To verify the proposed method, we design and fabricate the CMOS op-amp that contains various short and open faults through Hyundai 0.65$\mu\textrm{m}$ 2-poly 2-metal CMOS process. Experimental results of fabricated chip demonstrate that the proposed test method can detect short and open faults in CMOS Op-amp.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.10
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• pp.65-73
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• 2002

Two CMOS composite transistors with an improved operating region by reducing the threshold voltage are proposed in this paper. And also, as an application of the proposed composite transistors, the transconductor is designed. The proposed composite transistor I and II employ a P-type folded composite transistor and a composite diode in order to decrease the threshold voltage, respectively. The limitation of the operating region of these transistors by current source is described. All circuits are simulated by HSPICE using 0.25${\mu}{\textrm}{m}$ n-well process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.4
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• pp.388-396
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• 2012

In this paper, a $320{\times}240$ pixel, 80 frame/s CMOS image sensor with a low power dual correlated double sampling (CDS) scheme is presented. A novel 8-bit hold-and-go counter in each column is proposed to obtain 10-bit resolution. Furthermore, dual CDS and a configurable counter scheme are also discussed to realize efficient power reduction. With these techniques, the digital counter consumes at least 43% and at most 61% less power compared with the column-counters type, and the frame rate is approximately 40% faster than the double memory type due to a partial pipeline structure without additional memories. The prototype sensor was fabricated in a Samsung $0.13{\mu}m$ 1P4M CMOS process and used a 4T APS with a pixel pitch of $2.25{\mu}m$. The measured column fixed pattern noise (FPN) is 0.10 LSB.

• Journal of Sensor Science and Technology
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• v.14 no.1
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• pp.28-32
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• 2005

In this paper, a CMOS integrated detection circuit for capacitive type fingerprint sensor signal processing is described. We designed a detection circuit of charge-sharing sensing scheme. The proposed detection circuit increases the voltage difference between a ridge and valley. The test chip is composed of $160{\times}192$ array sensing cells (12 by $12.7{\;}mm^{2}$). The chip was fabricated on a 0.35 m standard CMOS process. Measured difference voltage between a ridge and valley was 0.95 V.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1077-1080
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• 1998

In this paper, a simple low-power current-mode CMOS wotage reference circuit is proposed. The reference circuit of enhancement-mode MOS transistors and resistors. Temperature compensation is made by adding a current component proportional to a thermal voltage to a current component proportional to a threshold voltage. The designed circuit has been simulated using a $0.65\mu\textrm{m}$ n-well CMOS process parameters. The simulation results show that the reference circuit has a temperature coefficient less than $7.8ppm/^{\circ}C$ and a power-supply(VDD) coefficient less than 0.079%/V for a temperature range from $-30^{\circ}C$ to $130^{\circ}C$ and a VDD range from 4.0V to 12V. The power consumption is 105㎼ for VDD=5V and $T=30^{\circ}C.$ The proposed reference circuit can be designed to generate a wide range of reference voltages owing to its current-mode operation.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.34C no.4
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• pp.1-15
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• 1997

This paper proposes CMOS on-chip voltage and current reference circuits that operate at supply voltages between 2.5V and 5.5V without using a vonventional bandgap voltage structure. The proposed reference circuits based on enhancement-type MOS transistors show low cost, compatibility with other on-chip MOS circuits, low-power consumption, and small-chip size. The prototype was implemented in a 0.6 um n-well single-poly double-metal CMOS process and occupies an active die area of $710 um \times 190 um$. The proposed voltage reference realizes a mean value of 0.97 V with a standard deviation of $\pm0.39 mV$, and a temperature coefficient of $8.2 ppm/^{\circ}C$ over an extended temeprature range from TEX>$-25^{\circ}C$ to $75^{\circ}C$. A measured PSRR (power supply rejection ratio) is about -67 dB at 50kHz.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.11
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• pp.37-42
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• 2010

A novel hysteresis tunable monolithic comparator circuit based on a $0.35{\mu}m$ CMOS process is suggested, designed, fabricated, measured and analyzed in this paper. To tune the threshold voltage of the hysteresis in the comparator circuit, two external digital bits are used with supply voltage of 3.3V.