• Title/Summary/Keyword: CMOS Process

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Design of Low Noise Amplifier Utilizing Input and Inter Stage Matching Circuits (다양한 매칭 회로들을 활용한 저잡음 증폭기 설계 연구)

  • Jo, Sung-Hun
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.25 no.6
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    • pp.853-856
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    • 2021
  • In this paper, a low noise amplifier having high gain and low noise by using input and inter stage matching circuits has been designed. A current-reused two-stage common-source topology is adopted, which can obtain high gain and low power consumption. Deterioration of noise characteristics according to the source inductive degeneration matching is compensated by adopting additional matching circuits. Moreover trade-offs among noise, gain, linearity, impedance matching, and power dissipation have been considered. In this design, 0.18-mm CMOS process is employed for the simulation. The simulated results show that the designed low noise amplifier can provide high power gain and low noise characteristics.

A novel approach for designing of variability aware low-power logic gates

  • Sharma, Vijay Kumar
    • ETRI Journal
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    • v.44 no.3
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    • pp.491-503
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    • 2022
  • Metal-oxide-semiconductor field-effect transistors (MOSFETs) are continuously scaling down in the nanoscale region to improve the functionality of integrated circuits. The scaling down of MOSFET devices causes short-channel effects in the nanoscale region. In nanoscale region, leakage current components are increasing, resulting in substantial power dissipation. Very large-scale integration designers are constantly exploring different effective methods of mitigating the power dissipation. In this study, a transistor-level input-controlled stacking (ICS) approach is proposed for minimizing significant power dissipation. A low-power ICS approach is extensively discussed to verify its importance in low-power applications. Circuit reliability is monitored for process and voltage and temperature variations. The ICS approach is designed and simulated using Cadence's tools and compared with existing low-power and high-speed techniques at a 22-nm technology node. The ICS approach decreases power dissipation by 84.95% at a cost of 5.89 times increase in propagation delay, and improves energy dissipation reliability by 82.54% compared with conventional circuit for a ring oscillator comprising 5-inverters.

Photocurrent Characteristics of Gate/Body-Tied MOSFET-Type Photodetector with High Sensitivity

  • Jang, Juneyoung;Choi, Pyung;Lyu, Hong-Kun;Shin, Jang-Kyoo
    • Journal of Sensor Science and Technology
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    • v.31 no.1
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    • pp.1-5
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    • 2022
  • In this paper, the photocurrent characteristics of gate/body-tied (GBT) metal-oxide semiconductor field-effect transistor (MOSFET)-type photodetector with high sensitivity in the 408 nm - 941 nm range are presented. High sensitivity is important for photodetectors, which are used in several scientific and industrial applications. Owing to its inherent amplifying characteristics, the GBT MOSFET-type photodetector exhibits high sensitivity. The presented GBT MOSFET-type photodetector was designed and fabricated via a standard 0.18 ㎛ complementary metal-oxide-semiconductor (CMOS) process, and its characteristics were analyzed. The photodetector was analyzed with respect to its width to length (W/L) ratio, bias voltage, and incident-light wavelength. It was confirmed experimentally that the presented GBT MOSFET-type photodetector has over 100 times higher sensitivity than a PN-junction photodiode with the same area in the 408 nm - 941 nm range.

Effects of Transfer Gate on the Photocurrent Characteristics of Gate/Body-Tied MOSFET-Type Photodetector

  • Jang, Juneyoung;Seo, Sang-Ho;Kong, Jaesung;Shin, Jang-Kyoo
    • Journal of Sensor Science and Technology
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    • v.31 no.1
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    • pp.12-15
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    • 2022
  • In this study, we studied the effects of transfer gate on the photocurrent characteristics of gate/body-tied (GBT) metal-oxide semiconductor field-effect transistor (MOSFET)-type photodetector. The GBT MOSFET-type photodetector has high sensitivity owing to the amplifying characteristic of the photocurrent generated by light. The transfer gate controls the flow of photocurrent by controlling the barrier to holes, thereby varying the sensitivity of the photodetector. The presented GBT MOSFET-type photodetector using a built-in transfer gate was designed and fabricated via a 0.18-㎛ standard complementary metal-oxide-semiconductor (CMOS) process. Using a laser diode, the photocurrent was measured according to the wavelength of the incident light by adjusting the voltage of the transfer gate. Variable sensitivity of the presented GBT MOSFET-type photodetector was experimentally confirmed by adjusting the transfer gate voltage in the range of 405 nm to 980 nm.

Formation of Nickel Silicide from Atomic Layer Deposited Ni film with Ti Capping layer

  • Yun, Sang-Won;Lee, U-Yeong;Yang, Chung-Mo;Na, Gyeong-Il;Jo, Hyeon-Ik;Ha, Jong-Bong;Seo, Hwa-Il;Lee, Jeong-Hui
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2007.06a
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    • pp.193-198
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    • 2007
  • The NiSi is very promising candidate for the metallization in 60nm CMOS process such as FUSI(fully silicided) gate and source/drain contact because it exhibits non-size dependent resistance, low silicon consumption and mid-gap workfunction. Ni film was first deposited by using ALD (atomic layer deposition) technique with Bis-Ni precursor and $H_2$ reactant gas at $220^{\circ}C$ with deposition rate of $1.25{\AA}/cycle$. The as-deposited Ni film exhibited a sheet resistance of $5{\Omega}/{\square}$. RTP (repaid thermal process) was then performed by varying temperature from $400^{\circ}C$ to $900^{\circ}C$ in $N_2$ ambient for the formation of NiSi. The process window temperature for the formation of low-resistance NiSi was estimated from $600^{\circ}C$ to $800^{\circ}C$ and from $700^{\circ}C$ to $800^{\circ}C$ with and without Ti capping layer. The respective sheet resistance of the films was changed to $2.5{\Omega}/{\square}$ and $3{\Omega}/{\square}$ after silicidation. This is because Ti capping layer increases reaction between Ni and Si and suppresses the oxidation and impurity incorporation into Ni film during silicidation process. The NiSi films were treated by additional thermal stress in a resistively heated furnace for test of thermal stability, showing that the film heat-treated at $800^{\circ}C$ was more stable than that at $700^{\circ}C$ due to better crystallinity.

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Design of Hardwired Variable Length Decoder for H.264/AVC (하드웨어 구조의 H.264/AVC 가변길이 복호기 설계)

  • Yu, Yong-Hoon;Lee, Chan-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.11
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    • pp.71-76
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    • 2008
  • H.264(or MPEG-4/AVC pt.10) is a high performance video coding standard, and is widely used. Variable length code (VLC) of the H.264 standard compresses data using the statistical distribution of values. A decoder parses the compressed bit stream and searches decoded values in lookup tables, and the decoding process is not easy to implement by hardware. We propose an architecture of variable length decoder(VLD) for the H.264 baseline profile(BP) L4. The CAVLD decodes syntax elements using the combination of arithmetic units and lookup tables for the optimized hardware architecture. A barral shifter and a first 1's detector parse NAL bit stream, and are shared by Exp-Golomb decoder and CAVLD. A FIFO memory between CAVLD and the reorder unit and a buffer at the output of the reorder unit eliminate the bottleneck of data stream. The proposed VLD is designed using Verilog-HDL and is implemented using an FPGA. The synthesis result using a 0.18um standard CMOS technology shows that the gate count is 22,604 and the decoder can process HD($1920{\times}1080$) video at 120MHz.

Design of Low-Area and Low-Power 1-kbit EEPROM (저면적.저전력 1Kb EEPROM 설계)

  • Yu, Yi-Ning;Yang, Hui-Ling;Jin, Li-Yan;Jang, Ji-Hye;Ha, Pan-Bong;Kim, Young-Hee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.15 no.4
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    • pp.913-920
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    • 2011
  • In this paper, a logic process based 1-kbit EEPROM IP for RFID tag chips of 900MHz is designed. The cell array of the designed 1-kbit EEPROM IP is arranged in a form of four blocks of 16 rows x 16 columns, that is in a two-dimensional arrangement of one-word EEPROM phantom cells. We can reduce the IP size by making four memory blocks share CG (control gate) and TG (tunnel gate) driver circuits. We propose a TG switch circuit to supply respective TG bias voltages according to operational modes and to keep voltages between devices within 5.5V in terms of reliability in order to share the TG driver circuit. Also, we can reduce the power consumption in the read mode by using a partial activation method to activate just one of four memory blocks. Furthermore, we can reduce the access time by making BL (bit line) switching times faster in the read mode from reduced number of cells connected to each column. We design and compare two 1-kbit EEPROM IPs, two blocks of 32 rows ${\times}$ 16 columns and four blocks of 16 rows ${\times}$ 16 columns, which use Tower's $0.18{\mu}m$ CMOS process. The four-block IP is smaller by 11.9% in the layout size and by 51% in the power consumption in the read mode than the two-block counterpart.

Implementation of Analog Signal Processing ASIC for Vibratory Angular Velocity Detection Sensor (진동형 각속도 검출 센서를 위한 애널로그 신호처리 ASIC의 구현)

  • 김청월;이병렬;이상우;최준혁
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.4
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    • pp.65-73
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    • 2003
  • This paper presents the implementation of an analog signal-processing ASIS to detect an angular velocity signal from a vibrator angular velocity detection sensor. The output of the sensor to be charge appeared as the variation of the capacitance value in the structure of the sensor was detected using charge amplifiers and a self oscillation circuit for driving the sensor was implemented with a sinusoidal self oscillation circuit using the resonance characteristics of the sensor. Specially an automatic gain control circuit was utilized to prevent the deterioration of self-oscillation characteristics due to the external elements such as the characteristic variation of the sensor process and the temperature variation. The angular velocity signal, amplitude-mod)Hated in the operation characteristics of the sensor, was demodulated using a synchronous detection circuit. A switching multiplication circuit was used in the synchronous detection circuit to prevent the magnitude variation of detected signal caused by the amplitude variation of the carrier signal. The ASIC was designed and implemented using 0.5${\mu}{\textrm}{m}$ CMOS process. The chip size was 1.2mm x 1mm. In the experiment under the supply voltage of 3V, the ASIC consumed the supply current of 3.6mA and noise spectrum density from dc to 50Hz was in the range of -95 dBrms/√Hz and -100 dBrms/√Hz when the ASIC, coupled with the sensor, was in normal operation.

A VLSI Design of High Performance H.264 CAVLC Decoder Using Pipeline Stage Optimization (파이프라인 최적화를 통한 고성능 H.264 CAVLC 복호기의 VLSI 설계)

  • Lee, Byung-Yup;Ryoo, Kwang-Ki
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.12
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    • pp.50-57
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    • 2009
  • This paper proposes a VLSI architecture of CAVLC hardware decoder which is a tool eliminating statistical redundancy in H.264/AVC video compression. The previous CAVLC hardware decoder used four stages to decode five code symbols. The previous CAVLC hardware architectures decreased decoding performance because there was an unnecessary idle cycle in between state transitions. Likewise, the computation of valid bit length includes an unnecessary idle cycle. This paper proposes hardware architecture to eliminate the idle cycle efficiently. Two methods are applied to the architecture. One is a method which eliminates an unnecessary things of buffers storing decoded codes and then makes efficient pipeline architecture. The other one is a shifter control to simplify operations and controls in the process of calculating valid bit length. The experimental result shows that the proposed architecture needs only 89 cycle in average for one macroblock decoding. This architecture improves the performance by about 29% than previous designs. The synthesis result shows that the design achieves the maximum operating frequency at 140Mhz and the hardware cost is about 11.5K under a 0.18um CMOS process. Comparing with the previous design, it can achieve low-power operation because this design is implemented with high throughputs and low gate count.

A Low-Voltage Low-Power Analog Front-End IC for Neural Recording Implant Devices (체내 이식 신경 신호 기록 장치를 위한 저전압 저전력 아날로그 Front-End 집적회로)

  • Cha, Hyouk-Kyu
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.10
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    • pp.34-39
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    • 2016
  • A low-voltage, low-power analog front-end IC for neural recording implant devices is presented. The proposed IC consists of a low-noise neural amplifier and a programmable active bandpass filter to process neural signals residing in the band of 1 Hz to 5 kHz. The neural amplifier is based on a source-degenerated folded-cascode operational transconductance amplifier (OTA) for good noise performance while the following bandpass filter utilizes a low-power current-mirror based OTA with programmable high-pass cutoff frequencies from 1 Hz to 300 Hz and low-pass cutoff frequencies from 300 Hz to 8 kHz. The total recording analog front-end provides 53.1 dB of voltage gain, $4.68{\mu}Vrms$ of integrated input referred noise within 1 Hz to 10 kHz, and noise efficiency factor of 3.67. The IC is designed using $18-{\mu}m$ CMOS process and consumes a total of $3.2{\mu}W$ at 1-V supply voltage. The layout area of the IC is $0.19 mm^2$.