In order to improve the quality of the sheared surface in cutting of inner structure bonded sheet metal the cut-off operation is mainly investigated, which is the typical shearing process in sheet metal forming technology. The sandwich sheet metals considered have inner structure which is constructed in the form of crimped expanded metal and woven metal. The inner structure is bonded between solid sheet by resistance welding or adhesive bonding. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results we found that the influence of sheared position can be observed and explained clearly and this result can be utilized to get the better sheared surface.

Most of member parts have experienced severe springback problems because of their open shape Now it becomes imperative to develop an effective method, which can resolve these problems. However, there remain several obstacles to get accurate estimation of shape error. In analysis, we have to analyze the total process including forming, trimming and flanging. Furthermore, it is another challenge to compare the computed result with the real shape. In this study we developed an analysis program for the springback analysis. We could achive a big enhancement in computation time in springback analysis by using latest equation solving technique and could get a more robust solution conversence by contination method. We have approached this problem in two steps. In the first step, we analyzed forming stage to solve tearing and wrinkling problems. In the second step, we have analyzed full process and have done springback analysis with the same boundary condition as field measuring conditions. We have investigated the accuracy of springback analysis in terms of gap and flush used for insfection of real autobody panels. We found good and effective agreement with the observed results.

3D CAE becomes a key technology to complete a digital engineering system. '3D TIMON', developed by TORAY Industries, Inc., is the useful software to analyze whole injection molding process with solid elements and is capable of generating solid mesh models directly from 3D CAD data. In this paper, we introduce '3D TIMON' and the application examples in the each industries.

광의 효율적 사용을 위해 표면에 마이크로 그루브가 새겨진 고성능 광학 부품의 개발이 활발하고, 이들 부품의 다량 생산을 위한 초정밀 금형제조기술이 각광을 받고 있다. 최근의 초정밀 미세 기계가공의 경우 간단한 공정으로 이러한 마이크로 그루브 금형을 제작할 수 있다. 특히 조명각 변조용 렌티큘러 렌즈와 같이 실린더형 그루브 금형의 경우에는 기존의 Lithography, MEMS, LIGA 등 광 에너지를 이용한 다른 제조방법들에서는 가공하기 어려운 점이 있으나, 기계가공에서는 쉽게 제작가능한 장점이 있다. 본 연구에서는 이러한 미세기계가공기술의 장점을 활용하여 U 형 마이크로 그루브를 가진 Lenticular 렌즈용 금형을 가공하고자 하였다. 가공에는 3 축 구동의 초정밀 미세 복합가공기와 단결정 천연 다이아몬드공구가 사용되었고, 가공방식은 마이크로 세이핑 공정을 적용하였으며, 가공 금형 재료에는 Brass와 무전해 Nickel이 사용되었다. 실험을 통하여 금형가공시의 절삭력, 칩 형상, 가공표면 등의 분석이 수행되었으며 이를 기반으로 여러 가지 가공문제점을 해결하고, 최종적으로 양호한 렌티큘러렌즈용 금형을 가공하였다.

3-D micro structures and micro tools are fabricated using MEDM (Micro Electric Discharge Machining). To make micro structures, micro electro discharge milling process is applied. During micro electro discharge milling, electrode (tool) wears both axial and radial direction. To compensate tool wear which influences significantly machining accuracy, overlap machining path is proposed. Machining characteristics of micro electro discharge milling is investigated in considering of depth of cut and capacitance of discharge circuit. Micro complex shaped tools are fabricated using REDM (reverse electro discharge machining). Sacrificial electrode is machined through electro discharge milling process and is used as electrode to make micro tools. Using this process several micro tools shape of 'ㄷ', 'ㅁ' and 'o' are fabricated. With these complex shaped tools, micro machining is successfully applied repeatedly.

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.