한국소성가공학회:학술대회논문집 (Proceedings of the Korean Society for Technology of Plasticity Conference)
- 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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- Pages.260-265
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- 2004
LTCC 기판의 미세 비아홀 펀칭 중 공정 변수의 영향 평가
Evaluation of punching process variables influencing micro via-hole quality of LTCC green sheet
- 백승욱 (서울대학교 기계항공공학부) ;
- 임성한 (서울대학교 기계항공공학부) ;
- 오수익 (서울대학교 기계항공공학부) ;
- 윤성만 ((주)아이엠텍) ;
- 이상목 (한국생산기술연구원) ;
- 김승수 (한국생산기술연구원)
- Baek S. W. ;
- Rhim S. H. ;
- Oh S. I. ;
- Yoon S. M. ;
- Lee S. ;
- Kim S. S.
- 발행 : 2004.11.01
초록
LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.
키워드